• 한국표면공학회지
• /
• 제27권1호
• /
• pp.29-35
• /
• 1994

The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

• Bulletin of the Korean Chemical Society
• /
• 제29권1호
• /
• pp.122-126
• /
• 2008

The magnetic properties of the organic/inorganic hybrid copper-methylenediphosphonate, Cu2(O3PCH2PO3) were examined by performing the spin dimer analysis based on the extended Hckel tight binding method. In Cu2(O3PCH2PO3) the CuO3 chains made up of edge-sharing CuO5 square pyramidal units are inter-linked by O-P-O bridges. The Cu-O-Cu superexchange interactions of the CuO3 chains are negligibly weak compared with the Cu-O…O-Cu super-superexchange interactions that occur between the CuO3 chains. The spin exchange interactions of Cu2(O3PCH2PO3) are dominated by three super-superexchange interactions, which leads to a three-dimensional antiferromagnetic spin lattice. The strongest spin exchange interactions form isolated spin dimers, which suggests that, to a first approximation, the magnetic properties can be described in terms of an isolated spin dimer model.

• 대한치과교정학회지
• /
• 제48권3호
• /
• pp.153-162
• /
• 2018

Objective: The aim of this trial was to compare the alignment efficiency and intermaxillary arch dimension changes of nickel-titanium (NiTi) or copper-nickel-titanium (CuNiTi) round archwires with increasing diameters applied sequentially to the mandibular arch. Methods: The initial alignment phase of fixed orthodontic treatment with NiTi or CuNiTi round archwires was studied in a randomly allocated sample of 66 patients. The NiTi group comprised 26 women, 10 men, and the CuNiTi ($27^{\circ}C$) group comprised 20 women, 10 men. The eligibility criteria were as follows: anterior mandibular crowding of minimum 6 mm according to Little's Irregularity Index (LII), treatment requiring no extraction of premolars, 12 to 18 years of age, permanent dentition, skeletal and dental Class I malocclusion. The main outcome measure was the alignment of the mandibular anterior dentition; the secondary outcome measure was the change in mandibular dental arch dimensions during 12 weeks. Simple randomization (allocation ratio 1:1) was used in this single-blind study. LII and mandibular arch dimensions were measured on three-dimensional digital dental models at 2-week intervals. Results: No statistically significant difference was observed between NiTi and CuNiTi according to LII (p > 0.05). Intercanine and intermolar arch perimeters increased in the CuNiTi group (p < 0.001). Inter-first premolar width showed a statistically significant interaction in week ${\times}$ diameter ${\times}$ application (p < 0.05). Conclusions: The effects of NiTi and CuNiTi round archwires were similar in terms of their alignment efficiency. However, the intercanine and intermolar arch perimeters, and the inter-first premolar width changes differed between groups.

• 한국재료학회지
• /
• 제20권6호
• /
• pp.338-343
• /
• 2010

As an alternative to the W plug used in MOSFETs, a Cu plug with a NiSi contact using Ta / TaN as a diffusion barrier is currently being considered. Conventionally, Ni was first deposited and then NiSi was formed, followed by the barrier and Cu deposition. In this study, Ti was employed as a barrier material and simultaneous formation of the NiSi contact and Cu plug / Ti barrier was attempted. Cu(100 nm) / Ti / Ni(20 nm) with varying Ti thicknesses were deposited on a Si substrate and annealed at $4000^{\circ}C$ for 30 min. For comparison, Cu/Ti/NiSi thin films were also formed by the conventional method. Optical Microscopy (OM), Scanning Probe Microscopy (SPM), X-Ray Diffractometry (XRD), and Auger Electron Microscopy (AES) analysis were performed to characterize the inter-diffusion properties. For a Ti interlayer thicker than 50 nm, the NiSi formation was incomplete, although Cu diffusion was inhibited by the Ti barrier. For a Ti thickness of 20 nm and less, an almost stoichiometric NiSi contact along with the Cu plug and Ti barrier layers was formed. The results were comparable to that formed by the conventional method and showed that this alternative process has potential as a formation process for the Cu plug/Ti barrier/NiSi contact system.

• 한국통신학회논문지
• /
• 제37권1A호
• /
• pp.51-56
• /
• 2012

HEVC는 성능 향상과 더불어 복잡도 또한 크게 증가했다. 본 논문은 깊이 영상의 복잡도를 줄이기 위해 깊이 영상의 특성을 이용한 조기 SKIP과 인터 예측의 고속 모드 결정 알고리즘을 제안한다. 이 알고리즘은 동차 영역에서 SKIP 모드가 자주 발생한다는 점을 이용해 설계됐다. 동차 영역의 SKIP에서 발생한 비용값이 양자화 매개변수에 적응적인 문턱값과, 평균 SKIP의 비용값의 곱보다 작다면 조기 SKIP 모드를 발생시킨다. 그렇지 않은 경우 인터 $2N{\times}2N$의 비용값을 구한 뒤 인터 $2N{\times}2N$의 움직임 벡터가 0이고 부호화 단위의 분산이 인터 예측을 위한 문턱값보다 작다면 인터 $2N{\times}N$과 인터 $N{\times}2N$의 탐색을 수행하지 않는다. 조기 SKIP과 인터 예측을 위한 문턱값은 실험을 통해 결정이 됐고, 실험 결과는 기존의 HEVC와 비교하였을 때 BDBR이 0.24%, BDPSNR이 -0.011 dB로 비트율과 화질의 큰 변화 없이 부호화 시간은 최소 39%에서 최대 82%까지 줄였다.

• Journal of Advanced Marine Engineering and Technology
• /
• 제27권3호
• /
• pp.429-436
• /
• 2003

The electrical discharge machining(EDM) with Si electrode instead of Gr or Cu electrode. made enormous effects on the surface. machining time, anti-caustic workpiece surface and so on In this paper. we experimented on the inter-role distance during discharge the electrical phenomenon of inter-pole, the distribution of discharge point. the distribution of off load time. etc., using Si electrode Cu electrode and Gr electrode under the same machining condition. As a result of a large quantity generated exclusive powders. the performance of the EDM using Si electrode. compared with EDM using others. is improved. We show that the quantities of those make far pole-gap discharge and discharge scatter under stable machining status possible.

• Journal of Radiation Protection and Research
• /
• 제42권1호
• /
• pp.63-68
• /
• 2017

Background: The combined effect of the low energy electron (LEE) irradiation and $Cu^{2+}$ ion on DNA damage was investigated. Materials and Methods: Lyophilized pBR322 plasmid DNA films with various concentrations (1-15 mM) of $Cu^{2+}$ ion were independently irradiated by monochromatic LEEs with 5 eV. The types of DNA damage, single strand break (SSB) and double strand break (DSB), were separated and quantified by gel electrophoresis. Results and Discussion: Without electron irradiation, DNA damage was slightly increased with increasing Cu ion concentration via Fenton reaction. LEE-induced DNA damage, with no Cu ion, was only 6.6% via dissociative electron attachment (DEA) process. However, DNA damage was significantly increased through the combined effect of LEE-irradiation and Cu ion, except around 9 mM Cu ion. The possible pathways of DNA damage for each of these different cases were suggested. Conclusion: The combined effect of LEE-irradiation and Cu ion is likely to cause increasing dissociation after elevated transient negative ion state, resulting in the enhanced DNA damage. For the decrease of DNA damage at around 9-mM Cu ion, it is assumed to be related to the structural stabilization due to DNA inter- and intra-crosslinks via Cu ion.

• 한국분말재료학회지
• /
• 제18권1호
• /
• pp.24-28
• /
• 2011

Effect of Cu content on microstructural and magnetic properties of a $(Nd_{26.06},Dy_{6.51})Fe_{bal.}$ $Cu_xB_{0.97}$(wt.%), (x = 0.2, 0.3, 0.4, 0.5) strip-cast was studied. The average inter-lamellar spacing in the free surface and wheel side of the strip cast increased as the Cu content increases. The grain uniformity, the grain alignment, and (00L) texture of the strip cast increased with Cu contents up to 0.4 wt.%. These microstructural changes were attributed to the decrease of the effective cooling rate of the melted alloy caused by the decrease of the melting temperature of resulting from Cu addition. Coercivity and remanence were increased because of the grain alignment and (00L) texture improvement with Cu contents up to 0.4 wt.%.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 2003년도 High Temperature Superconductivity Vol.XIII
• /
• pp.90-90
• /
• 2003

• 마이크로전자및패키징학회지
• /
• 제12권4호통권37호
• /
• pp.345-349
• /
• 2005

300 mW-cm의 낮은 비저항을 갖는 카본-질소$\_$텅스텐 (W-C-N) 확산방지막을 원자층 증착법으로 제조하였으며, 반응기체로 $WF_6-N_2-CH_4$를 사용하였다. $N_2$ 및 $CH_4$ 반응기체를 주입 할 때는 고주파 펄스를 인가하여 플라즈마에 의한 반응물의 분리가 일어나도록 하였다. 다층금속배선에 사용하는 층간 절연층 (TEOS) 위에서 W-C-N 박막은 원자층 증착기구를 따르며, 10에서 100 사이클 동안 증착율이 0.2nm/cycles 로 일정한 값을 가진다. 또한 Cu 배선을 위한 확산방지막으로써 W-C-N 박막은 비정질 상을 가지며, $800^{\circ}C$에서 30분간 열처리해도 Cu의 확산을 충분히 방지할 수 있음을 확인하였다.