• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.12
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• pp.1582-1585
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• 1988

A cavity perturbation technique is employed to determine the dielectric property of thin samples. Substrates in microwave integrated circuits are fabricated in sheet form and are expected to have a dielectric constant less than 10 and a dielectric loss better than 10**-3. This research aimed to determine both dielectric constant and dielectric loss with good accuracy. The tecynique makes use of thin circular disk samples placed in a right circular cylindrical cavity. The accuracy of measurements is within \ulcorner% for dielectric constnat and 3x10**-4 for dielectric loss.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.6
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• pp.255-262
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• 2004

In this paper, a number of double-layered microwave integrated circuits (MIC) have been designed and analyzed based on a developed finite-difference time-domain (FDTD) solver. The solver was first validated through comparisons of the computed results with those previously published throughout the literature. Subsequently, various double-layered MIC printed on both isotropic and anisotropic substrates and superstrates, which are frequently encountered in printed circuit boards (PCB), have been designed and analyzed. It was found that in addition to protecting circuits, the added superstrate layer can increase freedoms of design and improve circuit performance, and that the FDTD is indeed a robust and versatile tool for multilayer circuit design.

• Journal of Electrical Engineering and Technology
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• v.7 no.6
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• pp.954-958
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• 2012

This paper reports a flexible patch rectenna for wireless actuation of cellulose electro-active paper actuator (EAPap). The patch rectenna consists of rectifying circuit layer and ground layer, which converts microwave to dc power so as to wirelessly supply the power to the actuator. Patch rectennas are designed with different slot length at the ground layer. The fabricated devices are characterized depending on different substrates and polarization angles. The EAPap integrated with the patch rectenna is actuated by the microwave power. Detailed fabrication, characterization and demonstration of the integrated rectenna-EAPap actuator are explained.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.292.2-292.2
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• 2013

Graphene, a two-dimensional graphite material consisting of sp2-hybridized carbons. The properties of graphene such as extremely high carrier mobility, high thermal conductivity, low resistivity, large specific make it a promising materail of divices and material. Typically, poly (methyl methacrylate) (PMMA) is used when graphene transfer to other substrates. To remove PMMA on graphene, people used to dip the graphene into the acetone. However, it is known that the remove of PMMA on the graphene is difficult to completely using the acetone. Therefore, to remove the PMMA on the graphene surface, many research groups have employed various methods such as the thermal treatment, photothermal method, and other solvent. Nevertheless, a part of PMMA still remain on graphene surface. Usually, to observe the residual PMMA on graphene surface, topography of graphene surface scanned by atomic force microscopy is used. However, in that case, we can not distinguish PMMA and other particles. In this study, to confirm the residual PMMA on graphene surface, we employed novel measurement technique which is available to distinguish PMMA and other particles by means of photothermal effect.

• Journal of electromagnetic engineering and science
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• v.8 no.3
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• pp.129-133
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• 2008

An integrated passive device(IPD) technology by semi-insulating(SI)-GaAs-based fabrication has been developed to meet the ever increasing needs of size and cost reduction in wireless applications. This technology includes reliable NiCr thin film resistor, thick plated Cu/Au metal process to reduce resistive loss, high breakdown voltage metal-insulator-metal(MIM) capacitor due to a thinner dielectric thickness, lowest parasitic effect by multi air-bridged metal layers, air-bridges for inductor underpass and capacitor pick-up, and low chip cost by only 6 process layers. This paper presents the Wilkinson power divider with excellent performance for digital cellular system(DCS). The insertion loss of this power divider is - 0.43 dB and the port isolation greater than - 22 dB over the entire band. Return loss in input and output ports are - 23.4 dB and - 25.4 dB, respectively. The Wilkinson power divider based on SI-GaAs substrates is designed within die size of $1.42\;mm^2$.

• Advances in nano research
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• v.2 no.4
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• pp.211-217
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• 2014

The self-assembled strain-induced sub-micrometric islands and nanostructures are grown from In-As-Sb-P quaternary liquid phase on InAs (100) substrates in Stranski-Krastanow growth mode. Two samples are under consideration. The first sample consists of unencapsulated islands and lens-shape quantum dots (QDs) grown from expressly inhomogeneous liquid phase. The second sample is an n-InAs/p-InAsSbP heterostructure with QDs embedded in the p-n junction interface. The morphology, size and shape of the structures are investigated by high-resolution scanning electron (SEM) and transmission electron (TEM) microscopy. It is shown that islands, as they decrease in size, undergo shape transitions. Particularly, as the volume decreases, the following succession of shape transitions are detected: sub-micrometric truncated pyramid, {111} facetted pyramid, {111} and partially {105} facetted pyramid, completely unfacetted "pre-pyramid", hemisphere, lens-shaped QD, which then evolves again to nano-pyramid. A critical size of $5{\pm}2nm$ for the shape transformation of InAsSbP-based lens-shaped QD to nano-pyramid is experimentally measured and theoretically evaluated.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.37 no.3
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• pp.43-48
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• 2000

In this paper, vortical integrated transformers using bondwires are proposed and characterized for MMIC's (Monolithic Microwave Integrated Circuits) In a wide range of frequencies (1∼20 GHz), where full-wave analysis by the FEM (Finite Element Method) was adopted. The electrical characteristics of the proposed transformers are compared with those of the spiral transformer. We extracted mutual inductances from S -parameters. The vertical transformers using bondwires have not only low insertion loss but also reduce parasitic capacitances and dielectric loss due to their separation from substrates. It can be fabricated easily by used of the modern automatic wirebonding technology. It is expected that the proposed transformers are to improve the performance of MMIC's applied to impedance matching, and phase shifting circuits.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.965-970
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• 2018

In this paper, the transition of the folded substrate integrated waveguide (FSIW) using two substrates is suggested and applied to the bandpass filter. The FSIW has similar characteristics with the SIW and can be reduced the width of the SIW. The transition between the FSIW to the microstrip is designed by using shorted quarter wavelength line. Also, the bandpass filter is designed by using the FSIW and the elliptic lowpass filter of 5 section. Fabricated bandpass filter has the center frequency of 5.75 GHz and the bandwidth of 33.2%. Also, the insertion loss and return loss at the center frequency are 0.63dB and 19.1dB, respectively.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.433-434
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• 2002

Chemical mechanical polishing refers to a process by which silicon and partially-processed integrated circuits (IC's) built on silicon substrates are polished to produce planar surfaces for the continued manufacturing of IC's. Chemical mechanical polishing is done by pressing the silicon wafer, face down, onto a rotating platen that is covered by a rough polyurethane pad. During rotation, the pad is flooded with a slurry that contains nanoscale particles. The pad deforms and the roughness of the surface entrains the slurry into the interface. The asperities contact the wafer and the surface is polished in a three-body abrasion process. The contact of the wafer with the 'soft' pad produces a unique elastohydrodynamic situation in which a suction force is imposed at the interface. This added force is non-uniform and can be on the order of the applied pressure on the wafer. We have measured the magnitude and spatial distribution of this suction force. This force will be described within the context of a model of the sliding of hard surfaces on soft substrates.

• Particle and aerosol research
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• v.6 no.3
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• pp.131-138
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• 2010

Flexible electronics are the electronics on flexible substrates such as a plastic, fabric or paper, so that they can be folded or attached on any curved surfaces. They are currently recognized as one of the most innovating future technologies especially in the area of portable electronics. The conventional vacuum deposition and photolithographic patterning methods are well developed for inorganic microelectronics. However, flexible polymer substrates are generally chemically incompatible with resists, etchants and developers and high temperature processes used in conventional integrated circuit processing. Additionally, conventional processes are time consuming, very expensive and not environmentally friendly. Therefore, there are strong needs for new materials and a novel processing scheme to realize flexible electronics. This paper introduces current research trends for flexible electronics based on (a) nanoparticles, and (b) novel processing schemes: nanomaterial based direct patterning methods to remove any conventional vacuum deposition and photolithography processes. Among the several unique nanomaterial characteristics, dramatic melting temperature depression (Tm, 3nm particle~$150^{\circ}C$) and strong light absorption can be exploited to reduce the processing temperature and to enhance the resolution. This opens a possibility of developing a cost effective, low temperature, high resolution and environmentally friendly approach in the high performance flexible electronics fabrication area.