• 제목/요약/키워드: Integrated patterns

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상보적 분할 링 공진기를 이용한 전기적으로 작은 1/8 모드 기판 집적형 도파관 안테나 (Electrically Small Eighth-Mode Substrate-Integrated Waveguide(EMSIW) Antenna Loading Complementary Split Ring Resonator(CSRR))

  • 강현성;;임성준
    • 한국전자파학회논문지
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    • 제24권7호
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    • pp.686-693
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    • 2013
  • 본 논문은 기판 집적형 도파관(SIW: Substrate Integrated Waveguide)와 상보적 분할링 공진기(CSRR: Complementary Split Ring Resonator)를 기반으로 한 전기적으로 작은 안테나를 제안한다. 안테나의 전기적 크기는 CSRR과 기존 SIW의 1/8크기인 Eighth-Mode Substrate Integrated Waveguide(EMSIW)를 적용하여 줄일 수 있었다. EMSIW는 기존의 SIW와 비교하였을 때 공진 주파수는 유지하면서 단지 12.5 %의 크기를 차지한다. 또한, EMSIW 안에 CSRR을 회전함으로써 안테나의 방사 특성을 유지하면서 공진 주파수를 바꿀 수 있었다. CSRR을 $0^{\circ}$부터 $360^{\circ}$까지 회전시켜 공진 주파수를 4.74 GHz에서 5.07 GHz까지 변화를 줄 수 있었다. 단향성 방사 패턴이 발생하며, 그 최대 이득은 4.5 dBi에서 5.92 dBi로 관측되었다.

자기조직화 지도 신경망과 사례기반추론을 이용한 다변량 공정관리 (Integrated Procedure of Self-Organizing Map Neural Network and Case-Based Reasoning for Multivariate Process Control)

  • 강부식
    • 지능정보연구
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    • 제9권1호
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    • pp.53-69
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    • 2003
  • 현대의 생산공정에서는 많은 공정변수가 발생하고 있으며 복잡한 연관관계를 가지고 제품의 품질에 영향을 미치고 있다. 따라서 공정의 이상 유무 확인을 위해서는 많은 품질특성치를 동시에 관리하는 다변량 공정관리가 필요하다. 본 연구는 자기조직화 신경망(SOM)과 사례기반추론(CBR) 기법을 이용한 다변량 공정관리 방안을 제안한다. SOM을 이용하여 공정 데이터의 패턴을 생성하고 이상 유무 판단을 위해 기준패턴과 적합성 검정을 한다. 제안한 방법의 검증을 위해 공정에서 발생 가능한 패턴별로 데이터를 생성하여 실험하였고, 실험을 통해 이상패턴을 효과적으로 구별할 수 있음을 보였다. 또한 CBR 방법론을 적용하여 1종 오류는 줄이면서 2종 오류를 아주 작게 유지할 수 있음을 보임으로써, SOM과 CBR 이 결합된 절차가 다변량 공정관리를 위한 한 대안이 될 수 있음을 보였다.

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잠수복 패턴 자동 설계 및 $CO_2$ 레이저 절단을 위한 통합 시스템 개발 (Integrated Automation System of Pattern Design and $CO_2$ Laser Cutting for Diving Suits)

  • 윤세봉;강병수;강재관;김여숙
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.409-412
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    • 2004
  • In this paper, an integrated automation system of pattern design and $CO_2$ laser cutting for diving suits is presented. Pattern design includes grading which creates a full-size range from a base pattern. Tool path for laser cutting from the patterns is generated in G-code format. $CO_2$ Laser cutting machine is developed to help cut the patterns with accuracy and speed. Aluminum profiles, ball screws, and stepping motors are engaged into the machine as frame structure, transfer unit, and driving devices respectively. The developed system is tested in dry suit cutting, convincing it can be readily introduced in driving suits manufacturing with respect to cost and efficiency.

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Measurement Resolution of Edge Position in Digital Optical Imaging

  • Lee, Sang-Yoon;Kim, Seung-Woo
    • International Journal of Precision Engineering and Manufacturing
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    • 제1권1호
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    • pp.49-55
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    • 2000
  • The semiconductor industry relies on digital optical imaging for the overlay metrology of integrated circuit patterns. One critical performance demand in the particular application of digital imaging is placed on the edge resolution that is defined as the smallest detectable displacement of an edge from its image acquired in digital from. As the critical feature size of integrated circuit patterns reaches below 0.35 micrometers, the edge resolution is required to be less than 0.01 micrometers. This requirement is so stringent that fundamental behaviors of digital optical imaging need to be explored especially for the precision coordinate metrology. Our investigation reveals that the edge resolution shows quasi-random characteristics, not being simply deduced from relevant opto-electronic system parameters. Hence, a stochastic upper bound analysis is made to come up with the worst edge resolution that can statistically well predict actual indeterminate edge resolutions obtained with high magnification microscope objectives.

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Rapid와 conventional Alloying 공정에 의한 GaAs Ohmic Contact의 특성 비교연구와 TLM의 새로운 해석 방법의 제안 (Comparison Studies on GaAS Ohmic Contacts Fabricated by Rapid and Conventional Alloying Process and New Analysis Method of TLM Patterns)

  • Rhee, Jin-Koo
    • 대한전자공학회논문지
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    • 제25권12호
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    • pp.1663-1668
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    • 1988
  • Ohmic contact process for the fabrication of GaAs integrated circuits is very important. Specific contact resistivities, assuming Rsm=Rs, were measured after the rapid and the conventional alloying process, respectively. The results show that the characteristics of ohmic contact through the rapid alloying process is much better (Apc=1.3~3.3x10**-7 \ulcorner-(m\ulcorner. This is probably due to intensive and compound energy densities during the rapid alloying process. New analysis method of TLM patterns viz. measurements of normlaized specific contact resistivities are proposed to reduce measurement errors that could occur when measuring the small contact end resistances. The adoption of rapid alloying process for the mass production of GaAs integrated circuits could greatly reduce the total processig time.

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Protein tyrosine phosphatase profiling studies during brown adipogenic differentiation of mouse primary brown preadipocytes

  • Choi, Hye-Ryung;Kim, Won Kon;Park, Anna;Jung, Hyeyun;Han, Baek Soo;Lee, Sang Chul;Bae, Kwang-Hee
    • BMB Reports
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    • 제46권11호
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    • pp.539-543
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    • 2013
  • There is a correlation between obesity and the amount of brown adipose tissue; however, the molecular mechanism of brown adipogenic differentiation has not been as extensively studied. In this study, we performed a protein tyrosine phosphatase (PTP) profiling analysis during the brown adipogenic differentiation of mouse primary brown preadipocytes. Several PTPs, including PTPRF, PTPRZ, and DUSP12 showing differential expression patterns were identified. In the case of DUSP12, the expression level is dramatically downregulated during brown adipogenesis. The ectopic expression of DUSP12 using a retroviral expression system induces the suppression of adipogenic differentiation, whereas a catalytic inactive DUSP12 mutant showed no effect on differentiation. These results suggest that DUSP12 is involved in brown adipogenic differentiation and may be used as a target protein for the treatment or prevention of obesity by the regulation of brown adipogenic differentiation.

Building-Integrated Photovoltaic 시스템의 연간 발전 에너지 향상을 위한 커버글라스 패턴의 최적설계 (Optimal Design of Coverglass Pattern in Building-Integrated Photovoltaic for Improved Yearly Electrical Energy)

  • 김태현;이승철;박우상
    • 한국전기전자재료학회논문지
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    • 제33권4호
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    • pp.297-302
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    • 2020
  • A coverglass pattern was designed to improve the annual electrical energy production of a building-integrated photovoltaic (BIPV) module installed in the exterior walls of buildings. The transmittance pattern was calculated using ray tracing, and the results were derived by optimizing the simulation using Taguchi's method. We obtained the optimal pattern by analyzing the conventional patterns for improving the transmittance and derived design factors by quantifying the pattern. By calculating the influence of electrical energy on each design factor, we obtained the optimal coverglass pattern that produced the maximum annual electrical energy. The annual electrical energy production improved by approximately 11.79% compared to the non-patterned coverglass.

Generalized Motion Artifacts Index Usable for Various Patterns of Video Images

  • Oka, Koichi;Kitagishi, Keiko;Enami, Yoshi
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.129-133
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    • 2005
  • An integrated pattern profile distortion is newly proposed to analyze various two-dimensional test patterns. The unit is converted to a time to make parameters comparable for various types of displays. In addition, this can be compared with that of extended blur edge width in time scale, which has been reported.

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구리 박막의 Reflow 특성에 관한 연구 (A Study on the Reflow Characteristics of Cu Thin Film)

  • 김동원;권인호
    • 한국재료학회지
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    • 제9권2호
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    • pp.124-131
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    • 1999
  • Copper film, which is expected to be used as interconnection material for 1 giga DRAM integrated circuits was deposited on hole and trench patterns by Metal Organic Chemical Vapor Deposition(MOCVD) method. After a reflow process, contact and L/S patterns were filled by copper and the characteristics of the Cu reflow process were investigated. When deposited Cu films were reflowed, grain growth and agglomeration of Cu have occurred in surfaces and inner parts of patterns as well as complete filling in patterns. Also Cu thin oxide layers were formed on the surface of Cu films reflowed in $O_2$ambient. Agglomeration and oxidation of Cu had bad influence on the electrical properties of Cu films especially, therefore, their removal and prevention were studied simultaneously. As a pattern size is decreased, preferential reflow takes place inside the patterns and this makes advantages in filling patterns of deep submicron size completely. With Cu reflow process, we could fill the patterns with the size of deep sub-micron and it is expected that Cu reflow process could meet the conditions of excellent interconnection for 1 giga DRAM device when it is combined with Cu MOCVD and CMP process.

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마비된 말단근육의 제어를 위한 휴대용 다중 채널의 기능적 전기자극(FES) 장치 (A portable multichannel FES system for control of paralyzed extremities)

  • 류영재;박봉기;김영민;임영철;김하경
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1992년도 한국자동제어학술회의논문집(국내학술편); KOEX, Seoul; 19-21 Oct. 1992
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    • pp.90-94
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    • 1992
  • A portable multichannel functional electrical stimulation(FES) system for the fine control of the paralyzed extremities in spinal cord injury patients is described. This system is composed of a stimulation data creating system, a serial communication device, a 16-bit microprocessor, D/A converter of 32 channels and a display device. Stimulation patterns are created from analytical results of integrated EMGs during motion in normal subjects and are stored in the stimulation data creating system as data files. And then the stimulation patterns are sent to the memory in the portable multichannel FES system through serial communication interfacing device. Sophisticated fine control of paralyzed extrimities was realized by transmitting multichannel stimulation patterns to percutaneous intramuscular electrodes, which stimulate the motor function of paralyzed muscle simultaneously. Advantages of this system are as follws: 1) It is possible to modify stimulation patterns in accordance with the patient's situation. 2) This system is small and light.

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