• 한국시뮬레이션학회논문지
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• 제10권3호
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• pp.59-70
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• 2001

Typical low-level image processing tasks require thousands of operations per pixel for each input image. Traditional general-purpose computers are not capable of performing such tasks in real time. Yet important features of traditional computers are not exploited by low-level image processing tasks. Since storage requirements are limited to a small number of low-precision integer values per pixel, large hierarchical memory systems are not necessary. The mismatch between the demands of low-level image processing tasks and the characteristics of conventional computers motivates investigation of alternative architectures. The structure of the tasks suggests employing an array of processing elements, one per pixel, sharing instructions issued by a single controller. In this paper we implemented various image processing filtering using the format converter. Also, we realized from conventional gray image process to color image process. This design method is based on realized the large processor-per-pixel array by integrated circuit technology This format converter design has control path implementation efficiently, and can be utilize the high technology without complicated controller hardware.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 춘계학술회의 초록집
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• pp.21-21
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• 2010

(Ba,Sr)$TiO_3$ (BST) thin film with a perovskite structure has potential for the practical application in various functional devices such as nonvolatile-memory components, capacitor, gate insulator of thin-film transistors, and electro-optic devices for display. Normally, the BST thin films derived from sol-gel and sputtering are amorphous or partially crystalline when processed below $600^{\circ}C$. For the purpose of integrating BST thin film directly into a Si-based read-out integrated circuit (ROIC), it is necessary to process the BST film below $400^{\circ}C$. The microstructural and electrical properties of low-temperature crystallized BST film were studied. The BST thin films have been fabricated at $350^{\circ}C$ by UV-assisted rapidly thermal annealing (RTA). The BST films are in a single perovskite phase and have well-defined electrical properties such as high dielectric constant, low dielectric loss, low leakage current density, and high breakdown voltage. Photoexcitation of the organics contained in the sol-gel-derived films by high-intensity UV irradiation facilitates elimination of the organics and formation of the single-crystalline phase films at low temperatures. The amorphous BST thin film was transformed to a highly (h00)-oriented perovskite structure by high oxygen pressure processing (HOPP) at as low as $350^{\circ}C$. The dielectric properties of BST film were comparable to (or even better than) those of the conventionally processed BST films prepared by sputtering or post-annealing at temperature above $600^{\circ}C$. When external pressure was applied to the well-known contractive BST system during annealing, the nucleation energy barrier was reduced; correspondingly, the crystallization temperature decreased. The UV-assisted RTA and HOPP, as compatible with existing MOS technology, let the BST films be integrated into radio-frequency circuit and mixed-signal integrated circuit below the critical temperature of $400^{\circ}C$.

• 대한의용생체공학회:학술대회논문집
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• 대한의용생체공학회 1998년도 추계학술대회
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• pp.299-300
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• 1998

Recently the development of medical modality like as MRI, 3D US, DR etc is very active. Therefore it is more required not only the enhancement of quality in medical service but the improvement of medical system based on quantization, minimization, and optimization of high speed. Especially, as the changing into the digital modality system, it gets to start using ASIC(Application Specific Integrated Circuit) to realize one board system. It requires the implementation of hardware debugging and effective speedy algorithm with more speed and accuracy in order to support and replace existing device. If objected image could be linked to high speed process board with special interface and pre-processed using FPGA, it can be used in real time image processing and protocol of HIS(Hospital Information System). This study can support the basic circuit design of medical image board which is able to realize image processing basically using digitalized medical image, and to interface between existing device and image board containing image processing algorithm.

• 한국정보통신학회논문지
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• 제6권1호
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• pp.25-29
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• 2002

High speed 신호처리는 통신분야, SC circuit, HDTV, ISDN 등에서 관심이 더욱 승가하고 있으며, high speed 신호처리를 위한 많은 방법들이 있다. 본 논문에서는 CMOS 공정에서 고주파 Op-amp의 실현을 의한 설계를 기술하였다. 아날로그 집적회로를 기초로 하는 high speed op-amp의 기능을 제한하는 요소 중 한가지는 유효 주파수 범위이다. 본 논문에서는 $C_{L}$ =2pF에서 단위이득 주파수가 170MHz인 향상된 대역폭적을 가지는 CMOS op-amp 구조를 계발한다. 공정은 1.2$\mu$디자인 룰을 따른다. 본 논문에서 제시한 CMOS op-amp 고주파 SC filter에서 요구하는 큰 커패시터 부하에서의 넓고 안정된 대역폭을 얻기에 매우 적합하다.

• 대한전자공학회논문지SD
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• 제41권12호
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• pp.59-65
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• 2004

적외선 소자로부터 생성되는 신호의 잡음 특성의 향상, 즉 좋은 영상을 얻기 위해서 적외선 영상신호 취득회로(ROIC)에서는 안정적인 기준 전압원이 필요하다. 본 논문은 극저온인 77K에서 동작하는 적외선 영상신호 취득회로(readout integrated circuit)를 위한 밴드갭 회로를 처음으로 제작한 후 측정, 평가하여 그 실용 가능성을 입증하고 있다. 밴드갭 회로는 대표적인 전압 기준회로로서 기존에 발표된 대부분의 밴드갭 회로는 실온에서 동작하는 것이며, 액체질소 온도 77K에서는 그 특성이 적합하지 않다. 본 논문에서는 극저온에서 동작하는 밴드갭 회로 설계를 위하여, 그에 맞는 회로를 선택하여 온도변화에 따른 사용되는 소자들의 파라미터에 대한 이론정립을 통한 그것의 특성을 살펴보고, 이러한 특성들을 고려하여 저온동작에 적합도록 하였다. 이 회로는 Hynix 0.6um standard CMOS 공정을 통해서 제작되었으며, 측정된 출력전압($V_{out}$)은 60K에서 110K까지 1.0396$\pm$0.0015V로서 기존의 실온에 동작하던 밴드갭 회로보다 더 높은 안정도를 보여주었다.

• Advances in Energy Research
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• 제7권2호
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• pp.147-166
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• 2020

Industrial cooling towers are often ageing infrastructure that is expensive to maintain and operate. A novel approach is introduced in which a heat pump circuit is incorporated to reduce the load upon the towers by extracting low-grade energy from the stream sent to the towers and repurposing in on-site processing operations. To demonstrate the concept, a model was constructed, which uses industrial data on cooling towers linked to a smelter's sulphuric acid plant, to allow direct economic and environmental impact comparison between different heat recovery and repurposing scenarios. The model's results showed that implementing a heat pump system would significantly decrease annual operating costs and achieve a payback period of 3 years. In addition, overall CO₂ emissions could be reduced by 42% (430,000 kg/year) and a 5% heat load reduction on the cooling towers achieved. The concept is significant as the outcomes introduce a new way for energy intensive industrial sectors, such as mineral processing, to reduce energy consumption and improve long-term sustainable performance.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• 한국통신학회논문지
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• 제10권2호
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• pp.93-103
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• 1985

대역폭 압축에 의한 디지털 신호처리 기술은 최근 몇 년동안 집적회로 기술의 발달에 따라 급성장해왔다. 본 연구에서는 화면의 중앙에 시야가 돋보이며 눈의 감각과 일치하는 Hadamard Matrix의 중앙에 Weight를 준 Nonorthogonal 변환인 Weighted Handamard Matrix를 구하여 실시간처리를 위한 고속계산방법과 Hardware system을 연구하였다. 따라서 본 연구는 항공사진, X-Ray, CATV, 인공위성통신 등 디지탈영상신호처리에 사용할 수 있을 것이다.

• IEIE Transactions on Smart Processing and Computing
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• 제4권3호
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• pp.141-144
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• 2015

A broadband radio frequency synthesizer for multi-band, multi-standard mobile DTV tuners is proposed, it's loop bandwidth can be calibrated to optimize integrated phase noise performance without the problem of phase noise peaking. For this purpose, we proposed a new third-order scalable loop filter and a scalable charge pump circuit to minimize the variation in phase margin during calibration. The prototype phase-lock loop is fabricated in 180nm complementary metal-oxide semiconductor shows that it effectively prevents phase noise peaking from growing while the loop bandwidth increases by up to three times.

• 전자공학회논문지A
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• 제31A권8호
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• pp.62-71
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• 1994

A novel semiconductor device is proposed to be used as a processing element for the implementation of pulse-mode neural networks which consists of alternating n' GaAs quantum wells and undoped AlGaAs barriers sandwitched between n' GaAs cathode and P' GaAs anode and in simple circuit in conjunction with a parallel capacitive and resistive load the trigger circuit generates neuron-like pulse train output mimicking the function of axon hillock of biological neuron. It showed the sigmoidal relationship between the frequency of the pulse-train and the applied input DC voltage. In conjunction with MQWIMD the various neural circuits are proposed especially a neural chip monolithically integrated with photodetectors in order to perfrom the pattern recognition.