• Journal of Practical Engineering Education
• /
• v.13 no.3
• /
• pp.483-490
• /
• 2021

In this paper, we proposed the development of a smart factory intergrated technology education platform using smart factory based CPPS (Cyber Physical Production System) and VR (Vitrual Reality) technology and educational methods using the platform. A platform has been developed to learn how to integrate 3D digital twin and BOP (Bill of Process)-based manufacturing processes. In addition, Digital Twin established a smart factory-based integrated education platform by linking mechanical systems, digital twins, and virtual reality through the OPC-UA server. Based on this platform, the smart factory integration platform is proposed to have individual elements of the smart factory integration platform through BOP-based digital twin simulation, OPC-UA integration, MES system, SCADA system, and VR interworking.

• Current Optics and Photonics
• /
• v.5 no.6
• /
• pp.699-710
• /
• 2021

In this study, we propose a biomimetic optical structure design methodology for investigating micro-optical mechanisms associated with the compound eyes of insects. With these compound eyes, insects can respond fast while maintaining a wide field of view. Also, considerable research attention has been focused on the insect compound eyes to utilize these benefits. However, their nano micro-structures are complex and challenging to demonstrate in real applications. An effectively integrated design methodology is required considering the manufacturing difficulty. We show that photorealistic ray-traced visualization is an effective method for designing the biomimetic of a micro-compound eye of an insect. We analyze the image formation mechanism and create a three-dimensional computer-aided design model. Then, a ray-trace visualization is applied to observe the optical image formation. Finally, the segmented images are stitched together to generate an image with a wide-angle; the image is assessed for quality. The high structural similarity index (SSIM) value (approximately 0.84 to 0.89) of the stitched image proves that the proposed MATLAB-based image stitching algorithm performs effectively and comparably to the commercial software. The results may be employed for the understanding, researching, and design of advanced optical systems based on biological eyes and for other industrial applications.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.36 no.3
• /
• pp.265-273
• /
• 2012

The business environment is changing rapidly because of the global crisis. In order to survive and enhance competitiveness in the global market, global manufacturing companies are trying to overcome the crisis through the convergence of production infrastructure and IT technology. The importance of systems to support the integration of manufacturing processes, collaboration in product development, and information integration of providers and producers is therefore increasing. In this paper, research is conducted on the design and implementation of a collaboration system to support a power-boat manufacturing company in this situation of increased demand for collaboration and information integration. The system was designed through product-structure and production-process analysis, support product data management, and enterprise contents management. The company involved in the power-boat development project is expected to show an improvement in productivity through the integrated management of information and collaboration provided by this system.

• Journal of the Korean Institute of Gas
• /
• v.2 no.3
• /
• pp.54-59
• /
• 1998

As distributed control systems (DCS) and plant information systems (PIS) are introduced into gas industries, process monitoring systems based on process data have attracted significant interests. However, these technologies have not been fully due to strong nonlinearities of batch processes. The multiway principal component analysis, which has been recently developed, has solved these problems and has been widely used in the industries. However, the lack of statistical background of process operators has been one of major obstacles for maximum utilization of the technology This paper introduces a real time monitoring system for batch gas manufacturing processes that offers a variety of tools that operators can understand and use without serious difficulties. The proposed integrated system covers the whole spectrum of monitoring and diagnosis that include data collection, monitoring and diagnosis. The developed system has been verified to be very effective for monitoring and diagnosis using its application to the construction of monitoring system for a typical industrial batch reactor.

• KIPS Transactions on Computer and Communication Systems
• /
• v.10 no.7
• /
• pp.205-214
• /
• 2021

For smart manufacturing, most semiconductor sites utilize automated material handling systems(AMHS). As one of the AMHSs, the OHT control system(OCS) manages overhead hoist transports(OHT) that move along rails installed on the ceiling. This paper proposes a real-time scheduling system to efficiently allocate and control the OHTs in semiconductor logistics processes. The proposed system, as an independent subsystem within the OCS, is interconnected with the main subsystem of the OCS, so that it can be easily modified without the effect of other systems. To develop the system, we first identify the functional requirements of the semiconductor logistics process and classify several types of control scenarios of the OHTs. Next, based on SEMI(Semiconductor Equipment and Materials International) standard, we design sequence diagrams and interface messages between the subsystems. The developed system is interoperated with the OCS main subsystem and the database in real time and performs two major roles: 1) OHT dispatching and 2) pathfinding. Six integrated tests were carried out to verify the functions of the developed system. The system was normally operated on six basic scenarios and two exception scenarios and we proved that it is suitable for the mission planning of the OHTs.

• Journal of Korea Technology Innovation Society
• /
• v.18 no.3
• /
• pp.387-415
• /
• 2015

In this study, we have proposed an estimation model of domestic market size using the linking between standard statistical classification systems, and reviewed the practical applicability of the model. The results of the mining and manufacturing survey of Statistics Korea conducted on the basis of KSIC (Korea Standard Industrial Classification) and Korea trade statistics based on HS (The Harmonized Commodity Description and Coding System; Harmonized System) classification were linked for the model by using the correspondence tables provided by Statistics Korea and United Nations Statistics Division. The most serious problem to adopt the integrated KSIC-ISIC-HS correspondence table for the estimation of domestic market size is the complex multiple linkages among KSIC and HS codes. In this study, we have suggested the method to divide the amount of trade corresponding to the HS codes linked to more than two ISIC codes based on the ratio of shipments corresponding to the ISIC codes as the weight. Then, it is possible to analyze the domestic market size of 125 ISIC codes in the manufacturing industry and to forecast the market size in the near future by using the model. Although the model has some limitations such as the difficulty in analysis on more subdivided items than ISIC items, the impossibility of the analysis on items in industries except for manufacturing, errors in the shipment due to some missing data, this study has significance in the sense that it provided the analysis method of domestic market size by using the most objective, reliable and sustainably useful data.

• Proceedings of the Society of Korea Industrial and System Engineering Conference
• /
• 2002.05a
• /
• pp.113-118
• /
• 2002

Research and Development(R&D) was once considered to be a unique, creative and unstructured process that was difficult, if not impossible, to manage and control. R&D decisions impact the entire enterprise. Therefore, decisions must not be based solely on R&D's perception of what is important or worthwhile. R&D contributions are difficult to measure separately from other functional organizations such as manufacturing and marketing. While some firms are attempting to overcome perceived limitations in traditional accounting-based performance measures using ROI, EVA, others are embracing the use of non-financial measures for decision making and performance evaluation. In particular, many firms are implementing 'Balanced Scorecard(BSC)' systems that supplement traditional accounting measures with non-financial measures focused on at least three other perspectives-customers, internal business processes, and learning and growth. AHP is a popular multi-attribute decision making model that allows for the development of importance rankings. The AHP has been applied in a wide variety of practical settings to model complex decision problems. The former, determine Perspectives and the Key Performance indicator(KPI) through the former research, the latter compose the questionnaire for determine the weight of perspectives and KPIs. And then, make a survey with researchers about 4 perspectives and 18 KPIs. The results will be simulate with Expert Choice 2000 for determine the weights. This results helps establish the firm's business strategy and technology strategy The firm should establish the business strategy to consider market position, business growth potential, and technological capabilities.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.11 no.4
• /
• pp.1222-1228
• /
• 2010

This paper presents a design of the CMOS LDO regulator with a fast transient response for a high speed PMIC(power management integrated circuit). Proposed LDO regulator circuit consists of a reference voltage circuit, an error amplifier and a power transistor. 2-stage wide-band OTA buffer between error amplifier and power transistor is added for a good output stability. Although conventional source follower buffer structure is simple, it has a narrow output swing and a low S/N ratio. In this paper, we use a 2-stage wide-band OTA instead of source follower structure for a buffer. From HSPICE simulation results using a $0.5{\mu}m$ CMOS standard technology, simulation results were 16 mV/V line regulation and 0.007 %/mA load regulation.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.40 no.1
• /
• pp.87-94
• /
• 2017

Many industrial accidents have occurred continuously in the manufacturing industries, construction industries, and service industries of Korea. Fatal accidents have occurred most frequently in the construction industries of Korea. Especially, the trend analysis of the accident rate and fatal accident rate is very important in order to prevent industrial accidents in the construction industries systematically. This paper considers forecasting of the accident rate and fatal accident rate with static and dynamic time series analysis methods in the construction industries. Therefore, this paper describes the optimal accident rate and fatal accident rate by minimization of the sum of square errors (SSE) among regression analysis method (RAM), exponential smoothing method (ESM), double exponential smoothing method (DESM), auto-regressive integrated moving average (ARIMA) model, proposed analytic function model (PAFM), and kalman filtering model (KFM) with existing accident data in construction industries. In this paper, microsoft foundation class (MFC) soft of Visual Studio 2008 was used to predict the accident rate and fatal accident rate. Zero Accident Program developed in this paper is defined as the predicted accident rate and fatal accident rate, the zero accident target time, and the zero accident time based on the achievement probability calculated rationally and practically. The minimum value for minimizing SSE in the construction industries was found in 0.1666 and 1.4579 in the accident rate and fatal accident rate, respectively. Accordingly, RAM and ARIMA model are ideally applied in the accident rate and fatal accident rate, respectively. Finally, the trend analysis of this paper provides decisive information in order to prevent industrial accidents in construction industries very systematically.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.4
• /
• pp.53-58
• /
• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.