• 한국전기전자재료학회논문지
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• 제33권4호
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• pp.286-290
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• 2020

The formation of inorganic thin films in low-temperature solution processes is necessary for a wide range of commercial applications of organic electronic devices. Aluminum oxide thin films can be utilized as barrier films that prevent the deterioration of an electronic device due to moisture and oxygen in the air. In addition, they can be used as the gate insulating layers of a thin film transistor. In this study, aluminum oxide thin film were formed using two methods simultaneously, a thermal process and the DUV process, and the properties of the thin films were compared. The result of converting aluminum nitrate hydrate to aluminum oxide through a hybrid process using a thermal treatment and DUV was confirmed by XPS measurements. A film-based a-IGZO TFT was fabricated using the formed inorganic thin film as a gate insulating film to confirm its properties.

• 한국기계가공학회지
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• 제17권3호
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• pp.51-58
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• 2018

In this paper, the organic material Poly(methyl methacrylate) PMMA is used with inorganic $Al_2O_3$ to fabricate organic-inorganic multilayer barrier thin films. The organic thin films are developed using a roll-to-roll electrohydrodynamic atomization system, whereas the inorganic are grown using a roll-to-roll low-temperature atmospheric pressure atomic layer deposition system. For the first time, these two technologies are used together to develop organic-inorganic multilayer barrier thin films in atmospheric condition. The films are grown under optimized parameters and classified into three classes based on the layer structures, when the total thickness of the barrier is maintained at ~ 160 nm. All classes of barriers show good morphological, optical and chemical properties. The $Al_2O_3$ films with a low average arithmetic roughness of 1.58 nm conceal the non-uniformity and irregularities in PMMA thin films with a roughness of 5.20 nm. All classes of barriers show a notably good optical transmission of ~ 85 %. The hybrid organic-inorganic barriers show water vapor and oxygen permeation in the range of ${\sim}3.2{\times}10^{-2}g/m^2/day$ and $0.015cc/m^2/day$ at $23^{\circ}C$ and 100% relative humidity. It has been confirmed that it can be mass-produced and used as a low-cost barrier thin film in various printing electronic devices.

• 한국재료학회지
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• 제27권1호
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• pp.12-18
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• 2017

Transparent organic-inorganic hybrid hard coating films were prepared by the addition of $SiO_2$ or $ZrO_2$, as an inorganic filler to improve the hardness property, filler was highly dispersed in the acrylic resin. To improve the compatibility in the acrylic resin, $SiO_2$ or $ZrO_2$ is surface-modified using various silanes with variation of the modification time and silane content. Depending on the content and kind of the modified inorganic oxide, transparent modified inorganic sols were formulated in acryl resin. Then, the sols were bar coated and cured on PET films to investigate the optical and mechanical properties. The optimized film, which has a modified $ZrO_2$ content of 4 wt% markedly improved in terms of the hardness, haze, and transparency as compared to neat acrylate resin and acrylate resin containing modified $SiO_2$ content of 8 wt%. Meanwhile, the low transparency and high haze of these films slowly appeared at $SiO_2$ content above 10 wt% and $ZrO_2$ content of 5 wt%, but the hardness values were maintained at 2H and 3H, respectively, in comparison with the HB of neat acrylate resin.

• 한국산학기술학회논문지
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• 제12권4호
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• pp.1993-1998
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• 2011

반도체 산업은 지속적으로 비약적인 발전을 이루어내면서 점점 고집적회로를 제작하기 위하여 패턴의 미세화가 이루어지게 되었다. 현재 미세 나노패턴의 형성을 위하여 여러층의 하드마스크가 사용되고 있으며, 화학증기증착(CVD)공정을 이용하여 형성한다. 이에 본 연구에서는 스핀공정(spin-on process)이 가능한 유-무기 하이브리드 중합체를 이용한 단일층의 하드마스크를 제작하였는데, 하드마스크 내의 무기계 성분이 감광층 보다 쉽게 식각되는 반면에 하드마스크의 유기계 성분으로 인해 substrate층 보다 덜 식각되었다. 유-무기 하이브리드 중합체를 이용한 하드마스크막의 광학 및 표면 특성을 조사하였고, 감광층과 하드마스크막의 식각비를 비교하여 유-무기소재의 하이브리드중합체에 대한 미세패턴을 형성시킬 수 있는 하드마스크막으로써의 유용성을 확인하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.6.2-6.2
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• 2010

Stainless steel is widely known to have superior corrosion properties. However, in some harsh conditions it still suffers various kinds of corrosions such as galvanic corrosion, pitting corrosion, intergranular corrosion, chloride stress corrosion cracking, and etc. For the corrosion protection of stainless steel, the ceramic coatings such as protective silica film can be used. The sol-gel coating technique for the silica film has been extensively studied especially because of the cost effectiveness. It has been proved that silica can improve the oxidation and the acidic corrosion resistance of metal surface in a wide range of temperatures due to its high heat and chemical resistance. However, in the sol-gel coating process there used to engage a heat treatment at an elevated temperature like $500^{\circ}C{\sim}600^{\circ}C$ where cracks in the silica film would be formed because of the thermal expansion mismatch with the metal. The cracks and pores of the film would deteriorate the corrosion resistance. When the heat treatment temperature is reduced while keeping the adhesion and the density of the film, it could possibly give the enhanced corrosion resistance. In this respect, inorganic protective silica film was tried on the surface of stainless steel using a sol-gel chemical route where silica nanoparticles, tetraethoxysilane (TEOS) and methyltriethoxysilane (MTES) were used. Silica nanoparticles with different sizes were mixed and then the film was deposited on the stainless steel substrate. It was intended by mixing the small and the large particles at the same time a sufficient consolidation of the film is possible because of the high surface activity of the small nanoparticles and a modest silica film is obtained with a low temperature heat treatment at as low as $200^{\circ}C$. The prepared film showed enhanced adhesion when compared with a silica film without nanoparticle addition. The films also showed improved protect ability against corrosion.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.818-821
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• 2003

Sn-doped $In_{2}O_{3}$ (ITO) thin film is one of the materials widely on research not only in the academic fields but also in industrial fields because of their transparency, high conductivity and good adhesion characteristics on substrate. ITO thin films are usually preferred oriented to one of the (222), (400), and (440) planes during crystallization process, which is dependent on processing variables. The preferred orientation affects electrical, optical and etching properties of the films. In this study, thin films of preferred oriented in different orientation were fabricated by controlling processing variables. The crystallization behavior, grain size, surface roughness, transparency and electrical properties of the thin films in different orientation were examined.

• The Korean Journal of Ceramics
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• 제6권4호
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• pp.385-389
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• 2000

Residual stresses in epitaxial films were measured by X-ray diffraction method. Lattice strains of the (hkl) planes measured along particular Ψ-angles were converted to the in-plane stress according to the equation of stress-strain tensor conversion. Residual tensile stresses were observed in epitaxial PbTiO$_3$ films deposited on (100) SrTiO$_3$ substrate. Tensile stresses approximately 0.9 GPa were measured in Pb-rich films, while it increased to approximately 2.0 GPa with the decreasing of Pb content in the case of Pb-poor films, which ascribed to the formation of lead and oxygen vacancies (expressed as x in Pb$_1-x$TiO$_3-x$).

• 한국표면공학회지
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• 제42권6호
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• pp.287-293
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• 2009

The passivation films with epoxy layer on LiF, $SiN_x$ and LiF/$SiN_x$ inorganic layer were fabricated on OLED to protect device from the direct damage of $O_2$ and $H_2O$ and to apply for a buffer layer between OLED device and passivation multi-layer with organic/inorganic hybrid structure as to diminish the thermal stress and expansion. Red OLED doped with 1 vol.% Rubrene in $Alq_3$ was used as a basic device. The device structure was multi-layer of ITO(150 nm) / ELM200_HIL(50 nm) / ELM002_HTL(30 nm) / $Alq_3$: 1 vol.% Rubrene(30 nm) / $Alq_3$(30 nm) / LiF(0.7 nm) / Al(100 nm). LiF/epoxy applied as a protective layer didn't contribute to the improvement of life time. While in case of $SiN_x$/epoxy, damage was done in the passivation process because of difference in heat expansion between films which could occur during the formation of epoxy film. Using LiF/$SiN_x$/epoxy improved lifetime significantly without suffering damage in the process of forming films, therefore, the best structure of passivation film with inorganic/epoxy layers was LiF/$SiN_x$/E1.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.158-158
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• 2012

A new kind of organic-inorganic hybrid polymer, poly(tetraphenyl)silole siloxane (PSS), was invented and synthesized for realization of its unique charge trap properties. The organic portions consisting of (tetraphenyl)silole rings are responsible for electron trapping owing to their low-lying LUMO, while the Si-O-Si inorganic linkages of high HOMO-LUMO gap provide the intrachain energy barrier for controlling electron transport. Such an alternation of the organic and inorganic moieties in a polymer may give an interesting quantum well electronic structure in a molecule. The PSS thin film was fabricated by spin-coating of the PSS solution in THF organic solvent onto Si-wafer substrates and curing. The electron trapping of the PSS thin films was confirmed by the capacitance-voltage (C-V) measurements performed within the metal-insulator-semiconductor (MIS) device structure. And the quantum well electronic structure of the PSS thin film, which was thought to be the origin of the electron trapping, was investigated by a combination of theoretical and experimental methods: density functional theory (DFT) calculations in Gaussian03 package and spectroscopic techniques such as near edge X-ray absorption fine structure spectroscopy (NEXAFS) and photoemission spectroscopy (PES). The electron trapping properties of the PSS thin film of quantum well structure are closely related to intra- and inter-polymer chain electron transports. Among them, the intra-chain electron transport was theoretically studied using the Atomistix Toolkit (ATK) software based on the non-equilibrium Green's function (NEGF) method in conjunction with the DFT.

• 공업화학
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• 제22권2호
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• pp.230-234
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• 2011

반도체산업은 고집적화된 회로를 요구하면서 미세 패턴을 형성하기 위해 계속해서 발전해가고 있다. 이에 반도체 산업에서 미세 패턴을 형성하기 위하여 하드마스크를 도입하여 사용되고 있다. 일반적으로 하드마스크는 화학증기증착법(CVD) 공정을 이용하여 다층구조로 제작된다. 이에 본 연구에서는 스핀공정이 가능하고 단층의 하드마스크용 조성물을 제조하기 위하여 유-무기 하이브리드 중합체를 이용하여 그 특성에 대하여 연구하였다. Silanol로 처리된 siloxane 화합물과 acetonide 그룹을 가지는 propionic acid를 에스터화 반응을 통하여 얻은 유-무기 하이브리드 중합체에 가교제 및 첨가제들의 첨가로 광학적, 열적, 그리고 표면 특성이 조절된 하드마스크 막을 제조하였다. 또한 하드마스크 막과 감광층의 식각비를 비교하여 유-무기 소재의 하이브리드 중합체에 대해 미세패턴을 형성시킬 수 있는 하드마스크 막으로써의 유용성을 확인하였다.