• Title/Summary/Keyword: Ink-jet technology

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Development of a Paper Strain Gauge using Inkjet-printing Technology (잉크젯 인쇄기술을 이용한 종이 스트레인게이지 개발)

  • Lee, Young Tae
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.2
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    • pp.23-27
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    • 2015
  • In this paper, eco-friendly paper strain gauge was fabricated in the way of printing strain gauge on paper substrate, using PEDOT:PSS ink and inkjet printer technology. As a p-type conductive high polymer, PEDOT:PSS is known to be piezoresistive effect. I formed a strain gauge by connecting in parallel 5 lines of $60{\mu}m$ width printed with PEDOT:PSS. To minimize surrounding influence such as temperature, I formed wheat-stone bridge by combining 4 strain gauges (quarter-bridge strain gauge) which were made up of PEDOT:PSS 5 lines and measured. In quarter-bridge strain gauge, only two strain gauges, facing each other, arranged in strain and horizontal direction were deformed while the other two strain gauge of vertical direction were not. Therefore, quarter-bridge strain gauge showed the output of half bridge. The fabricated quarter-bridge strain gauge had output sensitivity of $105.6{\mu}V/V{\cdot}mm$ and its output linearity was relatively good.

A Study on Optimization of Inkjet-based IDE Pattern Process for Impedance Sensor (임피던스 센서 제작을 위한 잉크젯 기반 패턴 IDE 적층공정 최적화 연구)

  • Jeong, Hyeon-Yun;Ko, Jeong-Beom
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.4
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    • pp.107-113
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    • 2022
  • At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

Light Emitting Polymer Displays

  • Heeks, Karl;Smith, Euan;Goodchild, Bill;Burroughes, Jeremy;Towns, Carl
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.319-324
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    • 2002
  • We will report the latest developments in light emitting polymer (LEP) systems developed at CDT. Device performance for spin coated and ink jet printed systems will be described which are state-of-the-art. We will also report on novel driving schemes for both active and passive addressed LEP displays. These drive schemes extend system lifetime as well as lowering power consumption.

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Solution Processable P-OLED (Polymer Organic Light Emitting Diode) Display Technology.

  • Lee, Jueng-Gil;Carter, Julian
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1050-1055
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    • 2005
  • We report the development frontiers that are dictating the speed of adoption of polymer organic light emitting diode (P-OLED) technology in market applications. Our presentation includes both the developments taking place in materials and the rapid advances in the manufacturing processes used for solution processable P OLEDs. On the manufacturing side, the latest progress in ink jet printing process is discussed. On the materials side, we look at both fluorescent and phosphorescent material performance including the CDT development roadmap.

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Solution Processable P-OLED (Polymer Organic Light Emitting Diode) Display Technology.

  • Lee, Jueng-Gil;Carter, Julian
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1355-1360
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    • 2005
  • We report the development frontiers that are dictating the speed of adoption of polymer organic light emitting diode (P-OLED) technology in market applications. Our presentation includes both the developments taking place in materials and the rapid advances in the manufacturing processes used for solution processable P-OLEDs. On the manufacturing side, the latest progress in ink jet printing process is discussed. On the materials side, we look at both fluorescent and phosphorescent material performance including the CDT development roadmap.

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Information Displays in the Twenty-First Century

  • Miyasaka, Mitsutoshi;Shimoda, Tatsuya
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.61-64
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    • 2003
  • The information display industry this century has to improve our life without increasing energy consumption. Suftla technology together with high-performance silicon thin film transistors (TFTs) and ink-jet technology for forming metal-wiring and organic TFTs will play leading roles for achieving this requirement. In this paper these technologies are reviewed and the concept of the information displays in near future is discussed.

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Development of a new thermal inkjet head with the virtual valve fabricated by MEMS technology (멤스기술을 이용한 가상밸브가 있는 새로운 잉크젯 헤드 개발)

  • Bae, Ki-Deok;Baek, Seog-Soon;Shin, Jong-Woo;Lim, Hyung-Taek;Shin, SuHo;Oh, Yong-Soo
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1892-1897
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    • 2003
  • A new thermal inkjet printer head on SOI wafer with virtual valve was proposed. It was composed of two rectangular heaters with same size. So we could call it T-jet(Twin jet). T-jet has a lot of merits. It has the advantage of being fabricated with one wafer and is easy to change the size of chamber, nozzle, restrictor and so on. However, above all, It is the best point that T-jet has a virtual valve. And it was manufactured on SOI wafer. The chamber was formed in its upper silicon whose thickness was 40um. The chamber's bottom layer was silicon dioxide of SOI wafer and two heaters were located underneath the chamber's ceiling. And the restirctor was made beside the chamber. Nozzle was molded by process of Ni plating. Ni was 30um thick. Nozzle ejection test was performed by printer head having 56 nozzles in 2 columns with 600NPI(nozzle per inch) and black ink. It measured a drop velocity of 12m/s, a drop volume of 30pl, and a maximum firing frequency of 12KHz for single nozzle ejection. Throwing out the ink drop in whole nozzles at the same time, it was observed that the uniformity of the drop velocity and volume was less than 4%.

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Synthesis of Concentrated Cu-Ag Nano Sol for Ink-Jet Method

  • Park, Han-Sung;Choi, Young-Min;Ryu, Beyong-Hwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1370-1373
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    • 2006
  • The Cu-Ag nanoparticles have been synthesized in aqueous medium using a hydrazine reduction method. The assisted role of polymeric dispersant on synthesis of highly concentrated Cu-Ag nanoparticles was studied. The 30wt% of Cu-Ag nanoparticles with the range of 10 nm in diameter was prepared.

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Ultrafine ITO Nanoparticle for Ink Jet Printing

  • Hong, Sung-Jei;Kim, Yong-Hoon;Han, Jeong-In
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.467-470
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    • 2007
  • Ultrafine Indium tin oxide (ITO) nanoparticle was successfully fabricated by low temperature synthetic method (LTSM). Mean size of ITO nanoparticle is 5 nm, and uniformly dispersed with (222) orientated cubic structure. Using the nanoparticle, ITO thin film with good optical and electrical properties was fabricated by inkjet printing.

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Interfacial Microstructures between Ag Wiring Layers and Various Substrates (Ag 인쇄배선과 이종재료기판과의 접합계면)

  • Kim, Keun-Soo;Suganuma, Katsuaki;Huh, Seok-Hwan
    • Journal of Welding and Joining
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    • v.29 no.5
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    • pp.90-94
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    • 2011
  • Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.