• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.145-150
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• 2000

Micro punching is one of general methods to fabricate simple holes such as permanent ink-jet printer nozzles. A thin punch, that is need for micro punching, usually has been obtained by mechanical machining. There are some method to obtain a thin punch from a cylindrical rod, e.g., microgrinding and WEDG (Wire Electro-Discharge Grinding). Inefficiently, only one punch can be obtained from these machining methods. In contrast with these methods, many punches can be fabricated simultaneously by electrochemical process. Electrochemical process has usually aimed to obtain very sharp probe for atomic force microscopy (AFM) or scanning tunneling microscopy (STM), and it has not been considered the whole shape of a probe in spite of good merits. In this paper, an ultrathin punch with a tapered shape and a cylindrical tip is newly fabricated by electrochemical process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.824-828
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• 2000

As production cycle has become more and more shorter, the demand of rapid prototyping technology has increased largely. There are many methods for rapid prototyping technology, such as SLA. SLS, FDM. INK JET, LOM and so on. Of all methods, SLA has been most widely used for fabricating precision parts. But products manufactured by this method have limitation of single color and single material. So the principal purpose of this study is to overcome the limit of single color product. If the internal structure of manufactured product is visible with multi-color characteristic, it is possible to check easily the designed model with reality. In order to give multi-color characteristic to the product, photocurable resin mixed with pigment is used in this study. First, transparency of photocurable resin without pigment is evaluated, and then color characteristic and curing characteristic of the mixture is evaluated changing mixing ratio. Through the basic experiments, it becomes possible to fabricate multi-color 3D prototype without assembly.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.5
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• pp.201-208
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• 2016

Ceramic pigments, which show good thermal and chemical stabilities, have been applied for various industry with development of digital printing technology. Ceramic inkjet printing has advantages of high efficiency of ink usage and eco-friendly process. Thus, the interest of the ceramic pigments with various function and color including CMYK (cyan, magenta, yellow, black) digital primary color is increasing. Here, we investigated the thermal and chemical stabilities of white ceramic pigment for digital inkjet printing process. The microstructure and crystal structure of MgO, $Al_2O_3$, $MgAl_2O_4$, $CeO_2$ were analyzed, and the stability with glaze were evaluated. In order to evaluate the applicability for digital inkjet printing, the chemical stability of white ceramic pigments at high temperature was investigated by characterization of the mixed color properties with CMYK ceramic pigments after firing process.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.15-24
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• 2014

Recently, a variety of printing technologies, including ink jet, gravure, and roll-to-roll (R2R) printing, has generated intensive interest in the application of flexible and wearable electronic devices. However, the actual use of printing technique is much limited because the sintering process of the printed nanoparticle inks remains as a huge practical drawback. In the fabrication of the conductive metal film, a post-sintering process is required to achieve high conductivity of the printed film. The conventional thermal sintering takes considerable sintering times, and requires high temperatures. For application to flexible devices, the sintering temperature should be as low as possible to minimize the damage of polymer substrate. Several alternative sintering methods were suggested, such as laser, halogen lamp, infrared, plasma, ohmic, microwave, and etc. Eventually, the new sintering technique should be applicable to large area, R2R, and polymer substrate as well as low cost. This article reviews progress in recent technologies for several sintering methods. The advantages and disadvantages of each technology will be reviewed. Several issues for the application in R2R process are discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.39-42
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• 2007

Since the scalability of OLED process is crucial factor for large-sized TV manufacturing, various technologies are reviewed based on the published information. Despite of recent technology advancement enabling high color purity, large-sized AMOLED, a lot of problems to solve still exist to enter the large-sized display market. Here, Samsung will discuss what has to be concerned for large panel and how far the OLED technologies need to go more for the large-sized AMOLED TV marketplace.

• Journal of Electrical Engineering and Technology
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• v.4 no.1
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• pp.118-122
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• 2009

Organic thin film transistors with a pentacene active layer and various polymer gate insulators were fabricated and their performances were investigated. Characteristics of pentacene thin film transistors on different polymer substrates were investigated using an atomic force microscope (AFM) and x-ray diffraction (XRD). The pentacene thin films were deposited by thermal evaporation on the gate insulators of various polymers. Hexamethyldisilazane (HMDS), polyvinyl acetate (PVA) and polymethyl methacrylate (PMMA) were fabricated as the gate insulator where a pentacene layer was deposited at 40, 55, 70, 85, 100 oC. Pentacene thin films on PMMA showed the largest grain size and least trap concentration. In addition, pentacene TFTs of top-contact geometry are compared with PMMA and $SiO_2$ as gate insulators, respectively. We also fabricated pentacene TFT with Poly (3, 4-ethylenedioxythiophene)-Polysturene Sulfonate (PEDOT:PSS) electrode by inkjet printing method. The physical and electrical characteristics of each gate insulator were tested and analyzed by AFM and I-V measurement. It was found that the performance of TFT was mainly determined by morphology of pentacene rather than the physical or chemical structure of the polymer gate insulator

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.797-798
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• 2005

We report a novel structure for a full-color AMOLED (Active Matrix Organic Light Emitting Diode) eliminating the patterning process of a blue emitting layer. The patterning of the three primary colors, RGB, is a key technology in the OLED fabrication process. Conventional full color AMOLED containing RGB layers includes the three opportunities of the defects to make an accurate position and fine resolution using various technologies such as fine metal mask, ink-jet printing and laser-induced transfer system. We can skip the blue patterning step by simply stacking the blue layer as a common layer to the whole active area after pixelizing two primary colors, RG, in the conventional small molecular OLED structure. The red and green pixel showed equivalent performances without any contribution of the blue emission.

• Tribology and Lubricants
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• v.32 no.3
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• pp.75-81
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• 2016

Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm², the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm², however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.