• Title/Summary/Keyword: Ink Transfer

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Gravure Offset Printed on Fine Pattern by Developing Electrodes for the Ag Paste (Gravure Offset 인쇄에 의한 미세 전극용 Ag Paste 개발)

  • Lee, Sang-Yoon;Jang, Ah-Ram;Nam, Su-Yong
    • Journal of the Korean Graphic Arts Communication Society
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    • v.30 no.3
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    • pp.45-56
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    • 2012
  • Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.

Improving Conductivity of Metal Grids by Controlling Sintering Process (배선 함몰 전극의 배선 소결공정 최적화에 따른 전기적 특성 향상)

  • Ahn, Wonmin;Jung, Sunghoon;Kim, Do-Geun
    • Journal of the Korean institute of surface engineering
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    • v.48 no.4
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    • pp.158-162
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    • 2015
  • To substitute indium tin oxide (ITO), many substituents have been studied such as metal nanowires, carbon based materials, 2D materials, and conducting polymers. These materials are not good enough to apply to an electrode because theses exhibit relatively high resistance. So metal grids are required as an additionalelectrode to improve the conductivities of substituents. The metal grids were printed by electrohydrodynamic printing system using Ag nanoparticle based ink. The Ag grids showed high uniformity and the line width was about $10{\mu}m$. The Ag nanoparticles are surrounded by dispersants such as unimolecular and polymer to prevent aggregation between Ag nanoparticles. The dispersants lead to low conductivity of Ag grids. Thus, the sintering process of Ag nanoparticles is strongly recommended to remove dispersants and connect each nanoparticles. For sintering process, the interface and microstructure of the Ag grid were controlled in 1.0 torr Ar atmosphere at aound $400^{\circ}C$ of temperature. From the sintering process, the uniformity of the Ag grid was improved and the defects on the Ag grids were reduced. As a result, the resistivity of Ag grid was greatly reduced up to $5.03({\pm}0.10){\times}10^{-6}{\Omega}{\cdot}cm$. The metal grids embedded substrates containing low pressure Ar sintered Ag grids showed 90.4% of transmittance in visible range with $0.43{\Omega}/{\square}$ of sheet resistance.

Novel structure for a full-color AMOLED using a blue common layer (BCL)

  • Kim, Mu-Hyun;Chin, Byung-Doo;Suh, Min-Chul;Yang, Nam-Chul;Song, Myung-Won;Lee, Jae-Ho;Kang, Tae-Min;Lee, Seong-Taek;Kim, Hye-Dong;Park, Kang-Sung;Oh, Jun-Sik;Chung, Ho-Kyoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.797-798
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    • 2005
  • We report a novel structure for a full-color AMOLED (Active Matrix Organic Light Emitting Diode) eliminating the patterning process of a blue emitting layer. The patterning of the three primary colors, RGB, is a key technology in the OLED fabrication process. Conventional full color AMOLED containing RGB layers includes the three opportunities of the defects to make an accurate position and fine resolution using various technologies such as fine metal mask, ink-jet printing and laser-induced transfer system. We can skip the blue patterning step by simply stacking the blue layer as a common layer to the whole active area after pixelizing two primary colors, RG, in the conventional small molecular OLED structure. The red and green pixel showed equivalent performances without any contribution of the blue emission.

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Measurement and Compensation of Synchronization Error in Offset Printing Process (오프셋 인쇄에서의 동기화 오차 정밀 계측 및 보정 연구)

  • Kang, Dongwoo;Kim, Hyunchang;Lee, Eonseok;Choi, Young-Man;Jo, Jeongdai;Lee, Taik-Min
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.6
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    • pp.477-481
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    • 2014
  • Flexible electronics have been to the fore because it is believed that flexibility can add incredible value such as light weight and mobility into the existing electronic devices and create new markets of large-area and low-cost electronics such as wearable eletronics in near future. Offset printing processes are regarded as major candidates for manufacturing the flexible electronics because they can provide the patterning resolution of micron-size effectively in large-area. In view of mechanics, the most important viewpoint in offset printing is how to achieve the synchronized movement of two contact surfaces in order to prevent slip between two contact surfaces and distortion of the blanket surface during ink transfer so that the high-resolution and good-overlay patterns can be printed. In this paper, a novel low-cost measurement method of the synchronization error using the motor control output signals is proposed and the compensation method is presented to minimize the synchronization error.