• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.404-408
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• 2003

The characterization for several multi-layer embedded inductors with different structures was investigated. The optimized equivalent circuit models for several test structures were obtained from HSPICE. Building blocks are modeled using Partial element equivalent circuit method. The mean and the standard deviation of model parameters were extracted and predictive modeling was performed on different test structure. From this study, the characteristic of multi-layer inductors can be predicted.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.5
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• pp.283-288
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• 2000

In this work, small-size, high-performance simple solenoid-type RF chip inductors utilizing an Al2O3 core material were investigated. Copper (Cu) wire with $40\mum$ diameter was used as the coils and the size of the chip inductor fabricated in this work was $2.1mm\times1.5mm\times1.0mm$. The external current source was applied after bonding Cu coil leads to gold pads electro-plated on each end of backsides of a core material. High frequency characteristics of the inductance (L), quality factor (Q), and impedance (Z) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). This HP4291B was also used to obtain the equivalent circuit and its circuit parameters of the chip inductors. This HP4291B was also used to obtain the equivalent circuit and its circuit parameters of the chip inductors. The developed inductors have the self-resonant frequency (SRF) of 1.1 to 3.1 GHz and exhibit L of 22 to 150 nH. The L of the inductors decreases with increasing the SRF. The Z of the inductors has the maximum value at the SRF and the inductors have the quality factor of 70 to 97 in the frequency range of 500 MHz to 1.5 GHz.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.10
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• pp.17-23
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• 2003

In this study, microscale, high-performance, solenoid-type RF chip inductors were investigated. The size of the RF chip inductors fabricated in this work was 1.0${\times}$0.5${\times}$0.5㎣. The materials (96% Al2O3) and shape (I-type) of the core were determined by a Maxwell three-dimensional field simulator to maximize the performance of the inductors. The copper (Cu) wire with 40${\mu}{\textrm}{m}$ diameter was used as the coils. High frequency characteristics of the inductance (L), quality-factor (Q), and capacitance (C) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). The inductors developed have inductances of 11 to 39 nH and quality factors of 28 to 50 over the frequency ranges of 250MHz to 1 GHz, and show results comparable to those measured for the inductors prepared by CoilCraf $t^{Tm}$ that is one of the best chip inductor company in the world. The simulated data predicted the high-frequency data of the L, Q, and C of the inductors developed well.l.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.4126-4130
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• 2012

In this paper, we proposed planar spiral inductors based on AC coupling for high-frequency wireless signal transmission. Design and characteristics of various structures of the inductor were analyzed. Capacitance between the inductors can be reduced by positioning two thin-film inductors in parallel. So two structures were proposed. First structure is inter-diagonal structure. This structure was made not to overlap the wire part of the paralleled two inductors. Second structure is On-chip type structure that the two thin-film inductors were in parallel but located on diagonal line not to face each other. The resonance in this structure was reduced from twice to once by increasing horizontal distance between the two thin-film inductors, because the capacitance effect between the two thin-film inductors decreases when the distance between the two inductors increases.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.7
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• pp.339-343
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• 2006

In this study, the variations of the important characteristics of solenoid-type RF chip inductors utilizing a low-loss A1203 core material on inductor dimensions were investigated systematically. Four dimensions of the chip inductors fabricated in this work were $1.0\times0.5\times0.5mm^3,\;1.5\times1.0\times0.7mm^3,\;2.1\times1.5\times1.0mm^3,\;and\;2.4\times2.0\times1.4mm^3$ and copper (Cu) wire with $40{\mu}m$ diameter was used as the coils. High frequency characteristics of the inductance, quality factor, and impedance of developed inductors as a function of inductor dimensions were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). It was observed that the developed inductors with the number of turns of 6 have the inductance (L) of 12 to 82 nH and exhibit the self-resonant frequency (SRE) of 3.6 to 1.2 GHz. The SRF of inductors decreases with increasing the inductor size while the L increases with the inductor size. The smallest inductors of $1.0\times0.5\times0.5mm^3$ exhibited the L of 12 nH, SRF of 3.6 GHz, and the quality factor of 67 near the frequency of 1.1 GHz. The calculated data predicted the high-frequency data of the L, and Q of the developed inductors well.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.645-648
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• 1998

We used a three-dimensional inductance extraction program, Fasthenry for optimal design of the spiral inductors on silicon substrate. The inductance and quality factor of the spiral inductors with various design parameters were calculated so that the optimal parameter value was determined. The spiral inductors then were fabricated using different foundary processes and were measured using the network analyzer and microwave probes. The pad and other parasitics of measurement system were de-embedded using the y-parameter calibration technique. the inductors fabricated using the LG 0.8um process and HP 0.5um process showed the quality factor of 5.8 and 3, respectively. Finally the equivalent circuit farameters of the spiral inductors on silicon substrate were extracted from the measurement data using the matlab.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.890-893
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• 2004

In this study, Spiral inductors on the $SiO_2/Si$(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of 2 ${\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to 60${\mu}m$ and from 20 to 70 ${\mu}m$, respectively. Inductance and Q factor dependent on the frequency were investigated to analyze performance of spiral inductors.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2245-2247
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• 2000

The purpose of this paper is to demonstrate for the design and the fabrication of suspended spiral inductors using the micromachining technology. Also. the characteristics of spiral inductors with substrate lossless are simulated by lumped-element model. The absence of the lossy silicon substrate after micormachining results in significantly improved quality factor characteristics of 14. Micromachined spiral inductors have the improvement of a quality factor of about 60% than spiral inductors on silicon which is not micromachined.

• Journal of Power Electronics
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• v.15 no.2
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• pp.327-337
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• 2015

This study discusses the design of a parallel-operated DC-DC single-ended primary-inductor converter (SEPIC) for low-voltage application and current sharing with a constant output voltage. A coupled inductor is used for parallel-connected SEPIC topology. Generally, two separate inductors require different ripple currents, but a coupled inductor has the advantage of using the same ripple current. Furthermore, tightly coupled inductors require only half of the ripple current that separate inductors use. In this proposed work, tightly coupled inductors are used. These produce an output that is more efficient than that from separate inductors. Two SEPICs are also connected in parallel using the coupled inductors with a single common controller. An analog control circuit is designed to generate pulse width modulation (PWM) signals and to fulfill the closed-loop control function. A stable output current-sharing strategy is proposed in this system. An experimental setup is developed for a 18.5 V, 60 W parallel SEPIC (PSEPIC) converter, and the results are verified. Results indicate that the PSEPIC provides good response for the variation of input voltage and sudden change in load.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.3
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• pp.454-459
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• 2007

In this work, micro-scale, high-performance solenoid-type RF chip inductors utilizing amorphous $Al_2O_3$ core material were investigated. The size of the chip inductors was $0.86{\times}0.46{\times}0.45mm^3$ and copper(Cu) wire with $27{\mu}m$ diameter was used as the coil. High frequency characteristics of the inductance(L), quality factor(Q), impedance(Z), and equivalent circuit parameters of the RE chip inductors were measured and analyzed using an RF impedance/material analyzer(HP4291B with HP16193A test fixture). It was observed that the RF chip inductors with the number of turns of 9 to 12 have the inductance of 21 to 34nH and exhibit the self-resonant frequency(SRF) of 5.7 to 3.7GHz. The SRF of inductors decreases with increasing the inductance and inductors have the quality factor of 38 to 49 in the frequency range of 900MHz to 1,7GHz.