• Journal of information and communication convergence engineering
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• 제4권2호
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• pp.88-91
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• 2006

In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the S11-parameter of the inductor.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.91-92
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• 2005

The electromagnetic coupling effect in standard CMOS process is simulated and evaluated. EM coupling transfer characteristic between planar spiral inductors by isolation methode in standard CMOS have simulated and measured. Measurement results show that suppression of EM coupling effect by ground guardring. The evaluated structures are fabricated 1P5M(one poly, five metal) 0.25um standard CMOS process. These measurement results provide a isolation design guidelines in standard CMOS process for Rf coupling suppression.

• 한국전기전자재료학회논문지
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• 제16권1호
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• pp.83-87
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• 2003

In the present paper we suggested a parallel branch structure of aluminum spiral inductor for the use of RF integrated circuit at 1∼3 GHz. The inductor was implemented on p-type silicon wafer (5∼15Ω-cm) under the standard CMOS process and it showed a enhanced qualify(Q) factor by more than 10 % with no degradation of inductance. The effect of the structure modification on the Q factor and the inductance was scrutinized comparing with conventional spital inductors

• E2M - 전기 전자와 첨단 소재
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• 제10권8호
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• pp.813-818
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• 1997

In this study the thin film air core and magnetic core inductors consisting of planar coil and/or CoNbZr amorphous magnetic layers on a Si substrate were fabricated as spiral type by using rf magnetron sputtering and wet etching methods. The etchant solution was achieved by iron chloride solution(17.5 mol%) mixed with HF (20 mol%) during 150 sec which etched Cu films and CoNbZr/Cu/CoNbZr multi-layer films. They were about 10${\mu}{\textrm}{m}$ of thickness and 10$\times$10 mm$^2$of size. The properties of thin film magnetic core inductor were 400 nH of Q value at 10 MHz and the resonance frequency was about 300 MHz.

• Transactions on Electrical and Electronic Materials
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• 제6권6호
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• pp.256-261
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• 2005

This paper presents that the modeling to predict the characteristics with respect to the performance of solenoid embedded inductors manufactured by LTCC process via the nonlinear regression model based on the quasi-Newton method. In order to reduce the runs, the design of experiments (DOE) was used to generate the design space. The nonlinear process models were constructed by the piecewise regression model based on the quasi-Newton method for estimating the model coefficient with the break point on the statistical confidence intervals. Those models were verified by the model accuracy checking based on the assumption statistically.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.891-892
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• 2006

An obstacle is an element for power to small and slim the existing portable communication set. Developed Inductor for Chip-type electric power in needs to solve this. Stack applied Process, and used gap of a magnetic path, and made a height of an element to 1.0T or below, and this development commodity did product for saturation prevention to materials of silver. Saturation current characteristic of Chip-type inductor was low compare with winding-type inductors, but bulk against performance were had superior excellence. Chip-type inductor can raise performance per unit volume compared with the existing inductors at these papers. Therefore, acceleration can get growth of small and slim of a mobile product done, and expect.

• 전력전자학회논문지
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• 제25권5호
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• pp.343-349
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• 2020

This study proposes a new single inductor converter for DC grid systems. A conventional system is composed of two independent converters for controlling battery and load. This system is simple but it has two inductors that affect power density and efficiency. The proposed converter can reduce the number of inductors by integrating the two converters and relieve voltage stress on switches by using a battery switching cell. Accordingly, power density and efficiency can be improved using a single inductor and lower voltage-rated switches. A prototype of a 500 W converter is built, and each mode is experimented on to confirm the validity of the proposed converter.

• 한국전기전자재료학회논문지
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• 제15권1호
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• pp.85-92
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• 2002

In this study, we analyzed and experimented micro-strip line inductors and capacitors for a SAW duplexer, an important devise for mobile communication. For SAW duplexers, micro-strip line lumped elements must have small impedance values, below several tens of nH or several tens of pF, and a small area pattern. In this study, we performed theoretical analysis of flat line type, meander line type, and spiral line type inductors and interdigital capacitors on a LiTaO$_3$ Piezo-crystal. We proposed a measurement method to evaluate small values of lumped elements accurately with network analyzer. In experiments, we confirmed validity of the theoretical analysis method through fabrication and characterization of micro-strip line lumped elements. The analysis method in this paper can be applied to SAW duplexers well as other microwave devices.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권1호
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• pp.6-11
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• 2003

The multi layer spiral inductors, which enhance the quality factor Q of an inductor fabricated on the silicon substrate, has been designed using a TSMC CMOS 0.2sum 1-poly 5-metal layer technology. To investigate the performance of the designed inductors, a 2.5-dimensional field simulation tool(Momentum) is used. The simulation results show that the quality factor Q of the 5-metal inductor is improved 1.8 times over that of a convention31 spiral inductor at 2GHz for wireless LAN applications.

• Journal of Power Electronics
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• 제4권2호
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• pp.87-95
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• 2004

A new fast-response high-current clamp DC-DC converter circuit design is presented that will meet the requirements and features of the new generation of microprocessors and digital systems. The clamp in the proposed converter amplifies the current in case of severe load changes and is able to produce high slew rate of output current and capability to keep constant the output voltage. This proposed high-current clamp technique is theoretically loss less, low cost and easy to implement with simple control scheme. This is modified from a basic buck topology by replacing the output inductor with two magnetically coupled inductors. Inductors are difference in inductance, one has large inductance and other has small inductance. The inductor with small inductance will take over the output inductor during fast load transient. It speedup the output current slew rate and reduce the output voltage drop in the case of heavy burden load changes.