• Steel and Composite Structures
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• v.42 no.2
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• pp.277-288
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• 2022

A novel flat steel plate-concrete-corrugated steel plate (FS-C-CS) sandwich panel was proposed for resisting impact load. The failure mode, impact force and displacement response of the FS-C-CS panel under impact loading were studied via drop-weight impact tests. The combined global flexure and local indentation deformation mode of the FS-C-CS panel was observed, and three stages of impact process were identified. Moreover, the effects of corrugated plate height and steel plate thickness on the impact responses of the FS-C-CS panels were quantitatively analysed, and the impact resistant performance of the FS-C-CS panel was found to be generally improved on increasing corrugated plate height and thickness in terms of smaller deformation as well as larger impact force and post-peak mean force. The Finite Element (FE) model of the FS-C-CS panel under impact loading was established to predict its dynamic response and further reveal its failure mode and impact energy dissipation mechanism. The numerical results indicated that the concrete core and corrugated steel plate dissipated the majority of impact energy. In addition, employing end plates and high strength bolts as shear connectors could prevent the slip between steel plates and concrete core and assure the full composite action of the FS-C-CS panel.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.11
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• pp.144-150
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• 2019

In this study, resistance spot welding was performed using a high tensile steel plate SGAFC 780. The shear tensile strength, fracture profile, nugget diameter, and simulation were compared according to the conditions. After the nugget diameter calibration, the minimum diameter of welding was more than 4.3mm when the welding current was 8kVA or more. At 9kVA and above 10kVA, the minimum nugget diameter of 4.3mm was satisfied. On the other hand, due to the high current and time, the fly phenomenon occurred and the deep indentation remained. An evaluation of the weldability confirmed that there was an interval that was evaluated as weld failure due to the creep phenomenon, which satisfied the tensile shear strength and minimum nugget diameter. On the other hand, areas that have sufficient load bearing capacity even when drift has occurred were also identified. The simulation results show that the error rate was less than 4.2% when comparing the nugget diameter in the simulation and the experimental results in the appropriate weld zone, and confirmed the reliability of the simulation.

• The korean journal of orthodontics
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• v.30 no.4 s.81
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• pp.453-465
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• 2000

The purpose of this study was to investigate the change of mechanical properties, surface topography and frictional force of various nickel titanium wires after recycling. Three types of nickel-titanium wires and one type of stainless steel wire were divided to three groups: as-received condition(T0:control group), treated in artificial saliva for four weeks(T1) and autoclaved after being treated in artificial saliva(T2). Some changes were observed for the selected mechanical properties in tensile test, surface topography by means of SEM and 3D profilogram, and frictional coefficient. The findings suggest that: 1. Nickel-titanium wires demonstrated no statistically significant differences in maximum tensile strength, elongation rate and modulus of elasticity, but stainless steel wire demonstrated statistically significant differences in maximum tensile strength, elongation rate and modulus of elasticity between the groups(p<0.05). 2. NiTi, Optimalloy, Stainless Steel wires demonstrated increased pitting and corrosion in SEM finding. 3. Recycled NiTi, Optimalloy and stainless steel wires demonstrated significantly greater surface roughness(Ra and Rq) through 3D profilogram when compared with the control wires(p<0.05), but Sentalloy didn't demonstrate significant difference. 4. Recycled NiTi, Optimalloy and stainless steel wires demonstrated significantly greater maximum frictional coefficient when compared with the control wires(p<0.05), but Sentalloy didn't demonstrate significant difference The changes of surface roughness and frictional coefficient in NiTi and Optimalloy had no clinical implication. Consequently recycled nickel titanium wires demonstrated no clinical problem in tensile properties, surface topography and frictional coefficient.

• Journal of Korean Society of Water and Wastewater
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• v.37 no.4
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• pp.215-229
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• 2023

In this study, non-destructive technologies that can be applied to evaluate the integrity of valve materials, safety against internal pressure caused by corrosion, and the blocking function of large-diameter water valves during operation without requiring specimen collection or manpower entering the inside of the valve were tested to assess the reliability of the technologies and their suitability for field application. The results showed that the condition of the graphite structure inside the valve body can be evaluated directly through the optical microscope in the field without specimen collection for large-diameter water butterfly valves, and the depth of corrosion inside the valve body can be determined by array ultrasound and the tensile strength can be measured by instrumented indentation test. The reliability of each of these non-destructive techniques is high, and they can be widely used to evaluate the condition of steel or cast iron pipes that are significantly smaller in thickness than valves. Evaluation of blocking function of the valves with mixed gas showed that it can be detected even when a very low flow rate of mixed gas passes through the disk along with the water flow. Finally, as a result of evaluating the field applicability of non-destructive technologies for three old butterfly valves installed in the US industrial water pipeline, it was found that it is possible to check the material and determine the suitability of large-diameter water valves without taking samples, and to determine the corrosion state and mechanical strength. In addition, it was possible to evaluate safety through the measurement results, and it is judged that the evaluation of the blocking function using mixed gas will help strengthen preventive response in the event of an accident.

• Journal of Navigation and Port Research
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• v.28 no.6
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• pp.481-489
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• 2004

Ship collisions and grounding continue to occur regardless of continuous efforts to prevent such accidents. With the increasing demand for safety at sea and for protection of the environment, it is of crucial importance to be able to reduce the probability of accidents, assess their consequences and ultimately minimize or prevent potential damages to the ships and the marine environment. Numerical simulations for actual collision problem are conducted with a special attention with respect to finite element size, fracture criteria and material properties, which require a careful consideration to improve the accuracy. A parametric analysis varying colliding speed, angle, design loading condition is conducted using nonlinear finite element analysis method for 46,00 dwt Product/chemical carrier. The relationship between the absorbed energy and indentation are derived quantitatively using the insights observed from this study, and a novel design concept for assessing the anti-collision performance are proposed.

• Journal of Korean Ophthalmic Optics Society
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• v.14 no.1
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• pp.57-62
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• 2009

Purpose: TiN films were deposited on sus304 by unbalanced magnetron sputtering system which was designed and developed as unbalancing the strength of the magnets in the magnetron electrode. The color and hardness of deposited TiN films was investigated. Methods: The cross sections of deposited films on silicon wafer were observed by SEM to measure the thickness of the films, the components of the surface of the films were identified by XPS, the components of the inner parts of the films were observed by XPS depth profiling. XPS high resolution scans and curve fittings of deposited films were performed for quantitative chemical analysis, Vickers micro hardness measurements of deposited films were performed with a nano indenter equipment. Results: The colors of deposited films gradually changed from light gold to dark gold, light violet, and indigo color with increasing of the thickness. It could be seen that the color change come from the composite change of three compound,$TiO_{x}N_{y}$, $TiO_2$, TiN. Especially, the composite change of$TiO_{x}N_{y}$ compound was thought to affect the color change with respect to thickness. Conclusions: Deposited films had lower than the value of general TiN film in Vickers hardness, which was caused by mixing three TiN, $TiO_2$,$TiO_{x}N_{y}$ compound in the deposited films. The increasing and decreasing of micro hardness with respect to thickness was thought to have something to do with the composite of TiN in the films.