• Title/Summary/Keyword: Impurity concentration

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Removal of Metallic Impurity at Interface of Silicon Wafer and Fluorine Etchant (실리콘기판과 불소부식에 표면에서 금속불순물의 제거)

  • Kwack, Kwang-Soo;Yoen, Young-Heum;Choi, Seung-Ok;Jeong, Noh-Hee;Nam, Ki-Dae
    • Journal of the Korean Applied Science and Technology
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    • v.16 no.1
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    • pp.33-40
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    • 1999
  • We used Cu as a representative of metals to be directly adsorbed on the bare Si surface and studied its removal DHF, DHF-$H_2O_2$ and BHF solution. It has been found that Cu ion in DHF adheres on every Si wafer surface that we used in our study (n, p, n+, p+) especially on the n+-Si surface. The DHF-$H_2O_2$ solution is found to be effective in removing metals featuring high electronegativity such as Cu from the p-Si and n-Si wafers. Even when the DHF-$H_2O_2$ solution has Cu ions at the concentration of 1ppm, the solution is found effective in cleaning the wafer. In the case the n+-Si and p+-Si wafers, however, their surfaces get contaminated with Cu When Cu ion of 10ppb remains in the DHF-$H_2O_2$ solution. When BHF is used, Cu in BHF is more likely to contaminate the n+-Si wafer. It is also revealed that the surfactant added to BHF improve wettability onto p-Si, n-Si and p+-Si wafer surface. This effect of the surfactant, however, is not observed on the n+-Si wafer and is increased when it is immersed in the DHF-$H_2O_2$ solution for 10min. The rate of the metallic contamination on the n+-Si wafer is found to be much higher than on the other Si wafers. In order to suppress the metallic contamination on every type of Si surface below 1010atoms/cm2, the metallic concentration in ultra pure water and high-purity DHF which is employed at the final stage of the cleaning process must be lowered below the part per trillion level. The DHF-$H_2O_2$ solution, however, degrades surface roughness on the substrate with the n+ and p+ surfaces. In order to remove metallic impurities on these surfaces, there is no choice at present but to use the $NH_4OH-H_2O_2-H_2O$ and $HCl-H_2O_2-H_2O$ cleaning.

Development of $O_2$ Purifier by Pressure Swing Adsorption Process (고순도 산소 생산을 위한 산소 정제 PSA 공정 개발)

  • Lee Chang-Ha;Jee Jeong-Geun;Lee Sang-Jin;Moon Heung-Man;Lee Sang-Hoon
    • Journal of the Korean Institute of Gas
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    • v.8 no.1 s.22
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    • pp.37-47
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    • 2004
  • Pressure swing adsorption (PSA) process using CMS as an oxygen purifier was developed to produce high purity oxygen over $99\%$ with high productivity. The cyclic performances such as purity, recovery, and productivity of PSA process were compared experimentally and theoretically under the non-isothermal condition. A binary ($O_2$/Ar 95:5 vol.$\%$) and two kinds of ternary ($O_2/Ar/N_2$ 95:4:1 and 90:4:6 vol.$\%$) mixtures were used as feed gases. The developed process with the consecutive two blowdown steps produced the oxygen with $99.8\%$ purity and $56\%$ recovery from $95\%$ oxygen containing feed. However, in the feed with $90\%$ oxygen, the $O_2$ Purity was decreased up to $97.3\%$. In addition, because the cyclic performances of the suggested process was significantly affected by the diffusion rate, the non-isothermal model with the the modified LDF model was applied for the process simulation. The concentration-dependent rate parameter of the applied rate model was incorporated with the Langmuir isotherm.

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Luminescence properties of $(Y,\;Zn)_2O_3$:$Eu^{3+}$ red phosphor as the effect of Zn ion (Zn ion의 영향에 따른 $(Y,\;Zn)_2O_3$:$Eu^{3+}$ 적색 형광체의 발광특성)

  • Song, Y.H.;Moon, J.W.;Park, W.J.;Yoon, D.H.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.18 no.6
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    • pp.253-257
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    • 2008
  • To enhance the luminescence properties, the red phosphor composed of $(Y,\;Zn)_2O_3$:$Eu^{3+}$ as doping concentration of Zn ion is synthesized at $1200^{\circ}C$ for 6 hrs in air atmosphere by conventional solid reaction method. As a result of the red phosphor $(Y,\;Zn)_2O_3$:$Eu^{3+}$ is measured X-ray diffraction (XRD), The main peak is nearly corresponded to the same as JCPDS card (No. 41-1105). When the doping concentration of Zn ion is more than 5 mol%, However, the ZnO peak is showed by XRD analysis. Therefore, when the doping concentration of Zn ion is less than 5 mol%, the Zn ion is well mixed in $Y_2O_3$ structure without the impurity phases. The photoluminescence (PL) properties is shown as this phosphor is excited in 254 nm region and the highest emission spectra of $(Y,\;Zn)_2O_3$:$Eu^{3+}$ has shown in 612 nm region because of a typical energy transition ($^5D_0{\rightarrow}^7F_2$) of $Eu^{3+}$ ion. As the doping concentration of Zn ion is more than 10 mol%, the emission peak is suddenly decreased. when the highest emission peak as doping concentration of Zn ion is shown, the composition of this phosphor is $(Y_{0.95},\;Zn_{0.05})_2O_3$:$Eu^{3+}_{0.075}$ and the particle size analyzed by FE-SEM is confirmed from 0.4 to $3{\mu}m$.

Fabrications and Analysis of Schottky Diode of Silicon Carbide Substrate with novel Junction Electric Field Limited Ring (새로운 전계 제한테 구조를 갖는 탄화규소 기판의 쇼트키 다이오드의 제작과 특성 분석)

  • Cheong Hui-Jong;Han Dae-Hyun;Lee Yong-Jae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.7
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    • pp.1281-1286
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    • 2006
  • We have used the silicon-carbide(4H-SiC) instead of conventional silicon materials to develope of the planar junction barrier schottky rectifier for ultra high breakdown voltage(1,200 V grade). The substrate size is 2 inch wafer, Its concentration is $3*10^{18}/cm^{3}$ of $n^{+}-$type, thickness of epitaxial layer $12{\mu}m$ conentration is $5*10^{15}cm^{-3}$ of n-type. The fabticated devices are junction barrier schottky rectifier, The guard ring for improvement of breakdown voltage is designed by the box-like impurity of boron, the width and space of guard ring was designed by variation. The contact metals to rectify were used by the $Ni(3,000\:{\AA})/Au(2,000\:{\AA})$. As a results, the on-state voltage is 1.26 V, on-state resistance is $45m{\Omega}/cm^{3}$, maximum value of improved reverse breakdown voltage is 1180V, reverse leakage current density is $2.26*10^{-5}A/CM^{3}$. We had improved the measureme nt results of the electrical parameters.

Synthesis of Nano-Sized Y3Al5O12:Ce3+ Phosphors Prepared by High Energy Beads Milling Process and Their Luminescence Properties

  • Song, Hee-Jo;Kim, Dong-Hoe;Park, Jong-Hoon;Han, Byung-Suh;Hong, Kug-Sun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.386-386
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    • 2012
  • For white light emitting diode (LED) applications, it has been reported that Y3Al5O12:Ce3+ (YAG:Ce) in nano-sized phosphor performs better than it does in micro-sized particles. This is because nano-sized YAG:Ce can reduce internal light scattering when coated onto a blue LED surface. Recently, there have been many reports on the synthesis of nano-sized YAG particles using bottom-up method, such as co-precipitation method, sol-gel process, hydrothermal method, solvothermal method, and glycothermal method. However, there has been no report using top-down method. Top-down method has advantages than bottom-up method, such as large scale production and easy control of doping concentration and particle size. Therefore, in this study, nano-sized YAG:Ce phosphors were synthesized by a high energy beads milling process with varying beads size, milling time and milling steps. The beads milling process was performed by Laboratory Mill MINICER with ZrO2 beads. The phase identity and morphology of nano-sized YAG:Ce were characterized by X-ray powder diffraction (XRD) and field-emission scanning electron microscopy (FESEM), respectively. By controlling beads size, milling time and milling steps, we synthesized a size-tunable and uniform nano-sized YAG:Ce phosphors which average diameters were 100, 85 and 40 nm, respectively. After milling, there was no impurity and all of the peaks were in good agreement with YAG (JCPDS No. 33-0040). Luminescence and quantum efficiency (QE) of nano-sized YAG:Ce phosphors were measured by fluorescence spectrometer and QE measuring instrument, respectively. The synthesized YAG:Ce absorbed light efficiently in the visible region of 400-500 nm, and showed single broadband emission peaked at 550 nm with 50% of QE. As a result, by considering above results, high energy beads milling process could be a facile and reproducible synthesis method for nano-sized YAG:Ce phosphors.

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A study on the surface characteristics of diamond wire-sawn silicon wafer for photovoltaic application (다이아몬드 코팅 와이어로 가공된 태양전지용 실리콘 웨이퍼의 표면 특성에 관한 연구)

  • Lee, Kyoung-Hee
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.21 no.6
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    • pp.225-229
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    • 2011
  • Most of the silicon cutting methods using the multi-wire with the slurry injection have been used for wafers of the crystalline solar cell. But the productivity of slurry injection cutting type falls due to low cutting speeds. Also, the direct contact with the metal wire and silicon block increases the concentration of metallic impurities in the wafer's surface. In addition, the abrasive silicon carbide (SiC) generates pollutants. And production costs are rising because it does not re-use the worn wire. On the other hand, the productivity of the cutting method using the diamond coated wire is about 2 times faster than the slurry injection cutting type. Also, the continuous cutting using the used wire of low wear is possible. And this is a big advantage for reduced production costs. Therefore, the cutting method of the diamond coated wire is more efficient than the slurry injection cutting technique. In this study, each cutting type is analyzed using the surface characteristics of the solar wafer and will describe the effects of the manufacturing process of the solar cell. Finally, we will suggest improvement methods of the solar cell process for using the diamond cutting type wafer.

Separatipon of Oryzanol from the Refining By-Product of Rice Bran Oil (미강유 정제 부산물로부터 오리자놀 분리)

  • Kim, In-Hwan;Kim, Chul-Jin
    • Korean Journal of Food Science and Technology
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    • v.23 no.1
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    • pp.76-80
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    • 1991
  • To isolate oryzanol from the by-product of rice bran oil refinning, experiment of solvent fractional crystallization was carried out at various conditions with the dark oil obtained by acidifying the soap stock of micella refinning process and the pitch obtained from vacuum distillation of the dark oil. The impurity interfering the crystallization process such as waxes can be removed as precipitates by cooling the 1:1 mixtrue of acetone and dark oil to $0^{\circ}C$, From the dewaxed dark oil, oryzanol concentrate with 51.3% purity was obtained by fractional crystallization at$0^{\circ}C$ with the mixture of 8 part volume of hexane and 1 part of the dewaxed dark oil. The concentrate was recrystallized at room temperature with 20 part volume of methanol to yield oryzanol crystal of 98.3% purity. The optimum condition of vacuum distillation was temperature of $180^{\circ}C\;at\;0.2{\sim}0.4\;torr$ with 2% steam sparging. At this condition, the free fatty acid in the dark oil was removed as distillate without thermal deomposition to yield 82.3% of oryzanol as the pitch of 27.3% purity. After concentration from the pitch with 20 part volume of hexane to yield yellow powder of 75.4% purity, the yellow powder was recrystallized in methanol at room temperature to obtain the crystal containing 99.0% oryzanol. The overall oryzanol yield from the dark oil and the pitch was 9.5 and 28.5%, respectively. The change of the composition of sterols and triterpenoid alcohols in the compounds isolated during fractionation was analyzed by GC-MS.

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A Czochralski Process Design for Si-single Crystal O2 Impurity Minimization with Pulling Rate, Rotation Speed and Melt Charge Level Optimization (Pulling rate, rotation speed 및 melt charge level 최적화에 의한 쵸크랄스키 공정 실리콘 단결정의 O2 불순물 최소화 설계)

  • Jeon, Hye Jun;Park, Ju Hong;Artemyev, Vladimir;Hwang, Seon Hee;Song, Su Jin;Kim, Na Yeong;Jung, Jae Hak
    • Korean Chemical Engineering Research
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    • v.58 no.3
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    • pp.369-380
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    • 2020
  • Most mono-crystalline silicon ingots are manufactured by the Czochralski (Cz) process. But If there are oxygen impurities, These Si-ingot tends to show low-efficiency when it is processed to be solar cell substrate. For making single-crystal Si- ingot, We need Czochralski (Cz) process which melts molten Si and then crystallizing it with seed of single-crystal Si. For melts poly Si-chunk and forming of single-crystalline Si-ingot, the heat transfer plays a main role in the structure of Cz-process. In this study to obtain high-quality Si ingot, the Cz-process was modified with the process design. The crystal growth simulation was employed with pulling rate and rotation speed optimization. Studies for modified Cz-process and the corresponding results have been discussed. The results revealed that using crystal growth simulation, we optimized the oxygen concentration of single crystal silicon by the optimal design of the pulling rate, rotation speed and melt charge level of Cz-process.

PEMOCVD of Ti(C,N) Thin Films on D2 Steel and Si(100) Substrates at Low Growth Temperatures

  • Kim, Myung-Chan;Heo, Cheol-Ho;Boo, Jin-Hyo;Cho,Yong-Ki;Han, Jeon-Geon
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.211-211
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    • 1999
  • Titanium nitride (TiN) thin films have useful properties including high hardness, good electrical conductivity, high melting point, and chemical inertness. The applications have included wear-resistant hard coatings on machine tools and bearings, decorative coating making use of the golden color, thermal control coatings for widows, and erosion resistant coatings for spacecraft plasma probes. For all these applications as feature sizes shrink and aspect ratios grow, the issue of good step coverage becomes increasingly important. It is therefore essential to manufacture conformal coatings of TiN. The growth of TiN thin films by chemical vapor deposition (CVD) is of great interest for achieving conformal deposition. The most widely used precursor for TiN is TiCl4 and NH3. However, chlorine impurity in the as-grown films and relatively high deposition temperature (>$600^{\circ}C$) are considered major drawbacks from actual device fabrication. To overcome these problems, recently, MOCVD processes including plasma assisted have been suggested. In this study, therefore, we have doposited Ti(C, N) thin films on Si(100) and D2 steel substrates in the temperature range of 150-30$0^{\circ}C$ using tetrakis diethylamido titanium (TDEAT) and titanium isopropoxide (TIP) by pulsed DC plamsa enhanced metal-organic chemical vapor deposition (PEMOCVD) method. Polycrystalline Ti(C, N) thin films were successfully grown on either D2 steel or Si(100) surfaces at temperature as low as 15$0^{\circ}C$. Compositions of the as-grown films were determined with XPS and RBS. From XPS analysis, thin films of Ti(C, N) with low oxygen concentration were obtained. RBS data were also confirmed the changes of stoichiometry and microhardness of our films. Radical formation and ionization behaviors in plasma are analyzed by optical emission spectroscopy (OES) at various pulsed bias and gases conditions. H2 and He+H2 gases are used as carrier gases to compare plasma parameter and the effect of N2 and NH3 gases as reactive gas is also evaluated in reduction of C content of the films. In this study, we fond that He and H2 mixture gas is very effective in enhancing ionization of radicals, especially N resulting is high hardness. The higher hardness of film is obtained to be ca. 1700 HK 0.01 but it depends on gas species and bias voltage. The proper process is evident for H and N2 gas atmosphere and bias voltage of 600V. However, NH3 gas highly reduces formation of CN radical, thereby decreasing C content of Ti(C, N) thin films in a great deal. Compared to PVD TiN films, the Ti(C, N) film grown by PEMOCVD has very good conformability; the step coverage exceeds 85% with an aspect ratio of more than 3.

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Applications of XPS and SIMS for the development of Si quantum dot solar cell

  • Kim, Gyeong-Jung;Hong, Seung-Hwi;Kim, Yong-Seong;Lee, U;Kim, Yeong-Heon;Seo, Se-Yeong;Jang, Jong-Sik;Sin, Dong-Hui;Choe, Seok-Ho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.297-297
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    • 2010
  • Precise control of the position and density of doping elements at the nanoscale is becoming a central issue for realizing state-of-the-art silicon-based optoelectronic devices. As dimensions are scaled down to take benefits from the quantum confinement effect, however, the presence of interfaces and the nature of materials adjacent to silicon turn out to be important and govern the physical properties. Utilization of visible light is a promising method to overcome the efficiency limit of the crystalline Si solar cells. Si quantum dots (QDs) have been proposed as an emission source of visible light, which is based on the quantum confinement effect. Light emission in the visible wavelength has been reported by controlling the size and density of Si QDs embedded within various types of insulating matrix. For the realization of all-Si QD solar cells with homojunctions, it is prerequisite not only to optimize the impurity doping for both p- and n-type Si QDs, but also to construct p-n homojunctions between them. In this study, XPS and SIMS were used for the development of p-type and n-type Si quantum dot solar cells. The stoichiometry of SiOx layers were controlled by in-situ XPS analysis and the concentration of B and P by SIMS for the activated doping in Si nano structures. Especially, it has been experimentally evidenced that boron atoms in silicon nanostructures confined in SiO2 matrix can segregate into the Si/$SiO_2$ interfaces and the Si bulk forming a distinct bimodal spatial distribution. By performing quantitative analysis and theoretical modelling, it has been found that boron incorporated into the four-fold Si crystal lattice can have electrical activity. Based on these findings, p-type Si quantum dot solar cell with the energy-conversion efficiency of 10.2% was realized from a [B-doped $SiO_{1.2}$(2 nm)/$SiO_2(2\;nm)]^{25}$ superlattice film with a B doping level of $4.0{\times}10^{20}\;atoms/cm^2$.

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