• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1626-1631
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• 2007

The purpose of the study is to simulate the displacement of the LCD glass during process of a large size imprint. During this process, a small temperature variation makes thermal stress, which causes the horizontal variation of mold and glass. During alignment process to fix the LCD glass on a alignment stage, the vertical displacement is made by the absorption pressure and the shear stress. This study simulates the horizontal displacement of mold and glass due to temperature variation, the vertical displacement depending on the shape of absorption surface fixing the LCD glass in the alignment process, and the horizontal and vertical displacement which occurs in the LCD glass at the alignment process. Algor which is a FEM code for a framework simulation was applied. Temperature variation above ${\pm}$ $0.1^{\circ}C$ on mold and glass causes the horizontal displacement of 150nm due to thermal expansion. The vertical displacement due to the circular is ten times of the case of rectangular absorption nozzle. The displacement of the LCD glass in the alignment process is about 49nm.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.364-367
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• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.1 s.244
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• pp.42-51
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• 2006

An indentation method to determine equi-biaxial residual stress is proposed by examining the data from the incremental plasticity theory based finite element analyses. We first select optimal normalized-parameters, which are minimally affected by indentation depth and material properties. Numerical linear regressions of obtained data exhibit that maximum load and contact area of imprint are the main parameters measuring the residual stress. The proposed indentation approach provides a substantial enhancement in accuracy compared with the prior methods.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1119-1122
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• 2004

In the UV-NIL process using an elementwise patterned stamp (EPS), which includes channels formed to separate each element with patterns, low-viscosity resin droplets with a nano-liter volume are dispensed on all elements of the EPS. Following pressing of the EPS, the EPS is illuminated with UV light to cure the resin; and then the EPS is separated from several thin patterned elements on a wafer. Experiments on UV-NIL were performed on an EVG620-NIL. 50 － 70 nm features of the EPS were successfully transferred to 4 in. wafers. Especially, the wafer deformation during imprint was analyzed using the finite element method (FEM) in order to study the effect of the wafer deformation on the UV-NIL using EPS.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.502-505
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• 2007

PMMA has been extensively adopted in Nano Imprint Lithography(NIL). PMMA nano-structures experience severe mechanical load and deformation during NIL process, and understanding its mechanical behavior is very important in designing and optimizing NIL process. One of the most promising techniques for characterizing the mechanical behavior of nano structures is nano pillar compression test. In this study, the mechanical behaviors of PMMA pillars during compression test are analyzed using Molecular Dynamics. Two methods for simulation of PMMA nano pillars are proposed. The stress-strain relationship of nano-scale PMMA structure is obtained based on CVFF(Covalent Valence Force Fields) potential and the dependency of the applied strain rate on the stress-strain relationship is analyzed. The obtained stress-strain relationships can be useful in simulating nano-scale PMMA structures using Finite Element Method(FEM) and understanding the experimental results obtained by compression test of PMMA nano pillars.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.677-682
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• 2007

Recently, a precision stage is widely used in the fields of the nano technology. In this paper, the precision stage which consists of linear motor, vision system, light source system and controller, is designed and developed for nano imprint machine. Stiffness design considering resonance frequency is important for the precision stage. A virtual machine simulation is useful for machine development the early design stage. Kinematic and dynamic simulations of XYZ stage are performed. To consider the resonance frequency and vibration effects flexible multibody dynamics are utilized with FE modeling of the structural components.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.104-109
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• 2008

Nowadays, the researches for improving LCD manufacturing process and reducing cost are getting accelerated and additionally new types of process are widely developed. In this situation, APEM(Anti Photo Exposure Method) which does not need photo-lithography is realized as one of possible alternative of LCD process. APEM makes LCD pattern by stamping and it can reduce the process cost and process time because of its simplicity. But optical alignment between pattern glass and target glass is very critical fact to realize the precise patterns. So, the analysis of deflection of large size of glass is carried out and design of experiment method is applied for optimal design of jig.

• Journal of the Korean Vacuum Society
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• v.14 no.1
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• pp.35-39
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• 2005

In the UV-NIL process using an elementwise patterned stamp (EPS), which includes channels formed to separate each element with patterns, low-viscosity resin droplets with a nano-liter volume are dispensed on all elements of the EPS. Following pressing of the EPS, the EPS is illuminated with UV-light to cure the resin; and then the EPS is separated from several thin patterned elements on a wafer. Experiments on UV-NIL were performed on an EVG620-NIL. 50 - 100nm features of the EPS with 3m channels were successfully transferred to 4 in. wafers. Especially, the wafer deformation during imprint was analyzed using the finite element method (FEM) in order to study the effect of the wafer deformation on the UV-NIL using EPS.