• Title/Summary/Keyword: Image Inspection System

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Calibration of Detection System of Crack in Concrete Structure by Using Image Processing Technology

  • Kim, Su-Un;Shin, Sung-Woo;Park, Jeong-Hak;Choi, Man-Yong
    • Journal of the Korean Society for Nondestructive Testing
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    • v.31 no.6
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    • pp.626-634
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    • 2011
  • The investigation of concrete structure typically relies on visual inspection which is one of the basic inspection techniques. Image processing techniques play a crucial role in the growing field of automatic surface inspection technique. However, kinds of inspection equipment, environmental condition and detection algorithm have much influence on the reliability of inspection result. This paper proposes a verification method and testing procedure for the reliability of inspection results and surveys characteristics of image acquisition systems and crack inspection algorithms.

The development of product inspection X-ray DR image processing system using intensifying screen (형광지를 이용한 물품검사 X-선 DR 영상처리 시스템 개발)

  • Park, Mun-kyu;Moon, Ha-jung;Lee, Dong-hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.7
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    • pp.1737-1742
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    • 2015
  • In the industrial field for product inspection needs not only on the surface of the product but also the internal components defect inspection. Generally, optical inspection is mainly used for item inspection from production process. However, this is only to check defect of surface it is difficult to perform inspection of goods internal. To overcome these limitations, Instead of optical device by using the portable X- ray DR image acquisition device system developed to obtain an image in real time at the same time and determine product defects. After obtaining the X- ray image, the inspection product within error range is passed after machine image processing. Also, the results and numbers are stored by users.

Automatic Extraction of Component Window for Auto-Teaching of PCB Assembly Inspection Machines (PCB 조립검사기의 자동티칭을 위한 부품윈도우 자동추출 방법)

  • Kim, Jun-Oh;Park, Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.16 no.11
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    • pp.1089-1095
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    • 2010
  • We propose an image segmentation method for auto-teaching system of PCB (Printed Circuit Board) assembly inspection machines. The inspection machine acquires images of all components in PCB, and then compares each image with its standard image to find the assembly errors such as misalignment, inverse polarity, and tombstone. The component window that is the area of component to be acquired by camera, is one of the teaching data for operating the inspection machines. To reduce the teaching time of the machine, we newly develop the image processing method to extract the component window automatically from the image of PCB. The proposed method segments the component window by excluding the soldering parts as well as board background. We binarize the input image by use of HSI color model because it is difficult to discriminate the RGB colors between components and backgrounds. The linear combination of the binarized images then enhances the component window from the background. By use of the horizontal and vertical projection of histogram, we finally obtain the component widow. The experimental results are presented to verify the usefulness of the proposed method.

Scientific Inspection Method of PC Box Bridges Using Remote Control Tarantula Robot (원격제어 로봇을 이용한 PSC Box교량 내부 점검방법)

  • Lee, Byeong-Ju;Shin, Jae-In;Seo, Jin-Won;Lee, Ji-Yeong;Park, Yeong-Ha
    • Proceedings of the Korea Concrete Institute Conference
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    • 2009.05a
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    • pp.561-562
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    • 2009
  • The needs for inspection automation for more systematic and efficient maintenance were gradually increased by several inspectors and researchers. With the robotic and digital image processing technologies, in this paper, new inspection automation system were introduced and tested in the real PSC box crack inspection procedures The configuration and scheme of robotic inspection and digital image processing algorithms were represented. The designed robotic sensors and image processing system were tested and the feasibility and possibility of the robot based automatic inspection were approved in the real PSC box bridges.

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Used the Computer Vision System Develop of Algorithm for Aluminium Mill Strip Defect Inspection (컴퓨터 비젼 시스템을 이용한 알루미늄표면 검사 알고리즘 개발)

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    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.115-120
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    • 2000
  • This study is on the application the image processing algorithm for inspection of the aluminium mill strip surface defect. The image of surface defect data was obtained using the CCD camera with the digital signal board. The edge was found from the difference of pixel intensity between the normal image and defect image. Two step were taken to find the edge in the image processing algorithm. First, noise was removed by using the median filter in the image. Second, the edge was sharpened in detail by using the sharpening convolution filter in the image. Canny algorithm was used to defect the exact edge. The defect section was separated from the original image is to find the coordination point p1 and p2 which include the defect image

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PCB Defects Detection using Connected Component Classification (연결 성분 분류를 이용한 PCB 결함 검출)

  • Jung, Min-Chul
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.1
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    • pp.113-118
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    • 2011
  • This paper proposes computer visual inspection algorithms for PCB defects which are found in a manufacturing process. The proposed method can detect open circuit and short circuit on bare PCB without using any reference images. It performs adaptive threshold processing for the ROI (Region of Interest) of a target image, median filtering to remove noises, and then analyzes connected components of the binary image. In this paper, the connected components of circuit pattern are defined as 6 types. The proposed method classifies the connected components of the target image into 6 types, and determines an unclassified component as a defect of the circuit. The analysis of the original target image detects open circuits, while the analysis of the complement image finds short circuits. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.

Authentication Technologies of X-ray Inspection Image for Container Terminal Automation

  • Kim, Jong-Nam;Hwang, Jin-Ho;Ryu, Tae-Kyung;Moon, Kwang-Seok;Jung, Gwang-S.
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.1684-1688
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    • 2005
  • In this paper, authentication technologies for X-ray inspection images in container merchandises are introduced and a method of authentication for X-ray inspection images is proposed. Until now, X-ray images of container merchandises have been managed without any authentication of inspection results and environments, it means that there was no any action for protection of illegal copy and counterfeiting of X-ray images from inspection results. Here, authentication identifies that who did inspect container X-ray images and, whether the container X-ray images were counterfeited or not. Our proposed algorithm indicates to put important information about X-ray inspection results on an X-ray image without affecting quality of the original image. Therefore, this paper will be useful in determining an appropriate technology and system specification for authentication of X-ray inspection images. As a result of experiment, we find that the information can be embedded to X-ray image without large degradation of image quality. Our proposed algorithm has high detection ratio by Quality 20 of JPEG attack.

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Development of the Container Damage Inspection System (컨테이너 파손 검사장치의 개발)

  • Oh Jae Ho;Hong Seong Woo;Choi Gyu Jong;Kim Myong Ho;Ahn Doo Sung
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.1
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    • pp.82-88
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    • 2005
  • The damage inspection of container surface is performed by the expert inspectors at the container terminal gate of harbor. In this paper, we substitute the expert's capability with the damage inspection system using the artificial intelligent control algorithm and vision system, so we can improve the work environment and effectively decrease the inspection time and cost. Firstly, using six CCD cameras attached to the terminal gate, whole container is partially captured according to eleven sensors aligned with the entering direction of container. Captured partial images are inspected by the fuzzy system which the expert's technology is embedded. Next, we compose partial images to be a complete container image through the correlation coefficient method. Complete container image is saved to solve future troublesome problems. In this paper, the effectiveness of the proposed system was verified through the field test.

Development of Welding Quality Inspection System for RV Sinking Seat (RV 차량용 싱킹 시트의 용접 품질 검사 시스템 개발)

  • Yun, Sang-Hwan;Kim, Han-Jong;Kim, Sung-Gaun
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.1
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    • pp.75-80
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    • 2008
  • This paper presents a vision based autonomous inspection system for welding quality control of a RV sinking seat. In order to overcome the precision error that arises from a visible inspection by an operator in the manufacturing process of a RV sinking seat, the machine vision based welding quality control system is proposed. It consists of the CMOS camera and the NI vision system. The geometry of the welding bead, which is the welding quality criteria, is measured by using the captured image with a median filter applied on it. The image processing software for the system was developed using the NI LabVIEW software. The proposed welding quality inspection system for RV sinking seat was verified using experimentation.

The analysis and design of X-ray cross sectional imaging system for PCB solder joint inspection (PCB 납땜 검사를 위한 X선 단층 영상 시스템의 해석 및 설계)

  • 노영준;강성택;김형철;김성권
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10b
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    • pp.109-112
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    • 1996
  • The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

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