• The Bulletin of The Korean Astronomical Society
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• v.36 no.2
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• pp.116.1-116.1
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• 2011

L1448-MM, known as a class 0 YSO with a prominent outflow, was observed with the Photodetector Array Camera and Spectrometer (PACS) aboard Herschel Space Observatory by the key program, DIGIT (Dust, Ice, Gas in Time, PI: Neal Evans). The PACS covers various molecular and atomic line transitions such as CO, OH, $H_2O$, [OI], and [CII] at wavelengths from 55 to 210 ${\mu}m$. The line emission of $H_2O$, [OI], mid-J CO, and the OH fundamental transition distributes along the outflow direction although high-J CO and other OH emission peaks at the central spatial pixel. According to our excitation analysis, the CO gas has two temperature components: 300 K and 750 K, which are attributed to PDR and shock, respectively. However, the $H_2O$ gas with the rotation temperature ($T_{rot}$) of 200 K seems only affected by shock. Interestingly, the relative strength of OH transitions suggests the IR pumping process in L1448-MM. We also mapped L1448-MM in CO J=2-1 with the SRAO 6m telescope to compare with the FIR line transition maps.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1273-1274
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• 2006

In recent, it became necessary to develop the technology about electrodeless fluorescent lamp according to demand of the electrodeless fluorescent lamp system that used higher efficiency and advantage of long lifetime. Inductively coupled plasma is commonly used for electrodeless lamp due to its ease of plasma generation. An electric power efficiency of electrodeless fluorescent lamp has big relative property of gas in lamp, gas pressure, lamp formation, ingredients of magnetic substance and shape and action frequency etc. We used magnetic substance that open self-examination material of electrodeless fluorescent lamp antenna. Ferrite that is used in this experiment was Mn-Zn type. We have examined temperature and flux characteristic by frequency. Considering using frequency 2.65[MHz], Frequency was changed from 2.05[MHz] to 3.05[MHz] to recognize flux and temperature change of lamp. I used LMS(Lighting Measurement System) to measure flux and IR Camera to measure temperature of lamp.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.63-68
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• 2018

At present, ultra-precision cutting technology has been studied in Korean research institutes, focusing on development of ultra-precision cutting tool technology and ultra-precision control engineering. However, the developed technologies are still far behind advanced countries. It focuses on metals including aluminum, copper and nickel, and nonmetals including plastics, silicone and germanium which require high precision while using a lathe. It is hard to implement high precision by grinding the aforementioned materials. To address the issue, the ultra-precision cutting technology has been developing by using ultra-precision machine tools very accurate and strong, and diamond tools highly abrasion-resistant. To address this issue, this study aims to conduct ultra-precision cutting by using ECTS (Error Compensation Tool Servo) to improve motion precision of elements and components, and compensate for motion errors in real time. An IR camera is used for analyzing cutting accuracy differences depending on the heat generated in diamond tools in cutting to examine the heat generated in cutting to study cutting accuracy depending on generated heat.

• Bulletin of the Korean Space Science Society
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• 2009.10a
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• pp.29.4-30
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• 2009

Extra-tidal feature of the globular clusters such as tidal tails and halos can be a crucial evidence of the merging scenario of the Galaxy formation in the dynamical point of view. To search for such an extra-tidal feature of globular clusters located in the Galactic bulge(RGC<3kpc), we obtained wide-field near-infrared JHKs images of 6 metal-poor ([Fe/H]<-1.0) clusters and 3 metal-rich ([Fe/H]>-1.0) clusters. Observations were carried out using IRSF 1.4m telescope and SIRIUS near-infrared camera, during 2006~2007. The obtained images have a total maximum field-of-view of ~ $21'\times 21'$. To select clusters' member stars and minimize the field star contaminations, we applied CMD masking algorithm. Smoothed surface density contour maps with selected stars for each cluster show overdensity features around the tidal radius and beyond. Also, radial surface density profiles within the tidal radius of the clusters show an overdensity feature as a change of slope of the radial profile. The results add further observational constraints of the formation of the Galactic bulge.

• Journal of the Korean Ceramic Society
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• v.53 no.6
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• pp.707-711
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• 2016

A small diameter of SiC fiber mat can produce much higher heat under microwave irradiation than the other types of SiC materials. Fabrication of high strength SiC fiber consists of iodine vapor curing on polycarbosilane precursor and heat treatment process. The curing stage of polycarbosilane fiber was maintained at $150-200^{\circ}C$ in a vacuum condition under the iodine vapor to fabricate a high thermal radiation SiC fiber. The structure and morphology of the fibers were characterized by Fourier transform infrared (FTIR) spectroscopy, thermogravimetric analysis (TG) and scanning electron microscopy (SEM). In this study, the thermal properties of SiC fiber mats under microwave have been analyzed with an IR thermal camera and its image analyzer. The prepared SiC fiber mats radiated high temperature with extremely high heating rate up to $1100^{\circ}C$ in 30 seconds. The fabricated SiC fiber mats were not oxidized after the heat radiation process under the microwave irradiation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1733-1734
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• 2006

In recent, it became necessary to develop the technology about electrodeless fluorescent lamp according to demand of the electrodeless fluorescent lamp system that used higher efficiency and advantage of long lifetime. Inductively coupled plasma is commonly used for electrodeless lamp due to its ease of plasma generation. An electric power efficiency of electrodeless fluorescent lamp has big relative property of gas in lamp, gas pressure, lamp formation, ingredients of magnetic substance and shape and action frequency etc. We used magnetic substance that open self-examination material of electrodeless fluorescent lamp antenna. Ferrite that is used in this experiment was Mn-Zn type. We have examined temperature and flux characteristic by frequency. Considering using frequency 2.65[MHz], Frequency was changed from 2.05[MHz] to 3.05[MHz] to recognize flux and temperature change of lamp. I used LMS(Lighting Measurement System) to measure flux and IR Camera to measure temperature of lamp.

• Journal of Surface Science and Engineering
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• v.34 no.1
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• pp.33-38
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• 2001

10cm-diameter Si(100)∥$1.3\mu\textrm{m}$-X$1.3_2$X$1.3\mu\textrm{m}$-$SiO_2$∥Si(100) afers were prepared using a fast linear annealing (FLA) equipment. 1.3$\mu\textrm{m}$-thick $SiO_2$ films were grown by dry oxidation process. After cleaning and premating the wafers in a class 100 clean room, they were heat treated using with the FLA and conventional electric furnace. Bonded area and bond strength of wafer pairs were measured using a infrared (IR) camera and razor blade crack opening method, respectively. It was confinmed that the bonded area by FLA was around 99% and the bond strength value reached 2172mJ/$\m^2$, which is equivalent to theoritical bond strength. Our result implies that thick $SiO_2$ SOI may be prepared more easily by using $SiO_2$$SiO_2$ bonding interfaces then those of Si/$SiO_2$'s.

• Smart Structures and Systems
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• v.24 no.6
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• pp.803-812
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• 2019

Triplex composite is an epoxy-bonded joint structure, which constitutes the secondary barrier in a liquefied natural gas (LNG) carrier. Defects in the triplex composite weaken its shear strength and may cause leakage of the LNG, thus compromising the structural integrity of the LNG carrier. This paper proposes an autonomous triplex composite inspection (ATCI) system for visualizing and classifying hidden defects in the triplex composite installed inside an LNG carrier. First, heat energy is generated on the surface of the triplex composite using halogen lamps, and the corresponding heat response is measured by an infrared (IR) camera. Next, the region of interest (ROI) is traced and noise components are removed to minimize false indications of defects. After a defect is identified, it is classified as internal void or uncured adhesive and its size and shape are quantified and visualized, respectively. The proposed ATCI system allows the fully automated and contactless detection, classification, and quantification of hidden defects inside the triplex composite. The effectiveness of the proposed ATCI system is validated using the data obtained from actual triplex composite installed in an LNG carrier membrane system.