• 전기학회논문지
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• 제62권6호
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• pp.845-851
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• 2013

Because the existing control system has been operating for about 20 years, it is necessary to upgrade the system for stable and efficient operation. But, there is a difficulty in maintenance by difference of manufacturer of each main control systems for boiler, turbine and generator. This developed IMCS(Integrated Monitoring and Control System) consists of more than 10,000 inputs and outputs for large scale thermal power plant. This paper consists of the development journey of IMCS MBC(mill and burner control) ; core binary protection & monitoring logic including prevention circuit of boiler explosion & implosion. In this project, the IMCS for boiler, turbine and generator was developed on basis of one communications platform. In this paper, the whole journey of development of IMCS MBC is dealt with designing software and hardware, coding application software, and validating software and hardware.

• 한국전기전자재료학회논문지
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• 제29권3호
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

• 대한환경공학회지
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• 제31권7호
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• pp.473-482
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• 2009

본 연구에서는 여러 몰비의 망간과 철을 함유한 용액을 사용하여 담체인 모래 표면에 이들 산화물들이 동시에 코팅된 산화철 및 산화망간 코팅사(IMCS)를 제조하였으며, X-선 회절분석을 통하여 제조한 IMCS 표면의 광물종 규명과 이들에 의한 As(III) 산화 및 As(V) 흡착능을 평가하였다. 망간과 철을 동시에 코팅한 IMCS들에서의 철 및 망간의 총량은 단일금속용액으로 코팅시킨 담체(ICS 혹은 MCS)에 비하여 감소하였지만 코팅된 철산화물은 goethite와 magnetite의 혼합물 그리고 망간 산화물은 ${\gamma}-MnO_2$로서 매우 유사하였다. IMCS에 의한 As(V) 흡착량은 코팅된 망간보다는 철 함량에 의해 크게 영향을 받았다. 그리고 IMCS에 의한 As(V) 흡착량은 1가 및 2가 이온들로 이루어진 이온세기 화학종으로 이온세기를 고정하였을 때에는 큰 영향을 받지 않았으나 $PO_4\;^{3-}$와 같은 3가 화학종을 사용한 경우에는 크게 억제되었다. 망간만 코팅시켜 얻은 MCS의 경우, NaCl 및 $NaNO_3$와 같은 1가 이온세기 화학종이 존재하는 경우는 $PO_4\;^{3-}$와 같은 3가 이온세기 화학종이 존재하는 경우에서 보다 2배 이상의 산화효율을 나타내었다. 이에 반해 망간과 철이 함께 코팅된 7:3, 5:5, 3:7 몰비의 경우에는 $PO_4\;^{3-}$를 이온세기 화학종으로 사용한 경우가 다른 이온세기 화학종이 존재하는 경우에서 보다 오히려 As(III) 산화력이 높게 나타났는데 이것은 $PO_4\;^{3-}$가 As(V)와 IMCS 표면에 대한 경쟁흡착을 함에 따른 결과로 나타났다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.165-180
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• 2004

Phosphor contents are critical to the interfacial reaction and IMC behavior. - If content is too low, the dissolution rate will be very fast. - If content is too much, the cracks during interfacial reaction and the IMCs spalling will easily occur. The spalling of IMCs caused the brittle fracture of solder joint under shear test. IMCs from chemical reaction influences to the mechanical properties and life time. Composition changes from chemical reaction influence to the life time.

• 열처리공학회지
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• 제32권2호
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• pp.79-85
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• 2019

To investigate the influence of heat treatment on the growth intermetallic compounds (IMCs) at the joint interface of friction-welded Cu-Al, several heat treatments are performed at three different temperature with different times. The experiments reveal three different IMCs layers which are significantly influenced by atomic diffusion of Cu and Al with heat treatment conditions. Since the formation of these IMCs layers can affect mechanical properties of friction-welded Cu-Al interfaces, the relationship between the microstructure of IMCs layers and the tensile strength is analyzed according to heat treatment temperature and times.

• 한국재료학회지
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• 제29권4호
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• pp.258-263
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• 2019

Since the directly bonded interface between TiAl alloy and SCM440 includes lots of cracks and generated intermetallic compounds(IMCs) such as TiC, FeTi, and $Fe_2Ti$, the interfacial strength can be significantly reduced. Therefore, in this study, Cu is selected as an insert metal to improve the lower tensile strength of the joint between TiAl alloy and SCM440 during friction welding. As a result, newly formed IMCs, such as $Cu_2TiAl$, CuTiAl, and $TiCu_2$, are found at the interface between TiAl alloy and Cu layer and the thickness of IMCs layers is found to vary with friction time. In addition, to determine the relationship between the thickness of the IMCs and the strength of the welded interfaces, a tensile test was performed using sub-size specimens obtained from the center to the peripheral region of the friction-welded interface. The results are discussed in terms of changes in the IMCs and the underlying deformation mechanism. Finally, it is found that the friction welding process needs to be idealized because IMCs generated between TiAl alloy and Cu act to not only increase the bonding strength but also form an easy path of fracture propagation.

• 대한환경공학회지
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• 제32권2호
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• pp.193-200
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• 2010

복합 오염물질 처리를 위해 제조한 다기능성 흡착제인 철과 망간이 동시에 코팅된 모래(Iron and Manganese Coated Sand, IMCS)를 이용하여 용존 Mn(II) 처리 특성을 평가하였다. 실험에 사용된 IMCS는 0.05 M의 Mn(II)과 Fe(III) 용액을 pH 7에서 혼합하여 담체로 쓰인 모래에 코팅하여 제조하였다. IMCS는 ${\gamma}-MnO_2$ 형태의 Mn 산화물과 goethite 및 magnetite($F_{e3}O_4$) 형태의 철산화물이 동시에 존재하는 것으로 나타났다. Mn과 Fe의 함유량은 각각 826 및 1676 mg/kg으로 분석되었으며 $pH_{pzc}$는 6.40으로 측정되었다. IMCS와 산화제로서 NaOCl과 $KMnO_4$를 이용하여 Mn(II)의 제거에 관한 회분식 실험을 pH, 시간, 주입 농도를 변수로 하여 수행하였다. IMCS를 이용하여 Mn(II)을 처리하였을 때, pH 7.4에서 약 34%의 제거율을 나타내었고, 산화제인 NaOCl(13.6 mg/L)을 주입 후 IMCS와 반응시킨 결과 pH 7.0에서 96%의 제거율을 나타냈고, $KMnO_4$(4.8 mg/L)을 이용한 경우 pH 7.6에서 89%의 제거율을 나타내었다. IMCS와 산화제를 이용하여 Mn(II)을 제거할 경우, 용액의 pH가 증가함에 따라 제거율이 증가하는 양이온 형태의 제거 경향을 따랐으며, 반응 시간 6시간이 경과 후 거의 일정한 상태에 도달하는 것으로 나타났다. IMCS만을 이용하여 Mn(II)을 제거한 경우 833.3 mg/kg의 최대제거량을 나타냈고, 산화제로 NaOCl(13.6 mg/L), $KMnO_4$(4.8 mg/L)를 주입 후 IMCS와 반응시킨 경우 최대제거량은 각각 1428.6 및 1666.7 mg/kg으로 나타났다. IMCS에 의한 Mn(II)의 제거는 2차 반응속도식 및 Langmuir 식으로 잘 표현되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.