• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.19 no.3
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• pp.59-65
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• 2019

The EMI shielding effectiveness of the shielding layer thickness was analyzed when the metal shielding layer was placed in the near field of the magnetic probe and the noise source. Microstrip lines were used as noise source, and graphite and ferrite were selected as metal shielding materials. The magnetic probe uses the electromagnetic radiation measurement method using the magnetic probe by applying the IEC 61967-6 method. The transmission coefficient between the microstrip line and the magnetic probe was analyzed. The distance between the two was 1 mm for a single shielding layer and 5 mm for a multiple shielding layer. The thickness of the shielding layer was changed to 5 um, 10 um, 30 um, and 50 um. When the frequency was changed from 150 kHz to 1 GHz, a maximum shielding effectiveness (SE) of 44.9 dB was obtained.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.25-34
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• 2012

New calibration method for the near-field scanning (NFS) system is presented. The proposed calibration method consisted of a new near-field antenna (NFP) and newly devised patterns as circular patch patterns (CPPs) and meander patterns (MPs). The proposed patterns were used for improving spatial resolutions and simplifying a calibration procedure of the NFP compared to the conventional method defined in the IEC61967-3 and 6. Also, the effect of the length of NFPs on attenuation characteristics was investigated with length of 8mm and 30mm. For them, we designed and fabricated CPPs of diameter (D) = 20, 40, 60, and 100mm and MPs of various widths and spaces. We found the reverse relations between spatial resolutions and heights of measuring points by using simplified calibration procedure. The testing result shows that the spatial resolution of $120{\mu}m$ at height of $200{\mu}m$ was verified without complex correlation algorithms under 8GHz. For manufacturing cost all patterns and the NFP were realized with low-cost fabrication using PCB (FR-4) not by a conventional LTCC process. For verification of chip-level EMC from the results, near-field scanning system (NFSS) having step resolution of Sub-micron scale was produced and by using the proposed NFSS and proposed NFP measurement of chip shows accurately the shape of the resolution of $200{\mu}m$ patterns for securing a high level of chip-level EMC verification.