• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1261-1267
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• 2007

Although LEDs have been used in various applications with improving the brightness and luminous efficacy, the electrical and optical characteristics of high power LED varies at different temperature and starting time. In this paper, optimal heat sink and apparatus design were conducted using IR camera and ICEPAK on the LED bulb consisting with fourteen LED array. The temperatures of heat sink and LED device of the designed LED bulb without cooling pan were $74^{\circ}C\;and\;96.8^{\circ}C$, respectively, showing in good themal characteristics. For high efficiency driving circuit of LED array adopted optimal heat sink design, driving circuits of constant voltage and current circuits were suggested and fabricated. As a result the efficacy of all driving circuits showed more than 20 lm/W. Also, the constant current circuits are suitable for signal lamp, hallway lamp, and flash lamp having short operating time(about 30 min). On the other hand, a reading light and indoor lamp having long operating time can be controlled by constant voltage circuit.

• Journal of Energy Engineering
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• v.13 no.1
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• pp.12-19
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• 2004

A Molded Case Circuit Breaker (MCCB) is an electric control device to interrupt the abnormal currents which result from the over-loads or short-circuits. Its malfunction will result in severe accidents. In the development of the MCCB, higher current-rating and improved thermal performance become more and more important in providing the safe function and reliability for the modern devices requiring small scale and high performance. It is also very important to consider the factors of temperature rise in the design of MCCB. The major reasons of temperature rise in the MCCB result from the resistances, which are come from the connection and contact surfaces. These resistances are influenced by current, time, configuration of contact surfaces and applied voltage. In order to predict the temperature distribution inside MCCB, we have simulated the model with some assumptions and simplifications, using commercial code ICEPAK. To verify the results of temperature field analysis, the numerical results are compared with experimental ones for the same model. The results show a good agreement with actual temperature rise obtained by experiments.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.1
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• pp.61-68
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• 2012

The purpose of Crash Protected Module in Black Box used at aircraft is to protect a stored information(Flight data & Cockpit Voice) safely even after extreme environment like a plane crash. This study shows the structure & thermal analyses and the comparisons of predictions and results of tests about CPM for Crash Survival through extreme environment such as Penetration Resistance, High Temperature Fire, Low Temperature Fire. Specially, the Effect of housing thickness change was studied through the Penetration Resistance analysis using LS-DYNA, and the influence of volume ratio change between phase change material and thermal insulation material was studied through the High Temperature & Low Temperature analysis using Icepak. Also, structural and thermal reliability of CPM was validated through the tests.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.8
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• pp.821-828
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• 2012

Increasing heat generation in CPUs can hamper effective recirculation and by-pass because of the large temperature difference between the exhaust and the intake air through a server room. This increases the overall temperature inside a data center and decreases the efficiency of the data center's cooling system. The purpose of the data center's cooling system is to separate the intake and exhaust air by controlling the computer room air-conditioner(CRAC). In this study, ICEPAK is used to conduct a numerical analysis of a data center's cooling system. The temperature distribution and the entire room are analyzed for different volumetric flow rates. The optimized volumetric flow rate is found for each CPU power. The heat removal and temperature distribution for CPU powers of 100, 120, and 140 W are found to be the best for a volumetric flow rate of $0.15m^3/s$. The numerical analysis is verified through RTI indicators, and the results appear to be the most reliable when the RTI value is 81.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.927_929
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• 2009

This paper reports the case that unitizes heat analysis simulation in housing design of DC-DC converter. Icepak4.3 is used for heat analysis simulation program. 1.5kW prototype is produced with base of finally selected structure through simulation and is compared heating characteristic. Propriety of development application is confirmed through the result, shortening case of development cost and period is introduced.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.145-150
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• 2003

In this paper we have studied the characteristics of temperature fields in a Molded Case Circuit Breaker (MCCB). A switch and a trip device are arranged in narrow space of the MCCB. Thus, thermal factors have been risen to important problem. The temperature rise means an energy loss and it becomes the reason of fatal fault in devices. Also, the temperature rise on the connection and the contact parts is regulated up to $115^{\circ}C$ and $105^{\circ}C$, respectively. Therefore, a study for preventing the temperature rise should be investigated. A numerical analysis method that has confidence might be preceded for this purpose. In order to verify the confidence of temperature field analysis, the results of the numerical analysis are compared with those of experimental one for the same model. Comparison results show a qualitatively good agreement within ${\pm}5%$ errors.

• Proceedings of the KIPE Conference
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• 2010.07a
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• pp.166-167
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• 2010

최근 전기/전자 제품 개발에서 대용량, 소형화가 이루어지면서 제품 설계에 열유동 및 구조적 문제가 중요한 요소로 등장하였다. 열유동은 발열체와 공기의 흐름에 관련이 있기 때문에 시스템의 구조를 어떻게 설계 하느냐가 방열의 중요한 요소이다. 본 논문에서는 Ansys사(社)의 소프트웨어를 이용하여 연료전지용 PCS에 대한 열유동, 구조 및 강도 해석을 수행하였다. 3D설계는 CAD(Computer Aided Design) 소프트웨어인 Pro Engineer를 이용하였다. 설계된 3D 도면을 Ansys Multiphysics로 불러들여 구조 및 강도해석을 하였고 CFD(Computational Fluid Dynamics) 소프트웨어인 Icepak으로 열유동해석을 수행하였다.

• Proceedings of the KIEE Conference
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• 2002.11d
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• pp.39-42
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• 2002

In this study, the computational heat transfer of the high-voltage vacuum circuit breaker was investigated. Higher normal current-ratings and stabilized thermal characteristics become more important in existing circuit breakers in order to satisfy market needs. Increases in current-ratings have an even greater effect on the Joule heating in the main circuit of the breakers. The thermal design must account for this increase in heat produced for the breaker to meet various temperature-rise limits set by industry standards. We are studying to enhance the normal current-ratings without major frame change of our present production models. As the method used in this research, we performed the computational analysis using the commercial Package, ICEPAK. We could get optimized thermal design suitable for 25% upgraded normal current-ratings through parametric study.

• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.183-185
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• 2008

재택근무와 소규모 창업 등 사무 환경의 변화 에 따라 프린터와 복합기의 소형화가 요구 되고 있다. 이러한 소형화에 의해 프린터 내부의 발열 요소들이 제한 된 공간에 배치되어, 기기 내부의 열 유동 및 발열 개선은 제품의 수명과 안정성 확보를 위한 중요 사항이 되었다. 본 논문에서는 프린터와 복합기의 내부 요소 중 주요 발열원인 전원 공급 장치에 대하여 Computational fluid dynamics (CFD) software 인 ICEPAK을 이용하여 중요 부품의 배치 조건에 따른 대류 와 온도 특성을 확인 하고, 최적화 된 부품 배치 방법을 제안한다. 또한 제안하는 부품 배치 방법을 적용한 초박형 프린터용 50W 급 전원 공급 장치를 제작하여 실제 온도 특성이 개선됨을 확인한다.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1661-1662
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• 2006

고출력 LED의 전기적 광학적 열적인 특성을 분석한 결과를 토대로 MCPCB를 사용하지 않고 전구 형태의 좁은 면적에 고출력 1W LED를 배열하고, 적외선 카메라와 ICEPAK(열유동해석 프로그램)을 이용하여 14개의 LED 배열에 대한 LED 전구의 최적방열 및 기구 설계를 실시하였다. LED 전구에 대한 정전압과 정전류 제어방식의 고효율 구동회로를 제작하여, 약 70% 이상의 회로 효율과 약 95% 이상의 고역률, 약 20lm/W 이상의 고효율 LED 전구를 실현하였다. 정전압 구동회로는 동작시간에 무관하게 일정한 광출력을 나타내며, 정전류 구동회로는 초기 시동시 높은 광출력을 나타내고 동작시간의 경과에 따라 광출력 감소율이 높게 나타냄을 알 수 있다.