• 제목/요약/키워드: IC substrate

검색결과 184건 처리시간 0.026초

RABiTS 위에 PLD 방법으로 증착된 YBCO 초전도 박막 선재의 제조 (Manufacturing of YBCO coated conductor deposited on RABiTS by pulsed laser deposition method)

  • 고락길;;정준기;하홍수;김호섭;송규정;박찬;문승현;유상임;김영철
    • Progress in Superconductivity
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    • 제6권1호
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    • pp.74-78
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    • 2004
  • YBCO coated conductor is one of the most promising materials as a new generations wire especially for practical power applications. In this work, $YBa_2$$Cu_3$$O_{7}$ -$\delta$/(YBCO) coated conductors (CC) were deposited by pulsed laser deposition (PLD) from buffer layers to superconducting layer on hi-axially textured metal tape. The oxide multilayer buffered substrate of architectures of $CeO_2$/$YSZ/Y_2$$O_3$ was fabricated by PLD at steady status. Then YBCO layer was deposited on RABiTS substrate by stationary and reel-to-reel (R2R) continuous process and we compared with deposition conditions of both processes. The degree of texture of each layer was investigated using X-ray diffraction including $\theta$-2$\theta$ scans, $\omega$-scans and $\Phi$-scans analysis. Their surface morphology was observed by scanning electron microscopy (SEM). The FWHM of the X-ray $\Phi$-scans and $\Phi$-scans indicated that YBCO and buffer layers closely replicate the in-plane and out-of-plane texture of metal tape. Critical current (Ic) at 77 K, self-field of 75.8 A/cm-width, critical temperature (Tc) of 85 K, and critical current density (Ic) of 3.7 MA/$\textrm{cm}^2$ were measured from coated conductor deposited by stationary process. And coated conductor deposited by R2R continuous process had Ic of 57.5 A/cm-width, Tc of 86.5 K and Jc of 2.0 MA/$\textrm{cm}^2$. The film also exhibits a homogeneous and dense surface morphology.

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TFA-MOD법을 이용한 YBCO 박막의 열처리 온도와 두께의 영향 (Effects of the Heat Treatment Temperature and Thickness of YBCO Film Fabricated by TFA-MOD Method)

  • 장석헌;임준형;이진성;윤경민;김규태;주진호;김찬중;나완수
    • 한국전기전자재료학회논문지
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    • 제19권5호
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    • pp.467-476
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    • 2006
  • We fabricated the YBCO films on LAO substrate using the TFA-MOD method and evaluated the effects of heat treatment temperature and film thickness on the microstructure, degree of texture, and critical properties. The calcining and firing were peformed at the temperature range of $370^{\circ}C-460^{\circ}C\;and\;750^{\circ}C-800^{\circ}C$, respectively. For the films fired at $775^{\circ}C$ after calcining at $400^{\circ}C-430^{\circ}C$showed highest critical temperature (Tc-onset) of 89.5 K and critical current (Ic) of 40A/cm-width which corresponds to critical current density (Jc) of $1.8MA/cm^2$. The highest critical properties are probably attributed to the formation of purer YBCO phase, stronger biaxial texture, and higher oxygen content, according to the XRD, pole-figure, SEM, Raman analysis. From the multi-coated films, the Ic increased from 39 to 169 A/cm-width as the coating repeated to four times, while the corresponding Jc was measured from once to be in the range of $0.8-1.2MA/cm^2$. Both Ic and Jc degraded as the coating repeated further, indicating that the optimum thickness is in the range of $1.0{\mu}m-1.7{\mu}m$.

AT9283, 1-Cyclopropyl-3-(3-(5-(Morpholinomethyl)-1H-Benzo[d] Imidazole-2-yl)-1H-Pyrazol-4-yl) Urea, Inhibits Syk to Suppress Mast Cell-Mediated Allergic Response

  • Kim, Su Jeong;Choi, Min Yeong;Min, Keun Young;Jo, Min Geun;Kim, Jie Min;Kim, Hyung Sik;Kim, Young Mi
    • Biomolecules & Therapeutics
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    • 제30권6호
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    • pp.520-528
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    • 2022
  • Mast cells are an effector cell that plays a pivotal role in type I hypersensitive immune responses. Mast cells exist in connective tissues, such as skin and mucosal tissue, and contain granules which contain bioactive substances such as histamine and heparin in cells. The granules of mast cells are secreted by antigen stimulation to cause the type I allergic hypersensitivity. In addition, stimulated by antigen, mast cells synthesize and secrete various eicosanoids and cytokines. While AT9283 is known to have anticancer effects, the therapeutic effect of AT9283 on allergic disorders is completely unknown. In this study, it was found that AT9283 reversibly inhibited antigen-IgE binding-induced degranulation in mast cells (IC50, approx. 0.58 μM) and suppressed the secretion of the inflammatory cytokines IL-4 (IC50, approx. 0.09 μM) and TNF-α (IC50, approx. 0.19 μM). For a mechanism of mast cell inhibition, while not inhibiting Syk phosphorylation, AT9283 suppressed the activation of LAT, a downstream substrate protein of Syk, in a dose-dependent manner. As expected, AT9283 also inhibited the activation of PLCγ1 and Akt, downstream signaling molecules of Syk/LAT, and MAP kinases such as JNK, Erk1/2, and P38. In an in vitro protein tyrosine kinase assay, AT9283 directly inhibited Syk activity. Next, AT9283 dose-dependently inhibited passive cutaneous anaphylaxis (PCA), an IgE-mediated allergic acute response, in mice (ED50, approx. 34 mg/kg, p.o.). These findings suggest that AT9283 has potential to use as a new drug for alleviating the symptoms of IgE-mediated allergic disorders.

MEMS 공정을 이용한 BGA IC 패키지용 테스트 소켓의 제작 (Fabrication of MEMS Test Socket for BGA IC Packages)

  • 김상원;조찬섭;남재우;김봉환;이종현
    • 대한전자공학회논문지SD
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    • 제47권11호
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    • pp.1-5
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    • 2010
  • 본 논문에서는 외팔보 배열 구조를 가지는 MEMS 테스트 소켓을 SOI 웨이퍼를 이용하여 개발하였다. 외팔보는 연결부분의 기계적 취약점을 보완하기 위해 모서리가 둥근 형태를 가지고 있다. 측정에 사용 된 BGA IC 패키지는 볼 수 121개, 피치가 $650{\mu}m$, 볼 직경 $300{\mu}m$, 높이 $200{\mu}m$ 을 가지고 있다. 제작된 외팔보는 길이 $350{\mu}m$, 최대 폭 $200{\mu}m$, 최소 폭 $100{\mu}m$, 두께가 $10{\mu}m$인 곡선 형태의 외팔보이다. MEMS 테스트 소켓은 lift-off 기술과 Deep RIE 기술 등의 미세전기기계시스템(MEMS) 기술로 제작되었다. MEMS 테스트 소켓은 간단한 구조와 낮은 제작비, 미세 피치, 높은 핀 수와 빠른 프로토타입을 제작할 수 있다는 장점이 있다. MEMS 테스트의 특성을 평가하기 위해 deflection에 따른 접촉힘과 금속과 팁 사이의 저항과 접촉저항을 측정하였다. 제작된 외팔보는 $90{\mu}m$ deflection에 1.3 gf의 접촉힘을 나타내었다. 신호경로저항은 $17{\Omega}$ 이하였고 접촉저항은 평균 $0.73{\Omega}$ 정도였다. 제작된 테스트 소켓은 향 후 BGA IC 패키지 테스트에 적용 가능 할 것이다.

LTCC 기술을 적용한 집적화된 2.4 GHz 대역 무선 송수신 모듈 구현 (A Compact Integrated RF Transceiver Module for 2.4 GHz Band Using LTCC Technology)

  • 김동호;김동수;유종인;김준철;박종대;박종철
    • 한국전자파학회논문지
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    • 제22권2호
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    • pp.154-161
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    • 2011
  • 본 논문에서는 저온 동시 소성 세라믹(Low Temperature Co-fired Ceramic: LTCC) 기술을 이용하여 집적화된 2.4 GHz 대역 무선 송수신 모듈을 구현하였다. 구현된 송수신 모듈은 무선 전단부(RF front-end)단과 송수신 IC칩 단으로 나누어진다. 무선 전단부단은 송수신을 선택하기 위한 SPDT 스위치와 스위치 동작을 위한 DC block 커패시터를 제외하고, 모두 LTCC 내부에 내장하였다. 제작된 무선 전단부는 8층으로 설계되었고, 크기는 $3.3\;mm{\times}5.2\;mm{\times}0.4\;mm$이며, 무선 전단부의 측정 결과는 시뮬레이션과 유사한 결과를 보인다. 송수신 IC 칩 단은 신호 및 전원 선로와 송수신 IC 칩으로 구성이 되어 있다. 제작된 무선 송수신 모듈은 내부 접지(inner GND) 3개 층을 포함한 9층으로 설계되었으며, 크기는 $12\;mm{\times}8.0\;mm{\times}1.1\;mm$이다. 최종적으로 2.4 GHz 대역 송수신 모듈의 송신 파워는 18.1 dBm이고, 수신 민감도는 -85 dBm의 특성으로 우수한 결과를 나타내었다.

증착 조건이 KLN 박막의 형상에 미치는 영향 (The Effect of Deposition Parameters on the Morphology of KLN Thin Films)

  • 박성근;전병억;김진수;김지현;최병진;남기홍;류기홍;김기완
    • 한국재료학회지
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    • 제11권1호
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    • pp.27-33
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    • 2001
  • 본 실험에서는 $Pt/Ti/SiO_2/Si(100)$ 기판 위에 KLN 박막을 형성할 때 나타나는 4-fold 그레인의 성장 특성을 조사하기 위하여 공정 변수를 변화시키면서 박막을 제작하였다. 공정 변수는 기판 온도, 스퍼터링 압력, 고주파 전력을 선택하여 최적의 증착 조건 근방에서 공정 변수를 변화시키면서 실험하였다. K와 Li가 과량된 타겟을 사용하여 KLN 박막을 제조할 때 최적의 성장 조건은 고주파 전력 100 W, 공정압력 150 mTorr, 기판온도 $600^{\circ}C$이며 공정변수의 작은 변화에도 박막의 표면 형상은 매우 민감하게 변화하였다. KLN은 화합물을 구성하는 원소 사이의 증기화 온도의 차이가 많이나는 물질로서 고온 고진공의 환경에서 박막을 제조할 때 어려움이 있으며, 녹는점과 기판 온도와의 관계를 설명한 Thornton의 모델로 설명하기 어려운 현상이 나타났다. 이러한 것은 박막 물질을 이루는 구성 원소의 증기화 온도를 이용하여 이 현상을 간단하게 설명할 수 있었다.

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Thick Metal CMOS Technology on High Resistivity Substrate and Its Application to Monolithic L-band CMOS LNAs

  • Kim, Cheon-Soo;Park, Min;Kim, Chung-Hwan;Yu, Hyun-Kyu;Cho, Han-Jin
    • ETRI Journal
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    • 제21권4호
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    • pp.1-8
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    • 1999
  • Thick metal 0.8${\mu}m$ CMOS technology on high resistivity substrate(RF CMOS technology) is demonstrated for the L-band RF IC applications, and we successfully implemented it to the monolithic 900 MHz and 1.9 GHz CMOS LNAs for the first time. To enhance the performance of the RF circuits, MOSFET layout was optimized for high frequency operation and inductor quality was improved by modifying the technology. The fabricated 1.9 GHz LNA shows a gain of 15.2 dB and a NF of 2.8 dB at DC consumption current of 15mA that is an excellent noise performance compared with the offchip matched 1.9 GHz CMOS LNAs. The 900 MHz LNA shows a high gain of 19 dB and NF of 3.2 dB despite of the performance degradation due to the integrating of a 26 nH inductor for input match. The proposed RF CMOS technology is a compatibel process for analog CMOS ICs, and the monolithic LNAs employing the technology show a good and uniform RF performance in a five inch wafer.

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미세피치 Sn-In 솔더범프를 이용한 COG(Chip on Glass) 본딩공정 및 전기적 특성 (Processing and Electrical Properties of COG(Chip on Glass) Bonding Using Fine-pitch Sn-In Solder Bumps)

  • 최재훈;전성우;정부양;오태성;김영호
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.103-105
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    • 2003
  • COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

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평판디스플레이를 위한 열압착법을 이용한 이방성 도전성 필름 접합 (Thermocompression Anisothropic Conductive Films(ACFs) bonding for Flat Panel Displays(FPDs) Application)

  • 박진석;조일제;신영의
    • 한국전기전자재료학회논문지
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    • 제22권3호
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    • pp.199-204
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    • 2009
  • The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

Study on the Mechanism of P-glycoprotein Inhibitory Activity of Silymarin in Human Breast Cancer Cell

  • Kwon, Young-Joo;Jung, Ho-Jin;Lee, Hwa-Jeong
    • Journal of Pharmaceutical Investigation
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    • 제36권5호
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    • pp.315-320
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    • 2006
  • Silymarin showed P-glycoprptein(P-gp) inhibitory activity as much as verapamil, a well-known P-gp inhibitor, by decreasing $IC_{50}$ value of daunomycin(DNM)($16.0{\pm}0.7{\mu}M$), increasing the DNM accumulation($224.9{\pm}3.2%$), and decreasing DNM efflux($58.5{\pm}6.7%$), concurrently. In this study, we clarified the mechanism of action of silymarin for P-gp inhibitory function. First, silymarin may bind to the ATP-binding site and thus, prevent ATP hydrolysis. Second, the P-gp inhibitory activity of silymarin is not related to changing the cellular P-gp level. Third, the cytotoxicity of silymarin was increased in the presence of verapamil, reflecting that silymarin is a competent P-gp substrate against verapamil in the P-gp-overexpressed adriamycin-resistant MCF-7 breast cancer(MCF-7/ADR) cells. Conclusively, silymarin had the P-gp inhibitory activity through the action of competent binding to the P-gp substrate-binding site. Therefore, silymarin can be a good candidate for safe and effective MDR reversing agent in clinical chemotherapy by administering concomitantly with anticancer drugs.