• Design & Manufacturing
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• v.11 no.2
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• pp.9-14
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• 2017

The design and manufacturing tehcnology of IC sockets beyond 0.3mm pitch were presented. We compared the developed IC socket with the conventional one especially on the core metal-insulation part. Advanced machining techniques were employed to provide high precision. Our wire electrodischarge machining and high speed machining centers were able to maintain the micro-scale precision. We performed an injection molding analysis using a commercial analysis tool to predict the performance of the developed IC socket. We found that the solidification of the plastic resin and the high level of the clamping force are responsible for the defects such as incomplete filling and short shot. From these results, we modified the IC socket and successfully remove the defects. We were also able to find out that the new design socket needs less maintenance cost.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.297-298
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• 2006

• Journal of Sensor Science and Technology
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• v.21 no.1
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• pp.34-38
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• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• Journal of IKEEE
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• v.25 no.2
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• pp.315-321
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• 2021

In this paper, we have developed the multiple channel measurement system for IC Socket Test. The one can test the current-voltage measurements for pitting the several device specification, which analyze the thin current from several ㎂ to 5A with very low resistor mΩ. The increasement of the IC socket channel with lead pitch under 0.25 mm be need to perform several functions, concurrently. The system to perform these functions be designed to integrate several SMU(source measure unit) on board. So, we can reduce the 2 minutes test time per channel point to 40 sec, with daisy chain test method. Using by graphic interface, I-V curve mode and data logging technologies, we can implement the test flow methods and can make economies the time and cost.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.11
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• pp.1-5
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• 2010

We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

• Proceedings of the Korean Information Science Society Conference
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• 1999.10c
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• pp.167-169
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• 1999

산업응용 시스템에 있어서의 생산성이란 시스템의 성능 및 효율성에 관한 척도가 된다. 따라서, 시스템의 개발 전과정에서 이를 향상시키려는 많은 노력이 이루어진다. 특히 반도체의 제조공정에서는 이를 위한 노력이 민감하게 발전되어 왔다. 이들 중 IC Test Handler의 Socket관리는 제품(Device)의 생산량과 함께 시스템의 효율성에 직접적인 영향을 주는 부분으로 많은 연구 및 개발이 이루어지고 있다. 본 논문에서는 이러한 생산성 및 효율성을 높이기 위한 자동 Socket 관리 시스템을 개발하여 사용자(Operator)에게 보다 향상된 시스템 환경을 제공하고자 한다. 이를 위해 PC 환경의 GUI 시스템을 도입하였으며, 실제적인 제어부분은 Real Time 운영체제를 탑재한 VME 시스템이 담당하였다. 또한, 신뢰성을 위하여 날짜별 데이터를 하드디스크에 저장하여 Socket 데이터를 사용자가 확인할 수 있도록 하였다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.221-230
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• 2004

• Design & Manufacturing
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• v.10 no.3
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• pp.1-7
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• 2016

In the semiconductor industry the memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. After injection molding process the side gates were needed to remove for further assembly process. ln this study, the cold press cutting process was applied to remove the gates. For design of punch and die, the cold press cutting analysis was implemented by$DEFORM-2D^{TM}$ ln consideration of the simulation results, an adequate punch and die was designed and made for the cutting unit. In order to verify the performance of cutting process, the roughness of cutting section of the part was measured and was satisfied in requirement.

• Design & Manufacturing
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• v.10 no.2
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• pp.50-54
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• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.1
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• pp.1-6
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• 2011

We have developed the process of forming one body S-type cantilever probe in the recessed trench for fine-pitched MEMS probe card. The probe (cantilever beam and pyramid tip) was formed using Deep RIE etching and wet etching. The pyramid tip was formed by the wet etching using KOH and TMAH. The process of forming the curved probe was also developed by the wet etching. Therefore, the fabricated probe is applicable for the probe card for DRAM, Flash memory and RF devices tests and probe tip for IC test socket.