• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.6 s.360
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• pp.83-88
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• 2007

In this paper, we propose the function verification method of the OLED(Organic Light Emitting Diode) drive IC using PLI verification method. This method uses the HDL(Hardware Description Language) simulator, PLI(Programing Language Interface), and GUI (Graphic User Interface) image viewer. This method improves the execute efficiency 40 times than conventional function verification methods. The proposed method can be used efficiently for function verification of DDI(display driver IC) design step.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.1
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• pp.79-86
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• 1990

A method to determine directly $J_{IC}$ from load-displacement curve without measuring crack growth amount is studied. A method to use key curve in determination of $J_{IC}$ is also considered. The values of $J_{IC}$ obtained from the above methods are compared with that obtained from the ASTM standard test method (E813). By performing experiments using both compact-tension specimen and three-point-bending specimen of a structural alloy steel SCM4, it is shown that the methods proposed here may be used in determination of $J_{IC}$.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.2A
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• pp.109-115
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• 2002

We propose IC-IPDL method, in order to improve hearability which is the fundamental problem of cellular-based location systems. The proposed method improves hearability by using interference cancellation technique for CPICH and modified-IPDL method for other downlink channels. The simulation results showed that IC-IPDL method has a similar performance of the case using standard IPDL method though CPICH exists during idle period.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2018.10a
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• pp.507-511
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• 2018

This paper proposes a method for system development for high speed (300MHz) test of system IC semiconductors. The high-speed test system proposes a high-speed test circuit interface and a PCB design method for noise reduction. This paper proposes evaluation items and procedures for verifying the performance of the developed system. System IC The development of high speed test systems will help optimize the development of domestic system IC test equipment.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.2A
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• pp.124-129
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• 2002

We propose a wireless positioning system using IC-IPDL method that exploits the modified-IPDL method and the interference cancellation techniques to improve hearability. In the proposed system, IPDL method is modified to maintain the transmission of CPICH for stability of CDMA network Simultaneously in mobile CPICH is cancelled out using the interference cancellation techniques for improving hearability. The simulation results showed that the proposed location system has a compatible performance to the standard IPDL method though CPICH exists during idle period.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.4
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• pp.653-659
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• 1989

Elastic-plastic fracture toughness J$_{IC}$ can be used as an effective design criterion in elastic plastic fracture mechanics. In the J$_{IC}$ test methods approved by ASTM and JSME, there are discrepancies such as the definition of J$_{IC}$, the slope of the blunting line, curve fitting method and the measurement of crack extension etc. The objective of this paper is to evaluate the effect of these discrepancies on the determination of J$_{IC}$ values. Fracture toughness tests were performed on A516, SA508 and SCM415 steels, and test results were analyzed according to ASTM E 813-81, ASTM E 813-87 and JSME S 001-1981. Results showed significant differences depending on the analysis methods. Therefore, a conversion equation between two ASTM methods was proposed, and the conversion error was within acceptable range(less then 8.5%)en 8.5%)

• Journal of Welding and Joining
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• v.4 no.1
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• pp.47-57
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• 1986

The elastic-plastic fracture toughness J_{Ic}$ of submerged arc welded structural steel $SB_{41}$ which has the properties of low strength and high ductility was discussed, especially paying attention to a comparison between two methods recommended by ASTM and JSME. $J_{IC}$ tests were carried out with compact specimens by means of R-curve, SZW, ultrasonic and electric potential methods. Based on the investigations in this study, the results obtained are as follows; (1) The JSME R-curve method gave the smallest $J_{IC}$ values which were physically closest to the crack initiation and seemed to be more practical and stable procedure between the two R-curve methods. (2) The JSME SZW method tended to slightly overestimate the $J_{IC}$ values at initiation of ductile tearing. (3) The ultrasonic and electric potential methods which also had a tendency to overestimate these $J_{IC}$ values were confirmed to be applicable and useful in determining these values. (4) The $J_{IC}$ values by the JSME R-curve method were 18.06 kgf/mm and 17.25kgf/ mm for the smooths and the side grooved CT specimen respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.3
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• pp.540-544
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• 1998

Compliance calibration method is frequently used to determine $G_IC$ from the DCB composite specimen. However, the method requires at least 4 to 5 fracture test (loading-unloading) records. In this study, $G_IC$ of unidirectional graphite/epoxy DCB composites was determined from the elastic work factor approach which uses a single fracture test record. In order to inspect the validity of the elastic work factor approach, $G_IC$ determined from the elastic work factor approach was compared to that of determined from the compliance calibration method. It was shown that $G_IC$ determined from the elastic work factor approach was comparable to that determined from the compliance calibration method. That is, the elastic work factor approach can be used to determine $G_IC$ of unidirectional graphite/epoxy DCB specimen from a single fracture record.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.5
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• pp.680-688
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• 1986

In order to obtain the optimal estimation method of fracture toughness of dual phase steel in which martensitic phase encapsulated islands of ferritic phase, the stretched zone (SZ) method and the R-curve method of the JSME S 001 was discussed. The results obtained are as follows. (1) The $J_{IC}$ values estimated by the SZ method are overestimated as compared with those by the R-curve method. (2) The $J_{IC}$ by the R-curve method decreases with the increase of the ferrite grain size and the martensite hardness. (3) The overestimation of $J_{IC}$ by the SZ method is due to the continuous plastic blunting of ferrite after the formation of stable crack which affects the critical stretched zone width.