• KSBB Journal
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• 제23권1호
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• pp.77-82
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• 2008

본 연구는 제주도의 자생식물인 노루참나물 (Pimpinella komarovii)의 산업적 활용 가능성을 평가하기 위하여 에탄올 추출물 및 순차적 용매분획물을 얻어 항산화 활성 및 항염증 효과를 검색하고자 하였으며, 마우스 유래의 melan-a 세포에 처리하여 멜라닌 생합성 및 tyrosinas 억제활성을 통하여 유용자원으로서 미백 및 기능성 화장료로 활용가능성이 있는지 알아보고자 연구를 시행하였다. 노루참나물 에탄올 추출물은 높은 항산화 활성 (DPPH 소거활성 $IC_{50}$ 값, $231.8{\mu}g/m{\ell}$ ; superoxide 소거 활성 및 xanthine oxidase 억제 활성 $IC_{50}$ 값, 각각 $23.6{\mu}g/m{\ell},\;587.8{\mu}g/m{\ell}$)을 나타내었으며, 순차적 분획물 중에서는 에틸아세테이트 분획물이 가장 높은 항산화 활성을 나타내었다. 그리고 멜라닌 생성 세포인 melan-a 세포에서 노루참나물 에탄올 추출물과 에틸아세테이트 분획물이 tyrosinase와 멜라닌 합성을 농도 의존적으로 억제하였다. 또한 LPS로 자극한 RAW 264.7 세포에서 노루참나물의 헥산 분획물과 에틸아세테이트 분획물이 가장 높은 NO생성 억제 활성을 보였다. 본 연구결과는 노루참나물 추출물이 항산화 및 항염증 활성을 가지는 미백 관련 기능성 소재로서의 활용가치가 있음을 보여준다.

• 정보처리학회논문지A
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• 제19A권1호
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• pp.51-60
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• 2012

일반적으로 스마트카드라고 불리는 IC(Integrated Circuit)카드는 작은 크기의 마이크로칩(MPU)과 메모리, EEPROM, 카드 운영체제(COS) 및 보안 알고리즘을 내장하고 있다. 이러한 IC카드는 금융(카드,은행,증권 등), 교통, 통신, 의료, 전자여권, 멥버쉽 회원관리 등 거의 모든 산업분야에서 이용되고 있다. 최근 방송통신융합 및 TV의 스마트기기화 추세에 따라 TV전자상거래(T-커머스)가 방송산업의 신성장 동력이 되면서 T-커머스 지불결제 방법으로 IC카드를 이용하는 등 응용분야가 증가하고 있다. 예를 들어, T-커머스에서 IC신용카드(또는 IC현금카드)를 이용하여 결제를 하거나, IC현금카드를 이용하여 ATM과 같은 방식으로 TV뱅킹 서비스를 제공한다. 하지만 아직까지 대부분의 T-커머스 신용카드 결제 서비스는 리모콘을 이용한 카드정보 입력 방식을 이용하고 있기 때문에 고객 편의성이 크게 떨어지고, 카드정보 저장 및 노출 등 보안성에 있어서 취약성을 가지고 있다. 이러한 문제점을 해결하고자, 본 논문에서는 IC신용카드 결제 표준기술인 EMV기술을 이용한 TV전자 지불 결제시스템 구현을 위한 결제처리 모듈을 개발하였다.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2014년도 추계학술대회
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• pp.291-292
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• 2014

본 논문에서는 MIPI (Mobile Industry Processor Interface) DSI (Display Serial Interface) 규격을 지원하는 마스터 브릿지 IC의 고속 데이터 전송모드를 구현하였다. MIPI DSI 마스터 브릿지 IC는 RGB 데이터 및 각종 제어 명령어를 디스플레이 모듈 (슬레이브)로 전송하여 디스플레이 모듈을 시험하는 용도로 사용된다. 설계된 마스터 브릿지 IC는 2 라인의 영상 데이터를 저장하는 버퍼, 패킷생성 부분, 패킷을 데이터 레인 (1~4개)에 분배하여 슬레이브로 전송하는 D-PHY 계층 등으로 구성된다. 4가지 bpp (bit per pixel) 형식과 Burst 및 Non-Burst (Sync Events, Sync Pulses 방식)의 세 가지 전송모드를 지원하도록 설계되었다. 설계된 비디오 전송모드가 MIPI DSI 규격에서 정의되는 다양한 동작 파라미터들에 대해 올바로 동작함을 기능검증을 통해 확인하였다.

• 한국수산과학회지
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• 제55권2호
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• pp.121-128
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• 2022

The aims of this study were to optimize the processing procedure of high-quality semi-alternating temperature dried Israeli carp Cyprinus carpio (SAD-IC) and to investigate the sensory properties of the product. Based on the differences in moisture content of the dorsal and ventral muscles, high quality SAD-IC was prepared by alternating the drying temperature between 4 h at 35℃, and 2 h at 5℃, three times before final drying for 2 h at 35℃. The surface in SAD-IC produced under the optimal alternating-temperature drying process had a markedly superior browning index value and softer texture compared to products produced using constant-temperature drying. SAD-IC produced from dorsal and ventral muscle had significantly superior taste values than the raw material. These results suggest that SAD-IC has the potential to be industrialized.

• 패션비즈니스
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• 제27권5호
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• pp.121-134
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• 2023

With the development of information and communication technology, interest in new educational approaches that can enhance the learning performance of learners with improved information literacy skills is increasing, and universities are actively promoting educational innovation to foster the talents required by society. In the field of fashion studies education, which is closely related to the fashion industry, there is a strong need to develop field-linked educational programs that reflect the trends in the industry and changes in the educational system. The purpose of this study was to introduce industry-coupled problem-based learning (IC-PBL) to the course "Understanding Fashion Consumption Trends" for non-fashion majors to reflect the current needs and strengthen the educational effectiveness of the learners through a survey. A seven-step curriculum (introduction to the class, practitioner's problem, learner's problem analysis, organizing concepts related to variables, information collection and scenario writing, presentation and scenario proposal, and evaluation) not only enhanced learners' understanding of fashion consumption trends and the fashion industry but also greatly amplified learners' satisfaction with the class. The results of the survey showed that the seven-step curriculum was effective in increasing learners' self-directed learning ability, problem-solving ability, and confidence in learning. Self-directed learning ability was stronger than other factors, consistent with the core principle of problem-based learning to empower learners to take the initiative and promote self-directed learning. Each factor analyzed was positively correlated.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• 한국레이저가공학회지
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• 제15권3호
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• 통상정보연구
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• 제12권2호
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• pp.133-158
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• 2010

Since 11 September 2001, the awareness of terrorists' actions has clearly risen. The potential threat of terrorists using containers poses a large risk to our economies and to our societies. In order to protect cargo from damage and terrorist threats, business and government turn to RFID and IC tags, and tradition container is replaced by IC smart container. In this study, presented application of IC tag and future tasks to Container transport by sea in viewpoint of security strengthening. First, realization and international SCM realization structural order that cover container supply chain whole of international standardization and association between industry are certainly needed. Second, it may have to try in technical development for IC tag Ratio that can read elevation moment develop suitable IC tag or reader in International Standard. Third, Need to establish concrete use policy as soon as possible in national dimension at the same time effort for international standard normalization of frequency. Finally, it shows to uses jointly with electron sealing and must solve problem about usable plan and information leak.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• 경영과학
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• 제18권1호
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• pp.1-13
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• 2001

Despite that the semiconductor industry plays an important role to our economy, it has abnormal industrial structure stressing too much on memory chips. Thus, it is essential for our corporate to develop nonmemory chips to obtain technological leadership in a highly competitive semiconductor market. In this study, we demonstrate how benefit/cost analysis using the Analytic Hierarchy process (AHP) can be used for the proper selection of nonmemory semiconductor chips: Microprocessor, ASIC, digital IC and Analogue IC. The final results show that ASIC is the most attractive chip to develop, followed by Analogue IC, digital IC and Microprocessor. This is Somewhat consistent with the information that we found with respect to the elements that were taken into consideration. Sensitivity analysis is also provided here.