• Journal of the Korean Society for Heat Treatment
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• v.31 no.6
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• pp.300-306
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• 2018

In the present study we proposed new equations to predict the liquidus temperature curve for hypoeutectic Al-Si-Cu-Mg alloy. A thermodynamic simulation was carried out to calculate the liquidus temperature, eutectic temperature and eutectic Si concentration with different Si, Cu, and Mg contents in hypoeutectic Al-Si alloys. Regressed equations were derived using the thermodynamic simulation results by multiple regression analysis. The proposed equations were compared with the equations reported previously by other researchers and agreed better with the experimental data. The addition of Cu and Mg lowered the eutectic temperature. The eutectic Si concentration was decreased by adding Cu whereas that was increased by adding Mg. Al-Si binary phase diagram was successfully predicted with a consideration of the effect of Cu and Mg addition by using the proposed equations.

• Journal of Korea Foundry Society
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• v.24 no.3
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• pp.145-152
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• 2004

The eutectic Si in Al-8.5wt.%Si alloy was changed from large flake to fine lemellar(or fibrous) shape when the Sc amount in the Al-Si alloy reaches 0.2wt.%. The optimum amount of Sc for the best modification effect was 0.8wt.% and slight decrease of modification effect occurred over this value. The study on the distribution of the modifiers(Sr, Na, and Sc) and the measurement of the surface tension of the Al-8.5wt.%Si alloy melt added with Sr, Na, and Sc modifier, respectively, reveals that Sc modifies the eutectic Si by the decrease of surface tension, while Sr and Na modify the eutectic Si mainly by impurity induced twinning mechanism.

• Journal of Korea Foundry Society
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• v.37 no.4
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• pp.108-114
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• 2017

In this study, we investigated the effect of the Si content on the secondary dendrite arm spacing (SDAS) of hypoeutectic Al-Si binary alloys in the range of 4~10 wt% Si. Cooling curves were measured during the solidification of the alloy cast in a step-wise mold. We compared two kinds of solidification time: the first is the total solidification time for both dendritic and eutectic growth, and the second is the solidification time for only dendritic growth. The proportional constant in the relationship between SDAS and cooling rate was estimated, as this constant represents the stability of the cast microstructure. The proportional constant decreased with the Si contents from 4 wt% to 8 wt%, and it remains relatively uniform with up to 10 wt% of Si.

• Journal of Korea Foundry Society
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• v.24 no.2
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• pp.79-84
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• 2004

In this study, the electromagnetic vibration is adopted for modifying eutectic Si phase and reducing its size. The higher the current density and frequency of electromagnetic vibration(EMV), the finer the size of eutectic Si phase. The tensile strength and elongation of EMVed alloy were highly improved. Measured twin probability of EMVed alloy at a frequency of 1000 Hz was approximately six times as high as that of the normal alloy. The mechanism for the increase in twin density due to EMV during solidification could be supposed from the fact that the preferential growth along <112> in silicon was suppressed by preventing Si atom from attaching to the growing interface of Si phase and by changing the solid/liquid interfacial energy of silicon. According to the result of UTS test, because of modification of eutectic Si, UTS and elongation are highly increased.

• Journal of Korea Foundry Society
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• v.15 no.3
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• pp.209-219
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• 1995

• Journal of Korea Foundry Society
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• v.18 no.6
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• pp.604-612
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• 1998

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.897-905
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• 2012

Directional solidification experiments were carried out in a hypoeutectic Al-11.3Si-3.5Cu system to investigate the microstructural evolution with the solidification rate. At a fixed temperature gradient, a dendritic microstructure was observed at a constant speed of more than $25{\mu}ms^{-1}$, a cellular interface developed at $5{\mu}ms^{-1}$ and the growth rate of $0.5{\mu}ms^{-1}$ led to the stability of the planar interface. The results revealed that primary silicon phases formed among cells, even though the studied Al-Si alloy system formed the composition within a hypoeutectic silicon composition. This suggests that the liquid concentration among cells during solidification reached a higher concentration, i.e., the eutectic concentration. It is, however, interesting that primary silicon phases did not form during a dendritic growth of more than $25{\mu}ms^{-1}$. These experimental observations are explained using the theoretical models on the interface temperatures.

• Journal of Korea Foundry Society
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• v.15 no.6
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• pp.566-573
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• 1995

In this study, the microstructural characteristics such as primary silicon, eutectic silicon, $SiC_p$ dispersion behavior, compound amount and Si solubility in $Al/SiC_p$ composite fabricated by the squeeze casting under various conditions were investigated systematically. As applied pressure(MPa) increases, cooling rate and compound amount are increased. In gravity casting, the cooling rate of hypereutectic composite is slower than of hypoeutectic composite by exothermic reaction of primary Si crystallization. But the cooling rate of hypereutectic composite is faster than that of hypoeutectic composite fabricated by same applied pressure, because amount of primary Si crystallization in hypereutectic composite was decreased, on the contrary, primary ${\alpha}-Al$ in hypoeutetic composite was increased due to increase of Si solubility in matrix by applied pressure. The crystalized primary silicon in hypereutectic composite fabricated by squeeze casting become more fine than that in non-pressure casting This is because mush zone became narrow due to increase of Si content of eutectic composition by pressure and time for growth of primary silicon got shorter according to applied pressure. It is turned out that eutectic temperature and liquidus are decreased by the increasing of squeeze pressure in all the composite due to thermal unstability of matrix owing to increasing of Si solubility in matrix by the increasing of applied pressure, as indicated in thermal anaiysis(DSC) results.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.480-485
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• 2005

Sc has been known to be an very effective ppt-hardening element in Al and Al alloys and also to be effective in modification of eutectic Si in hypoeutectic Al-Si alloys. The modification mechanism of Sc is different from that of the traditional modifier Sr in Al-Si alloys. In the present study the effects of Sc on the primary and eutectic Si in hypereutectic Al-Si alloys were investigated with evaluating the microstructures with OM, EPMA and EBSD methods. The results represent that Sc has only a small effect on primary Si when added less than $0.8wt\%$. However, when Sc addition leading to the precipitation of metallic Sc within primary Si reaches $1.6wt\%$, very coarse primary Si occurs.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.04a
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• pp.56-62
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• 2000

Semi-solid forming process has some advantages such as successful manufacturing of high quality components with less inner defects suitable for less machining high productivity and energy-saving effect. the thixotropic behavior(solid-like in the unperturbed state and liquid-like during shearing) has been the basis for the semi-solid forming process. The main focus of this article is the investigation of the effect of T6 heat treatment and alloying elements on the mechanical properties in the semi-solid formed products using thixotropic hypoeutectic (A357 and ALTHIX 86S) and hypereutectic(A390) materials. The new methods to produce semi-solid formed components with high quality are also proposed and discussed in terms of a die design and the development of a lubricant.