• Smart Media Journal
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• v.3 no.4
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• pp.28-34
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• 2014

Recently the depth-image-based rendering (DIBR) method is usually used in 3D image application filed. Virtual view image is created by using a known view with associated depth map to make a virtual view point which did not taken by the camera. But, disocclusion area occur because the virtual view point is created using a depth image based image 3D warping. To remove those kind of disocclusion region, many hole filling methods are proposed until now. Constant color region searching, horizontal interpolation, horizontal extrapolation, and variational inpainting techniques are proposed as a hole filling methods. But when using those hole filling method some problem occurred. The different types of annoying artifacts are appear in texture region hole filling procedure. In this paper to solve those problem, the multi-directional extrapolation method is newly proposed for efficiency of expanded hole filling performance. The proposed method is efficient when performing hole filling which complex texture background region. Consideration of directionality for hole filling method use the hole neighbor texture pixel value when estimate the hole pixel value. We can check the proposed hole filling method can more efficiently fill the hole region which generated by virtual view synthesis result.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2019.05a
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• pp.160-161
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• 2019

As a method for modeling a three-dimensional object, there are a method using a 3D scanner, a method using a motion capture system, and a method using a Kinect system. Through this method, a portion that is not captured due to occlusion occurs in the process of creating a three-dimensional object. In order to implement a perfect three-dimensional object, it is necessary to arbitrarily fill the obscured part. There is a technique to fill the unexposed part by various image processing methods. In this study, we propose a method using GANs, which is the latest trend of unsupervised machine learning, as a method for more natural hole-filling.

• ETRI Journal
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• v.38 no.5
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• pp.996-1007
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• 2016

This paper presents new hole-filling methods for generating multiview images by using depth image based rendering (DIBR). Holes appear in a depth image captured from 3D sensors and in the multiview images rendered by DIBR. The holes are often found around the background regions of the images because the background is prone to occlusions by the foreground objects. Background-oriented priority and gradient-oriented priority are also introduced to find the order of hole-filling after the DIBR process. In addition, to obtain a sample to fill the hole region, we propose the fusing of depth and color information to obtain a weighted sum of two patches for the depth (or rendered depth) images and a new distance measure to find the best-matched patch for the rendered color images. The conventional method produces jagged edges and a blurry phenomenon in the final results, whereas the proposed method can minimize them, which is quite important for high fidelity in stereo imaging. The experimental results show that, by reducing these errors, the proposed methods can significantly improve the hole-filling quality in the multiview images generated.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.6 no.10
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• pp.2663-2678
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• 2012

Due to sharp depth transition, big holes may be found in the novel view that is synthesized by depth-image-based rendering (DIBR). A hole-filling method based on disparity map is proposed. One important aspect of the method is that the disparity map of destination image is used for hole-filling, instead of the depth image of reference image. Firstly, the big hole detection based on disparity map is conducted, and the start point and the end point of the hole are recorded. Then foreground pixels and background pixels are distinguished for hole-dilating according to disparity map, so that areas with matching errors can be determined and eliminated. In addition, parallaxes of pixels in the area with holes and matching errors are changed to new values. Finally, holes are filled with background pixels from reference image according to these new parallaxes. Experimental results show that the quality of the new view after hole-filling is quite well; and geometric distortions are avoided in destination image, in contrast to the virtual view generated by depth-smoothing methods and image inpainting methods. Moreover, this method is easy for hardware implementation.

• Journal of KIISE
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• v.44 no.2
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• pp.186-194
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• 2017

Depth-image-based rendering is a technique that can be applied in a variety of 3D-display systems. It generates the images that have been captured from virtual viewpoints by using a depth map. However, disoccluded hole-filling problems remain a challenging issue, as a newly exposed area appears in the virtual view. Image inpainting is a popular approach for the filling of the hole region. This paper presents a robust hole-filling method that reduces the error and generates a high quality-virtual view. First, the adaptive-patch size is decided using the color and depth information. Also, a partial filling method for which the patch similarity is used is proposed. These efforts reduce the error occurrence and the propagation. The experiment results show that the proposed method synthesizes the virtual view with a higher visual comfort compared with the existing methods.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Current Optics and Photonics
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• v.4 no.6
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• pp.545-550
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• 2020

We propose a hole-filling method to solve discontinuous depth representation and to reduce the visible seams and cracks that cause the limitation of the viewing angle of the three-dimensional (3D) image in the multilayer type 3D display system. The occlusion and the disocclusion regions between layers, such as the visible seams and cracks, are a major bottleneck of the multilayer type 3D display system to represent a volumetric 3D image by stacking multiple images. As a result, in the reconstructed 3D image, the visible seams and cracks appear as brighter overlapping and undesirable cut-off. In order to resolve the problems above, we applied the depth-fused effect to the sub-depth map generating algorithm and improve the viewing characteristics of the multilayer type 3D display. The experimental demonstrations are also provided to verify the proposed scheme.

• Journal of the Korea Society of Computer and Information
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• v.17 no.7
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• pp.53-65
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• 2012

Existing method of creating Stereoscopy image, creates viewpoint image from the left and right by shooting one object with 2 lens in certain distance. However, in case of 3-D TV using Stereoscopy camera, the necessity to transmit 2 viewpoint images from the left and right simultaneously, increases the amount of bandwidth. Various and more effective alternatives are under discussion. Among the alternatives, DIBR(Depth Image Based Rendering) creates viewpoint images from the left and right using one image and its Depth information, thus decreasing the amount of transmitted bandwidth. For this reason, there have been various studies on Algorithm to create DIBR Image in existing Static Scene. In this paper, I would like to suggest Gaussian Hole-filling solution, which utilizes reverse-depth image to fill the hole naturally, while minimizing distortion of background. In addition, we have analyzed the effectiveness of each Algorithm by comparing and calculating its functions.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.117-123
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• 2014

Cu through-vias, which can be used as thermal vias or vertical interconnects, were formed using bottom-up electrodeposition filling as well as top-down electrodeposition filling into open via-holes and their microstructures were observed. Solid Cu through-vias without voids could be successfully formed by bottom-up filling as well as top-down filling with direct-current electrodeposition. While chemical-mechanical polishing (CMP) to remove the overplated Cu layer was needed on both top and bottom surfaces of the specimen processed by top-down filling method, the bottomup process has an advantage that such CMP was necessary only on the top surface of the sample.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.190-199
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• 2006

A new approach which combines implicit surface scheme and recursive subdivision method is suggested in order to fill the holes with complex shapes in the polygon model. In the method, a base surface is constructed by creating smooth implicit surface from the points selected in the neighborhood of holes. In order to assure C$^1$ continuity between the newly generated surface and the original polygon model, offset points of same number as the selected points are used as the augmented constraint conditions in the calculation of implicit surface. In this paper the well-known recursive subdivision method is used in order to generate the triangular net with good quality using the hole boundary curve and generated base implicit surface. An efficient anisotropic smoothing algorithm is introduced to eliminate the unwanted noise data and improve the quality of polygon model. The effectiveness and validity of the proposed method are demonstrated by performing numerical experiments for the various types of holes and polygon model.