• 제목/요약/키워드: Hole Quality

검색결과 394건 처리시간 0.024초

Enhanced Spectral Hole Substitution for Improving Speech Quality in Low Bit-Rate Audio Coding

  • Lee, Chang-Heon;Kang, Hong-Goo
    • The Journal of the Acoustical Society of Korea
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    • 제29권3E호
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    • pp.131-139
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    • 2010
  • This paper proposes a novel spectral hole substitution technique for low bit-rate audio coding. The spectral holes frequently occurring in relatively weak energy bands due to zero bit quantization result in severe quality degradation, especially for harmonic signals such as speech vowels. The enhanced aacPlus (EAAC) audio codec artificially adjusts the minimum signal-to-mask ratio (SMR) to reduce the number of spectral holes, but it still produces noisy sound. The proposed method selectively predicts the spectral shapes of hole bands using either intra-band correlation, i.e. harmonically related coefficients nearby or inter-band correlation, i.e. previous frames. For the bands that have low prediction gain, only the energy term is quantized and spectral shapes are replaced by pseudo random values in the decoding stage. To minimize perceptual distortion caused by spectral mismatching, the criterion of the just noticeable level difference (JNLD) and spectral similarity between original and predicted shapes are adopted for quantizing the energy term. Simulation results show that the proposed method implemented into the EAAC baseline coder significantly improves speech quality at low bit-rates while keeping equivalent quality for mixed and music contents.

거버너샤프트 교차구멍 내경의 전해디버링 특성에 관한 연구 (A study on the characteristics of electrochemical deburring in the governor shaft cross hole)

  • 최인휴;김정두
    • 대한기계학회논문집A
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    • 제21권12호
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    • pp.1984-1991
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    • 1997
  • Recently burr technology is rising in the fields of the precision manufacturing and the high quality machining, deburring has treated as a difficult problem on going to the high efficiency, automation in the FMS. Removal of burr with various shapes, dimensions and properties couldn't be standardized and has depended on manual treatment. Especially, deburring for cross hole inside owing to passing through out perpendicular to a main hole is more difficult, the electrochemical method is proper as its solution at practical aspects. Burr elimination in the cross hole drilling of governor shaft used in the automobile engine so far has been worked by a manual post-processing by a skillful worker, which becomes a factor of productivity-down and cost-up so that improvement of machining process is needed. Therefore, for the high efficiency and automation of internal deburring in the cross hole, development of electrochemical deburring technology is needed. So, the new process in the burr treatment is supposed. In this study, characteristics of electrochemical deburring through experiments were identified and factors such as electrolytic gap and electorlytic fluid contributed to removal burr height were analyzed. Also, deburring efficiency and electrolytic performance for cross hole were examined according to electrolytic current and electrochemical deburring condition corresponding to acquired edge quality was found out.

Calibrating black hole mass estimators using high quality Keck spectra

  • 박다우;우종학
    • 천문학회보
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    • 제36권1호
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    • pp.52.1-52.1
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    • 2011
  • Black hole masses of Active Galactic Nuclei (AGN) are one of the most important parameters in AGN physics. Based on the virial assumption, black hole masses can be determined from the product of the width of the broad emission lines and the continuum/line luminosities. Using the Low Resolution Imaging Spectrometer(LRIS) at the Keck telescope, we obtained high quality spectra (S/N~100), covering 2300-5500A in the rest-frame, for a sample of 37 intermediate-luminosity AGN at z~0.4, in order to calibrate various black hole mass estimators based on the Mg II (2798A) and the Hbeta (4861A) emission lines. After subtracting continuum and complex FeII emission under Mg II and Hbeta, we fit the broad emission lines using high order Guass-Hermite models to best constrain the profile and the width of the emission lines. Combining the SDSS spectra covering Halpha emission line with the Keck spectra, we determine a set of 6 black hole masses for each object, based on the line width (MgII, Hbeta, and Halpha) and the luminosity (LMgII, LHbeta, LHalpha, L3000, L5100), and calibrate each black hole mass estimator. We will present uncertainties and limitations of each mass estimator.

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초음파 진동을 이용한 미세구멍 가공기술 (A Study on Micro-hole Machining Technology using Ultrasonic vibration)

  • 이석우;최헌종;이봉구;최영재
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.231-234
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    • 2002
  • Ultrasonic machining technology has been developed over recent years for the manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile. Ultrasonic machining process is an efficient and economical means of precision machining of ceramic materials. The process is non-thermal, non-chemical and non-electric and hardly creates changes to the mechanical properties of the brittle materials machined. This paper describes the characteristics of the micro-hole of $\textrm{Al}_2\textrm{O}_3$ by ultrasonic machining with tungsten carbide tool. The effects of various parameters of ultrasonic machining, including abrasives, machining force and pressure, on the material removal rate, hole quality, and tool wear presented and discussed. The ultrasonic Machining of micro-holes in ceramics has been under taken and the machining mechanism in the ultrasonic machining of ceramics based on the fracture-mechanics concept has been analyzed.

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LTCC 기판의 미세 비아홀 펀칭 중 공정 변수의 영향 평가 (Evaluation of punching process variables influencing micro via-hole quality of LTCC green sheet)

  • 백승욱;임성한;오수익;윤성만;이상목;김승수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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    • pp.260-265
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    • 2004
  • LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

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Hole quality assessment of drilled CFRP and CFRP-Ti stacks holes using polycrystalline diamond (PCD) tools

  • Kim, Dave;Beal, Aaron;Kang, Kiweon;Kim, Sang-Young
    • Carbon letters
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    • 제23권
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    • pp.1-8
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    • 2017
  • Polycrystalline diamond (PCD) tools possessing high hardness and abrasive wear resistance are particularly suited for drilling of carbon fiber reinforced plastic (CFRP) composites, where tool life and consistent hole quality are important. While PCD presents superior performance when drilling CFRP, it is unclear how it performs when drilling multi-stack materials such as CFRP-titanium (Ti) stacks. This comparative study aims to investigate drilling of a Ti plate stacked on a CFRP panel when using PCD tools. The first sequence of the drilling experiments was to drill 20 holes in CFRP only. CFRP-Ti stacks were then drilled for the next 20 holes with the same drill bit. CFRP holes and CFRP-Ti stack holes were evaluated in terms of machined hole quality. The main tool wear mechanism of PCD drills is micro-fractures that occur when machining the Ti plate of the stack. Tool wear increases the instability and the operation temperature when machining the Ti plate. This results in high drilling forces, large hole diameter errors, high surface roughness, wider CFRP exit thermal damage, and taller exit Ti burrs.

MICRO HOLE FABRICATION BY MECHANICAL PUNCHING PROCESS

  • Joo B. Y.;Rhim S. H.;Oh S. I.
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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    • pp.179-188
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    • 2003
  • The objective of our study is to investigate the micro fabric ability by conventional metal forming processes. In the present investigation, micro hole punching was studied. We tried to control punching process at the micro level and scaled down the standard blanking condition for $25{\mu}m$ hole fabrication. To accommodate this, tungsten carbide tooling sets and micro punching press were carefully designed and assembled meeting accuracy requirements for $25{\mu}m$ hole punching. With our developments, 100, 50, and $25{\mu}m$ holes were successfully made on metal foils such as brass and stainless steel of 100, 50, and $25{\mu}m$ in thickness, respectively, and hole sizes and shapes were measured and analyzed to investigate fabrication accuracy. Shear behavior during micro punching was also discussed. Our study showed that the conventional punching process could produce high quality holes down to $25{\mu}m$.

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미세 비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성 (Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process)

  • 신승용;임성한;주병윤;오수익
    • 소성∙가공
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    • 제13권1호
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    • pp.65-71
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    • 2004
  • Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

머신비젼을 이용한 구멍 정밀도의 기상측정시스템 개발 (On-Machine Measurement System Development of Hole Accuracy using Machine Vision)

  • 김민호;김태영
    • 한국정밀공학회지
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    • 제27권5호
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    • pp.7-13
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    • 2010
  • The integrity and accuracy of the drilling hole are decided by positional error, diameter error, the roundness, the straightness, the cylindericity, size of the burr, the surface roundness and others. Among these parameters, positional error and diameter error have the most important parameters. The diameter error has been widely studied, but there has been little research done about the positional error due to the difficulty of measuring it. The measurement of hole location and diameter would be performed by CMM(Coordinate Measurement Machine). However, the usage of CMM requires much time and cost. In order to overcome the difficulties, we have developed a hole location and diameter error measuring device using machine vision. The developed measurement device attached to a CNC machine can determine hole quality quickly and easily.