• Transactions on Electrical and Electronic Materials
• /
• 제14권2호
• /
• pp.63-66
• /
• 2013

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

• 한국기계가공학회지
• /
• 제14권4호
• /
• pp.118-125
• /
• 2015

The roll-forming process is a highly productive incremental forming process and is suitable for manufacturing thin, high-strength steel products. Recently, this process has been considered one of the most productive processes in manufacturing high-strength steel automotive structural parts. However, it is very difficult to develop the roll-forming process when the cross-sectional shape of the product changes in the longitudinal direction. In this study, a roll-forming process for manufacturing high-strength steel automotive parts with a linearly variable symmetric hat-type cross-section was developed. The forming rolls were designed by the 3D CAD system, CATIA. Additionally, the designed forming rolls were modified by the simulation through the 3D elastic-plastic finite element analysis software, MARC. The results of the finite element analysis show that the final roll-forming roll can successfully produce the desired high-strength steel automotive part with a variable cross-section.

• International Journal of Reliability and Applications
• /
• 제1권1호
• /
• pp.1-14
• /
• 2000

The global marketplace is highly competitive and organisations, who want to survive long-term, have to continuously improve, change and adapt in response to market demands. These improvements should focus on cost cutting, increasing productivity levels and quality and guaranteeing deliveries in order to satisfy customers. Total Productive Maintenance (TPM) is one method, which can be used to achieve these goals. TPM is a change management approach that involves employees from both production and maintenance departments. The purpose is to eliminate major production losses by introducing a program of continuous and systematic improvements to production equipment. TPM should be developed and expanded to embrace the whole organisation and all employees should be involved in the process as members of improvement teams. This paper gives a short description of the development of TPM and the TPM implementation process. Findings are reported from a case study in which one of the authors had the possibility of following and guiding a company through their TPM implementation. The implementation process takes several years and the research has focused on the initial three years. The study demonstrates that driving forces, obstacles and difficulties often are dependent on the organisation, its managers and the individual employees.

• 한국멀티미디어학회논문지
• /
• 제10권12호
• /
• pp.1704-1713
• /
• 2007

Contents industry is growing into a versatile area whose contents can be embodied through not only traditional media such as theater and TV, but also new ones such as the internet, mobile unit, PDA, DMP, etc. In addition, highly advanced computer technology and contents are harmoniously combined for image development featuring multi-channels, which produces various contents, and thus, creating synergy effects with other key industries such as IT, strengthens the domestic economy as an industry of value expansion and new high value items. To this end, this study is to present development plans that are highly productive and valued to domestic contents development companies. For this, the focus was put on the fact that concurrent engineering, which is the mechanism bringing very beneficial effects to existing analog product development processes, and the team system have significant, positive effect on the company productiveness and competitive market values among digital contents related companies, especially contents businesses.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.499-499
• /
• 2012

This study was evaluated on etcher of capacitive coupled plasmas with OES (Optical Emission Spectroscopy) and impedance by VI probe that are widely used for process control and monitoring at semiconductor industry. The experiment was operated at conventional Ar and C4F8 plasma with variable change such as pressure and addition of gas (Atmospheric Leak: N2 and O2), RF, pressure, that are highly possible to impact wafer yield during wafer process, in order to observe OES and VI Probe signals. The sensitivity change on OES and Impedance by Vi probe was analyzed by statistical method to determine healthy of process. The main goal of this study is to understand unwanted tool performance to eventually improve productive capability. It is important for process engineers to actively adjust tool parameter before any serious problem occurs.

• 한국표면공학회지
• /
• 제32권3호
• /
• pp.253-256
• /
• 1999

Wet plating has been initiated and developed as a major surface finishing technology as of the long customized and highly productive process until now. As the external compression by virtue of the environmental preservation becomes stricter, there has been new move to adapt dry plating line instead of conventional wet plating one in domestic surface finishing industry. Dry plating, so-called, plasma surface technology has been developed in semiconducting industry and becomes a key technology to be useful as an alternative to wet plating in surface finishing industry. The historical progress of domestic surface finishing industry was outlined with the background on the adaptation of three dry plating processes-plasma spraying, plasma nitriding and ion plating. The present status of domestic industrial activity was covered on major alternative to wet plating.

• 해양환경안전학회지
• /
• 제19권3호
• /
• pp.277-284
• /
• 2013

To ensure that the production system of a factory is efficient, the factory layout design should consider the location and material flow plans of facilities, workshops, and storage areas. Highly productive factories need to have an optimized layout planning process, and a customized design methodology of the production system is a necessity for feasible layout planning. This paper presents a method for designing a layout module's size and shape and provides a heuristic location-allocation algorithm for the modules. The method is implemented and validated using a rich internet application-based platform. The layout design method is based on the leisure ship production process; this method can be used for designing the layout of a new factory or remodeling an existing factory and its production system. In contrast to existing layout methods, the inputs required for the proposed method, such as target products, production processes, and human-resource plans, are simple. This layout design method provides a useful solution for the initial stage of factory design.

• Transactions on Electrical and Electronic Materials
• /
• 제15권2호
• /
• pp.91-95
• /
• 2014

This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
• /
• pp.1590-1592
• /
• 2009

The ubiquitous nature of large area TFT-LCD televisions are truly one of the major success stories of consumer electronic products for the $21^{st}$ century. It is the industry's ability to lower prices over the years that have made TFT-LCD television an affordable option for the majority of consumers. TFT-LCD equipment manufacturers have played a major role these cost reduction efforts. Increasing requirements for high process quality like for eg UHD panels need to be met simultaneously with the demand of an highly productive and reliable equipment. AKT provides an excellent PVD product by improving performance and cost of ownership (CoO) for Gen8.5 and beyond.

• 한국정보과학회논문지:컴퓨팅의 실제 및 레터
• /
• 제16권11호
• /
• pp.1056-1060
• /
• 2010

항공 시스템에 사용되는 소프트웨어는 높은 신뢰성과 생산성이 요구된다. 이와 같은 요구로 인하여 IMA(Integrated Modular Avionics)의 파티션 OS 개념을 가진 ARINC 653 같은 항공 시스템 운영체제와 응용프로그램 간 인터페이스를 정의한 표준이 등장하였다. ARINC 653을 사용한 운영체제나 유인 항공기의 예는 많다. 하지만 아직까지 무인 항공기를 위한 리녹스 기반의 ARINC 653은 연구된 바 없다. 리녹스는 항공 ARINC 653의 요구사항을 충분히 충족시킬 수 있는 잠재력을 가지고 있다. 본 논문에서는 리녹스 기반의 ARINC 653 프로세스 모델을 위한 설계를 제안하고 초기 버전을 구현한다. 구현된 결과물을 통해 제시된 리녹스 기반 ARINC 653이 무인 항공기에 충분히 활용 가능함을 보인다.