• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.63-66
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• 2013

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.118-125
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• 2015

The roll-forming process is a highly productive incremental forming process and is suitable for manufacturing thin, high-strength steel products. Recently, this process has been considered one of the most productive processes in manufacturing high-strength steel automotive structural parts. However, it is very difficult to develop the roll-forming process when the cross-sectional shape of the product changes in the longitudinal direction. In this study, a roll-forming process for manufacturing high-strength steel automotive parts with a linearly variable symmetric hat-type cross-section was developed. The forming rolls were designed by the 3D CAD system, CATIA. Additionally, the designed forming rolls were modified by the simulation through the 3D elastic-plastic finite element analysis software, MARC. The results of the finite element analysis show that the final roll-forming roll can successfully produce the desired high-strength steel automotive part with a variable cross-section.

• International Journal of Reliability and Applications
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• v.1 no.1
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• pp.1-14
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• 2000

The global marketplace is highly competitive and organisations, who want to survive long-term, have to continuously improve, change and adapt in response to market demands. These improvements should focus on cost cutting, increasing productivity levels and quality and guaranteeing deliveries in order to satisfy customers. Total Productive Maintenance (TPM) is one method, which can be used to achieve these goals. TPM is a change management approach that involves employees from both production and maintenance departments. The purpose is to eliminate major production losses by introducing a program of continuous and systematic improvements to production equipment. TPM should be developed and expanded to embrace the whole organisation and all employees should be involved in the process as members of improvement teams. This paper gives a short description of the development of TPM and the TPM implementation process. Findings are reported from a case study in which one of the authors had the possibility of following and guiding a company through their TPM implementation. The implementation process takes several years and the research has focused on the initial three years. The study demonstrates that driving forces, obstacles and difficulties often are dependent on the organisation, its managers and the individual employees.

• Journal of Korea Multimedia Society
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• v.10 no.12
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• pp.1704-1713
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• 2007

Contents industry is growing into a versatile area whose contents can be embodied through not only traditional media such as theater and TV, but also new ones such as the internet, mobile unit, PDA, DMP, etc. In addition, highly advanced computer technology and contents are harmoniously combined for image development featuring multi-channels, which produces various contents, and thus, creating synergy effects with other key industries such as IT, strengthens the domestic economy as an industry of value expansion and new high value items. To this end, this study is to present development plans that are highly productive and valued to domestic contents development companies. For this, the focus was put on the fact that concurrent engineering, which is the mechanism bringing very beneficial effects to existing analog product development processes, and the team system have significant, positive effect on the company productiveness and competitive market values among digital contents related companies, especially contents businesses.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.499-499
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• 2012

This study was evaluated on etcher of capacitive coupled plasmas with OES (Optical Emission Spectroscopy) and impedance by VI probe that are widely used for process control and monitoring at semiconductor industry. The experiment was operated at conventional Ar and C4F8 plasma with variable change such as pressure and addition of gas (Atmospheric Leak: N2 and O2), RF, pressure, that are highly possible to impact wafer yield during wafer process, in order to observe OES and VI Probe signals. The sensitivity change on OES and Impedance by Vi probe was analyzed by statistical method to determine healthy of process. The main goal of this study is to understand unwanted tool performance to eventually improve productive capability. It is important for process engineers to actively adjust tool parameter before any serious problem occurs.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.253-256
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• 1999

Wet plating has been initiated and developed as a major surface finishing technology as of the long customized and highly productive process until now. As the external compression by virtue of the environmental preservation becomes stricter, there has been new move to adapt dry plating line instead of conventional wet plating one in domestic surface finishing industry. Dry plating, so-called, plasma surface technology has been developed in semiconducting industry and becomes a key technology to be useful as an alternative to wet plating in surface finishing industry. The historical progress of domestic surface finishing industry was outlined with the background on the adaptation of three dry plating processes-plasma spraying, plasma nitriding and ion plating. The present status of domestic industrial activity was covered on major alternative to wet plating.

• Journal of the Korean Society of Marine Environment & Safety
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• v.19 no.3
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• pp.277-284
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• 2013

To ensure that the production system of a factory is efficient, the factory layout design should consider the location and material flow plans of facilities, workshops, and storage areas. Highly productive factories need to have an optimized layout planning process, and a customized design methodology of the production system is a necessity for feasible layout planning. This paper presents a method for designing a layout module's size and shape and provides a heuristic location-allocation algorithm for the modules. The method is implemented and validated using a rich internet application-based platform. The layout design method is based on the leisure ship production process; this method can be used for designing the layout of a new factory or remodeling an existing factory and its production system. In contrast to existing layout methods, the inputs required for the proposed method, such as target products, production processes, and human-resource plans, are simple. This layout design method provides a useful solution for the initial stage of factory design.

• Transactions on Electrical and Electronic Materials
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• v.15 no.2
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• pp.91-95
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• 2014

This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1590-1592
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• 2009

The ubiquitous nature of large area TFT-LCD televisions are truly one of the major success stories of consumer electronic products for the $21^{st}$ century. It is the industry's ability to lower prices over the years that have made TFT-LCD television an affordable option for the majority of consumers. TFT-LCD equipment manufacturers have played a major role these cost reduction efforts. Increasing requirements for high process quality like for eg UHD panels need to be met simultaneously with the demand of an highly productive and reliable equipment. AKT provides an excellent PVD product by improving performance and cost of ownership (CoO) for Gen8.5 and beyond.

• Journal of KIISE:Computing Practices and Letters
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• v.16 no.11
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• pp.1056-1060
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• 2010

The software running on avionic systems is required to be highly reliable and productive. Due to these demands, the standard such as ARINC 653 has been suggested, which includes the abstraction of resource partitioning and defines interfaces between avionic operating system and applications. Though there are many manned aerial vehicles employing ARINC 653 based operating systems, Linux-based ARINC 653 for unmanned aerial vehicles has not been studied yet. In this paper, we propose the design of Linux-based ARINC 653 process model and present preliminary implementation. The experiment results present that the implementation is enough to support control software of unmanned helicopter.