• Title/Summary/Keyword: Highly Accelerated Life Test

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Highly Accelerated Life Tests for Auto-Connector in Use-Environment (자동차 환경을 고려한 커넥터의 가속시험에 관한 연구)

  • Kim Jong-Gurl;Kim Jin-Hawn
    • Proceedings of the Safety Management and Science Conference
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    • 2004.11a
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    • pp.229-235
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    • 2004
  • This paper treats accelerated life tests for automotive connector. The contact resistance of connector is explained by some factors; the use time(calender time, real cycle), stresses and loads adapted in auto test. The relationships between contact resistance and some factors are compared and analyzed by regression models in various test conditions; field use-environment, manufacturer's test environment, and accelerated test condition. The consistency between of manufacturer's test and field test is examined. Finally, the future study on accelerated test for automotive connector is presented.

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Accelerated Life Evaluation of Propeller Shaft for Forklift Truck (지게차용 추진축의 가속 수명 평가)

  • Kim, Do-Sik;Sung, Baek-Ju
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.11
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    • pp.1221-1229
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    • 2014
  • This paper proposes an approach for predicting the fatigue life of a propeller shaft of a forklift truck by an accelerated life test method. The accelerated life test method adopted in this study is the calibrated accelerated life test, which is highly effective in the prediction of the lifetime and enables significant reduction of the test time as well as a quantification of reliability in the case of small sample sizes. First, the fatigue test was performed under two high stress levels, and then, it was performed by setting low stress levels in consideration of the available test time and extrapolation. Major reliability parameters such as the lifetime, accelerated power index, and shape parameter were obtained experimentally, and the experimentally predicted lifetime of the propeller shaft was verified through comparison with results of an analysis of load spectrum data under actual operating conditions.

Research Results and Trends Analysis on Accelerated Testing for Ensuring High Reliability (고 신뢰성 확보를 위한 가속시험의 연구동향 분석)

  • Kim, Jong-Gurl;Song, Jung-Moo
    • Proceedings of the Safety Management and Science Conference
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    • 2011.04a
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    • pp.419-432
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    • 2011
  • 제품의 신뢰성에 대한 소비자의 인식이 높아짐에 따라 기업에서는 높은 품질과 신뢰성 있는 제품을 만들기 위해 많은 노력을 하고 있다. 신뢰성은 기기, 부품, 재료 등 시스템이 규정된 조건하에서, 의도하는 기간 동안 규정된 기능을 고장 없이 수행할 수 있는 성질로 규정된다. 높은 신뢰성의 확보를 위한 제품의 신뢰성 시험은 많은 시간과 비용이 소모되기 때문에 현대의 빠른 시장 흐름에 따라가지 못한다. 특히, 최근 기술발전 속도가 빨라지고 제품 수명주기(Life Cycle)와 개발 기간이 짧아지고 있는 추세에 있으므로 이에 대응할 수 있는 신속한 시험방법의 실시가 반드시 필요한 시점이다. 위와 같은 신뢰성을 갖는 제품의 시험의 한계를 극복하고 시험시간을 단축하기 위한 여러 가지 방법이 연구되어 왔고, 그 중 가속 시험(Accelerated Test)에 대한 필요성과 요구가 계속 증가하고 있는 추세다. 본 연구에서는 단순부품과 재료의 신뢰도 정보를 신속하게 얻는데 매우 유용한 신뢰성 시험방법 중에 하나인 가속시험의 연구동향과 적용 현황을 분석하고 이의 효과적인 적용과 활용방안을 모색 하고자 한다.

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Verification for the design limit margin of the power device using the HALT reliability test

  • Chang, YuShin
    • Journal of the Korea Society of Computer and Information
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    • v.23 no.11
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    • pp.67-74
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    • 2018
  • The verification for the design limit margin of the power device for the information communication and surveillance systems using HALT(Highly Accelerated Life Test) reliability test is described. The HALT reliability test performs with a step stress method which change condition until the marginal step in a design and development phase. The HALT test methods are the low temperature(cold) step stress test, the high temperature(hot) step stress test, the thermal shock cyclic stess test, and the high temperature destruct limit(hot DL) step stress test. The power device is checked the operating performance during the test. In this paper, the HALT was performed to find out the design limit margin of the power device.

Accelerated Life Test and Data Analysis of the Silver Through Hole Printed Wiring Board (가속수명시험을 이용한 은도통홀 인쇄회로기판의 신뢰성연구)

  • 전영호;권이장
    • Journal of Korean Society for Quality Management
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    • v.25 no.2
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    • pp.15-27
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    • 1997
  • This paper describes a highly accelerated life test (HALT, USPCBT) method for rapid qualification testing of STH PWB(Silver Through Hole Printed Wiring Boards). This method was carried out to be an alternative to the present time-consuming standard 1344 hours life testing(THB). The accelerated life test conditions were $121^{\circ}C$/95%R.H. at 50V bias and without bias. Their results are compared with those observed in the standard 1344 hours life test at $40^{\circ}C$/95%R.H. at 50V bias and without bias. The studies were focused on the samples time-to-failure as well as the associated conduction and failure mechanisms. The abrupt drop of insulation resistance is due to the absorption of water vapour. And the continuous drop of insulation resistance is due to the Ag migration. The ratios of time-to-failure of HALT(USPCBT) to THB were 25 and 11 at 50V bias and without bias respectively.

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Fatigue Life Estimation of Shot Peened Metal Using Accelerated Life Testing (가속수명시험법을 이용한 쇼트피닝가공 금속의 피로수명예측)

  • Kang, Jin-Shik;Nam, Ji-Hun;Lee, Jae-Heon;Cheong, Seong-Kyun
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.184-189
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    • 2004
  • Shot peening process is used as one of the various kinds of techniques to improve the fatigue properties. However, to obtain fatigue properties of metal materials, many efforts and time are needed. Because the fatigue life of shot peened metals increases highly. In this paper, fatigue properties of shot peened Al 7075-T6 are estimated using the fundamental of accelerated life test to reduce the experimental. Experimental results show that the estimated life data almost agree with actual rotary bending fatigue test data within 7% error.

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Study of Life Prediction and Failure Mechanisms of Cramic Heater for Home Appliance (가전 제품용 세라믹 히터의 수명 및 고장 원인에 대한 연구)

  • Choi, Hyoungseuk
    • Journal of Applied Reliability
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    • v.17 no.4
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    • pp.355-361
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    • 2017
  • Purpose: The purpose of this research is to establish the life test method for ceramic heater and identify the failure mechanisms. Methods: We do accelerated life test in the condition of thermal shock and failure analysis for failed samples. Conclusion: The main failure mechanisms of ceramic heater are identified as overstress failure mechanisms as results of failure analysis and the shape parameters of weibull distribution by accelerated life test are identified as 0.8, 1.2 and 0.4 each at $400^{\circ}C$, $600^{\circ}C$ and $900^{\circ}C$. At $900^{\circ}C$, the shape parameter 0.4 means that It is exactly initial failure caused that the stress exceeds the strength of ceramic heater highly and the shape parameters 0.8, 1.2 at $400^{\circ}C$, $600^{\circ}C$ means that the shape parameters are around 1.0 so that the main failure mechanism is overstress failure which is same result as failure analysis. It means that the appropriate life test method for ceramic heater is reliability qualification test method rather than accelerated life test.

전장품의 신뢰성 향상을 위한 HALT기법 연구

  • Lee, Hui-Bok;Wi, Sin-Hwan;Park, Dong-Gyu
    • Proceedings of the Korean Reliability Society Conference
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    • 2011.06a
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    • pp.55-60
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    • 2011
  • Recently, the application of electronics in vehicle is increasing, in order to assess the reliability of the electronics, highly accelerated life test is used, highly accelerated life test can assess the reliability of the electronics in the short time. In this study, optimized HALT technique can be applied to the electronics is proposed. The main results are as follows; i) HALT is proceed to the 8-step process. ii) The test mode of HALT is composed of the cold step stress, hot step stress, vibration step stress and combined environments stress. iii) The time dwell is set to at least 20 minutes.

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Analysis the Reliability of Multilayer Ceramic Capacitor with inner Ni Electrode under highly Accelerated Life Test Conditions

  • Yoon, Jung-Rag;Lee, Kyung-Min;Lee, Serk-Won
    • Transactions on Electrical and Electronic Materials
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    • v.10 no.1
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    • pp.5-8
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    • 2009
  • The reliability of multilayer ceramic capacitor with active thin dielectric layer was investigated by highly accelerated life test at various stress condition. The distribution of multilayer ceramic capacitor failure times is plotted as a function of time from Weibull distribution function. According to the test result, voltage acceleration factor is obtained from 2.24 to 2.96. The acceleration by temperature is much higher than other values of active thick dielectric layer. It is clear that median time to failure is affected by the stress voltage for high volumetric efficiency ceramic capacitors with active thin dielectric layer. The degradation under stress of voltage involves electromigration and accumulation of oxygen vacancy at Ni electrode interface of cathode.