• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 추계학술대회 논문집
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• pp.77-81
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• 2001

The present study is concemed with the design of high pressure container reinforced by winding wire used as a die component in cold forming of metals. The stress analysis for the design of high pressure container has been made under an optimal design criterion. The wire-winding equipment and the tension control unit according to the theoretical winding force are installed. The circumferential stresses at the inner wall of die housing are measured every turn of wire-winding. The measure stresses are in good agreement with the analytically predicted ones.

• 디지털융복합연구
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• 제14권5호
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• pp.317-323
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• 2016

본 논문에서는 아두이노를 이용하여 온도시험 장비의 오동작이 발생이 되면, 이를 검출하여 주변에 이 정보를 알려 고가의 정밀 전자제품의 훼손을 방지할 수 있는 시스템을 제안한다. 정밀 전자제품은 출고전에 온도시험 장비를 이용하여 극저온, 극고온 온도 상황하에서 정상동작 여부를 확인하게 된다. 만약 이 상황하에서 장비의 오동작이 발생되면 고가의 제품이 손상을 입어 폐기하는 경우가 생긴다. 이 시스템은 특히 야간에 담당자가 없이 자동으로 시험이 진행될 때에 온도시험 장비 내에 온도 센서를 부착하여 시험 대상인 제품이 실제로 받고 있는 온도 정보를 아두이노를 이용하여 실시간으로 감시한다. 만약 시험자가 설정한 온도구간을 벗어날 경우 아두이노의 출력단에서 High 신호를 출력하여 경보 구동회로가 온도시험 장비의 전원을 차단하고 야간 근무부서의 근무자에게 이 정보를 알려, 온도 시험 중 발생할 수 있는 극고온 혹은 극저온 상황에서 고가의 시험대상 제품의 훼손을 방지할 수 있도록 설계 및 구현을 하였다. 본 논문에서 제안한 시스템은 장비의 제조사에 관계없이 모든 온도시험 장비에 적용가능하고, 저비용으로 제작 가능하다.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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• pp.186-191
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• 2003

• 한국정밀공학회지
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• 제21권10호
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.15.2-15.2
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• 2009

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.

• 반도체디스플레이기술학회지
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• 제14권4호
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• pp.67-71
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• 2015

Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

• 한국측량학회지
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• 제35권2호
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• pp.75-80
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• 2017

Recently, there has been growing interest in spatial data that combines information and communication technology with smart cities. The high-precision LiDAR (Light Dectection and Ranging) equipment is mainly used to collect three-dimensional spatial data, and the acquired data is also used to model geographic features and to manage plant construction and cultural heritages which require precision. The LiDAR equipment can collect precise data, but also has limitations because they are expensive and take long time to collect data. On the other hand, in the field of computer vision, research is being conducted on the methods of acquiring image data and performing 3D reconstruction based on image data without expensive equipment. Thus, precise 3D spatial data can be constructed efficiently by collecting and processing image data using CCTVs which are installed as infrastructure facilities in smart cities. However, this method can have an accuracy problem compared to the existing equipment. In this study, experiments were conducted and the results were analyzed to increase the number of extracted matching points by applying the feature-based method and the area-based method in order to improve the precision of 3D spatial data built with image data acquired from stereo CCTVs. For techniques to extract matching points, SIFT algorithm and PATCH algorithm were used. If precise 3D reconstruction is possible using the image data from stereo CCTVs, it will be possible to collect 3D spatial data with low-cost equipment and to collect and build data in real time because image data can be easily acquired through the Web from smart-phones and drones.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1636-1639
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• 2005

The process equipment and remote handling for the deep geological disposal of high-level radioactive waste(HLW) should be checked prior to the operation in view of reliability and operability. In this study, the concept of virtual environment workcell is implemented to analyze and define the feasible disposal process instead of real mock-up, which is very expensive and time consuming. To do this, the parts of process equipment for the disposal and maintenance will be modeled in 3-D graphics, assembled, and kinematics will be assigned. Also, the virtual workcell for the encapsulation and disposal process of spent fuel will be implemented in the graphical environment, which is the same as the real environment. This virtual workcell will have the several functions for verification such as analyses for the equipment's work space, the collision detection, the path planning and graphic simulation of the processes etc. This graphic virtual workcell of the HLW disposal process can be effectively used in designing of the processes for the hot cell equipment and enhance the reliability of the spent fuel management.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2001년도 춘계학술대회논문집
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• pp.869-874
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• 2001

In order that precision equipment using high precision industrial operate normally. vibration criteria of expected area that equipment be set up is micrometer level. that method is a trust design for apply to in field, when there attend to quantifiable method. Hence, semi -empirical method that using on the basis of experimental data about undefined information (properities of vibration source, dynamic properities of structure, etc.,) for prediction of vibration response make the use of dynamic structure design of semiconductor ＆ TFT-LCD in the inside and outside country. Like this, for doing an optimal design of dynamic about structure, it is best important to get trust data that apply to semi-empirical method that is method of prediction vibration level. In this paper, on the basis of experimental data which was offered by a manufacturing company Of precisin equipment that plan to set up in semiconductor factory, we predicted vibration response on expected area that equipment be set up.

• International Journal of Precision Engineering and Manufacturing
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• 제8권3호
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• pp.50-53
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• 2007

Improving the reliability or long-term dependability of a system requires a different approach from the previous emphasis on short-term concerns. The purpose of this paper is to present a reliability evaluation method for an oil cooler intended for high-precision machining centers. The oil cooler system in question is a cooling device that minimizes the deformation caused from the heat generated by driving devices. This system is used for machine tools and semiconductor equipment. We predicted the reliability of the system based on the failure rate database and conducted the reliability test using a test-bed to evaluate the life of the oil cooler. The results provided an indication of the reliability of the system in terms of the failure rate and the MTBF of the oil cooler system and its components, as well as a distribution of the failure mode. These results will help increase the reliability of oil cooler systems. The evaluation method can also be used to determine the reliability of other machinery products.