• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.154-157
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• 2005

The use of electron-beam(E-Beam) manufacture systems provides a means to alleviate optic exposure equipment's problems. We designed an E-beam manufacture system with SEM function. Optimal beam scanning is one of the most important conditions in the performance of E-beam and SEM. The performance of E-beam manufacture system and images of SEM are a close affinity with each other. Developed E-beam manufacture system consist of the controllers of high voltage, scanning, optic and high voltage generator. In this paper, we analyze the condition of steady beam scanning and describe the development of controller fer optimal beam scanning.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.88-95
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand fur high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The geometrical relationship between PCB, cameras, and xy$\theta$ stage is derived, and analytical equations for alignment errors are also obtained. The unknown parameters including camera declining angles and etc. can be obtained by initialization process. Finally, the proposed algorithm is verified by experiments by using test bench.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.96-104
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The centers of fiducial marks are obtained by using moment, gradient method. The first method is calculating the centroid by using first moment of blob, and the latter method is calculating the center of the circle whose equation is obtained by curve-fitting the boundaries of fiducial mark. The operating system used to implement the whole set-up is carried in Window 98 (or NT) environment. Finally we implemented this system to PCB screen printer.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.05a
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• pp.627-630
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• 2009

The combination of the marine use various multi sensor surveillance system technology with the development of servo motion control algorithm and gyro sensor in six freedom motion is implemented to analyze the movement response. The stabilization of the motion control is developed and Nano driving Precision Pan-Tilt/Gimbal system is obtained from the security positioning cameras with ultra high speed device is used to carry out the exact behavior of the device. The exact behavior will be used to make a essential equipment. Finally the development of the Nano Driving Multi Sensor, Nano of Surveillance System Driving Precision Pan-Tilt/Gimbal optimal design and production, 3-aix Gyro Sensor based with Servo Motion Control algorithm development, Image trace video software and hardware tracking the development is organized and discuss in details. The development of the equipment and the system integration are fully experimented and verified.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1289-1293
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• 2005

We will improve tools performance without the change of a tools' physical shape, if we process mirror like finishing on the surface of cutting tools. Because cutting tools' shapes are very complex, the general method of polishing can't be polished. So we will apply new method of polishing which is magnetic fluid grinding technique. Magnetic fluid grinding technique can polish complex shape's workpiece by pressing the surface of workpiece with magnetic and abrasive grains in magnetic field. Therefore we developed the polishing equipment to improve the performance of cutting tools and experimented on various polishing conditions to determine the polishing conditions of cutting tools.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.450-454
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• 1997

This system is the automatic boiler tube bending equipment which has four heads for bending the tube and the carriage for moving the tube. The system consists of two frames for transporting each moving parts, high-frequency heating equipment for heating the tube in hot bending, control panel for inputting the job data operating, remote control unit for concetration and distribution of input/output, and the monitoring system which can establish unmanned operationby receiving the bending job data via LAN form a design teamwhich produces the job data and schedule based on master production plan and diagnoses bending data change, input, whole system status, and system malfunctions. By employing this system, 30% of production improvement was achieved was achieved comparing to the existing bending system.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.84-91
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• 2010

The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.1
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• pp.413-419
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• 2011

Diagnosis X-ray equipment localized at 1950's but it is developed suddenly at 1960's with demand together. Manufacture of Diagnostic X-ray equipment is controled by the KS regulation and the Ministry of Health and Welfare because of hazardous element etc. exposure by radiation. Most of diagnostic X-ray equipment ware single phase and three phase full-wave rectification but from 1980's it transforms it was exchanged in inverter type X-ray equipment. Inverter type X-ray equipment produces approximately 50~80% more average photon intensity then single phase full-wave rectification and the accuracy is high. But from a clinic it dose not use because expensive therefor the efficiency improvement of single phase full-wave rectification is necessary. We produced single phase full-wave rectification X-ray equipment control unit, high tension transformer, filament heating transformer, rectification circuit, high tension cable and others and evaluated efficiency, in result which is excellent compare with Rule of Safety Management and KS regulation.