• Transactions on Electrical and Electronic Materials
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• v.8 no.2
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• pp.93-96
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• 2007

LCD (liquid crystal display) industry is needed to goods of high reliability and is interested in products without harmful material. In this experiment, we made the LED backlight unit for Automotive-navigation. And for making this backlight unit we used to eight side emitting type white LEDs with 1 W high power of the lumileds company. We could know that this backlight unit releases to 6500 nit in 14 W power consumption and start up voltage time is under the 15ms in the ambient temperature $-20\;^{\circ}C$.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.8
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.1
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• pp.35-38
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• 2015

LEDs are considered to be an alternative for enhancement of energy efficiency, applied for numerous areas such as display, automotive headlight not only lights. Yellow phosphor is generally utilized with blue LEDs to generate WLED, $Y_3Al_{5}O_{12}:Ce^{3+}$ is typically used as the yellow phosphor. The phosphor, mixed with epoxy resin, has been used by being spread and hardened on the blue LED chip. This paste-based packaging gives rise to problems of degradation of phosphor by heat and decrease of luminous efficiency. Although phosphor plate is used instead of the epoxy-phosphor mixture to solve these problems, loss of luminous efficacy by total internal reflection inside the plate also should be solved. In this study, we coated the side of the plate with silver as one of the solution.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.5
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• pp.615-622
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• 2015

As the development of high efficiency and high flux density LEDs, the trend of illumination lamp industry transfers from conventional-lamps to the LED-lamps. For energy efficiencies, LED lamps are superior to the conventional lamps, but they have heat problems. Especially, the heat problems are severe for the high luminance lamps. They degrade the soldering point of the metal PCB, and shorten the life cycle of LEDs. So, the solution of the heat sinking is very important to develop high luminance LED lamps. This study suggested a new method to solve the heat problems for high luminance LED lamps, and developed a LED lamp which has 1200W power. In this study, a water jacket is installed to the LED lamp, and the cooing water is circulated by a water pump.

• Journal of Industrial Technology
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• v.31 no.A
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• pp.95-101
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• 2011

According to recent technological developments in high-power LEDs, the stage lighting is one of most important areas to apply power LED system. Moving light for color rendering of stage uses the RGBW(red, green, blue, white) color mixing method. LED moving light system needs to have a wide range of dimming control as enough to operate at very low power. Also LED dimming system should not be induced color-shift and flicker in camera. This paper is experimentally verified the LED Moving Light driving circuit of 200Watt level designed to satisfy the above characteristics which applied the DC current-controlled and PWM mixed dimming method.

• Proceedings of the KIPE Conference
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• 2007.07a
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• pp.67-68
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• 2007

The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards specialty and general illumination applications. Because drive circuit of illumination LED has an effect on efficiency and life, research about the drive circuit following LED characteristic is needed. This paper proposed a implementation of the stand-alone LED lighting system using battery from photovoltaic power generation.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.295-299
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• 2012

We investigated the crystal and the optical properties of GaN-based blue light emitting diodes (LEDs) which were simultaneously grown on c-plane (0001) and semipolar (11-22) GaN templates by using metal-organic chemical vapor deposition (MOCVD). The X-ray rocking curves (XRCs) full width at half maximums (FWHMs) of c-plane (0001) and semipolar (11-22) GaN templates were 275 and 889 arcsec, respectively. In addition, high-resolution X-ray ω-2θ scan showed that satellite peaks of semipolar (11-22) InGaN quantum-wells (QWs) was weaker and broader than that of c-plane (0001) InGaN QWs, indicating that the interface quality of c-plane (0001) QWs was superior to that of semipolar (11-22) QWs. Photoluminescence (PL) and electroluminescence (EL) results showed that the emission intensity and the FWHMs of polar c-plane (0001) LED were much higher and narrower than those of semipolar (11-22) LED, respectively. From these results, we believed that relative poor crystal quality of semipolar (11-22) GaN template might give rise to the poor interfacial quality of QWs, resulting in lower output power than conventional c-plane (0001) GaN-based LEDs.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.4177-4185
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• 2012

LEDs are becoming the most suitable candidate replacing traditional fluorescent lamps because of its eco-friendly characteristics. LEDs are also actively used to design green building system and to make outdoor billboard as a back-light system due to its high energy efficiency. In this paper, we have developed AC direct driver for $12{\times}12$ FLB(flexible LED board) and LED flat light without SMPS. It has LID-PC-R101B driver IC that can support the high power factor and be composed of LED switching circuit in group. Also, an elaborate system designs can guarantee a high luminous efficiency, a high reliability and a low power consumption. The proposed FLB has the ultra slim shape of $450{\times}450$ mm, width of 4 mm and weight of 280 g. In the end, we have developed a prototype of FLB for billboard and flat light for room lighting with AC direct driver iposrder to verify the performance of the proposed system.