• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.12
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• pp.1084-1096
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• 2016

This paper presents method of design and analysis of a high-speed serial interface connector with a data rate of 12.5 Gbps. A high-speed serial interface connector is composed of various material and complex structures. It is very difficult to match the impedance of each discontinuous portion of connector. Therefore, this paper proposes the structure of a connector line that be simplified a connector. In the structure of proposed connector line, this research presents a method for extracting R, L, C and G parameters, analyzing the differential mode impedance, and minimizing the impedance discontinuity using time domain transmissometry and time domain reflectometry. This paper applies the proposed methods in the connector line to the high-speed serial interface connector. The proposed high-speed serial interface connector, which consists of forty-four pins, is analyzed signal transmission characteristics by changing the width and spacing of the four pins. According to the analysis result, as the width of the ground pin increases, the impedance decreases slightly. And as the distance between the ground pin and the signal pin increases, the impedance increases. In addition, as the width of the signal pin increases, the impedance decreases. And as the distance between the signal pin and the signal pin increases, the impedance decreases. The impedance characteristic of initial connector presents ranges from 96 to $139{\Omega}$. Impedance characteristic after applying the structure of proposed connector is shown as a value between 92.6 to $107.5{\Omega}$. This value satisfies the design objective $100{\Omega}{\pm}10%$.