• Title/Summary/Keyword: High vacuum system

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Modelling of Optimum Design of High Vacuum System for Plasma Process

  • Kim, Hyung-Taek
    • International journal of advanced smart convergence
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    • v.10 no.1
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    • pp.159-165
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    • 2021
  • Electronic devices used in the mobile environments fabricated under the plasma conditions in high vacuum system. Especially for the development of advanced electronic devices, high quality plasma as the process conditions are required. For this purpose, the variable conductance throttle valves for controllable plasma employed to the high vacuum system. In this study, we analyzed the effects of throttle valve applications on vacuum characteristics simulated to obtain the optimum design modelling for plasma conditions of high vacuum system. We used commercial simulator of vacuum system, VacSim(multi) on this study. Reliability of simulator verified by simulation of the commercially available models of high vacuum system. Simulated vacuum characteristics of the proposed modelling agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve schematized as the modelling of throttle valve for the constant process-pressure of below 10-3 torr. Simulation results plotted as pump down curve of chamber, variable valve conductance and conductance logic of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably in plasma process.

Simulations of Effects of Variable Conductance Throttle Valve on the Characteristics of High Vacuum System

  • Kim, Hyung-Taek;Cho, Han-Ho
    • International Journal of Internet, Broadcasting and Communication
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    • v.7 no.2
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    • pp.28-35
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    • 2015
  • Thin film electronic devices which brought the current mobile environment could be fabricated only under the high quality vacuum conditions provided by high vacuum systems. Especially for the development of advanced thin film devices, constant high quality vacuum as the deposition pressure is definitely needed. For this purpose, the variable conductance throttle valves were employed to the high vacuum system. In this study, the effects of throttle valve applications on vacuum characteristics were simulated to obtain the optimum design modelling of variable conductance of high vacuum system. Commercial simulator of vacuum system, $VacSim^{(multi)}$, was used on this investigation. Reliability of employed simulator was verified by the simulation of the commercially available models of high vacuum system. Simulated vacuum characteristics of the proposed modelling were agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve were schematized as the modelling of throttle valve for the constant process-pressure of below $10^{-3}torr$. Simulation results were plotted as pump down curve of chamber, variable valve conductance and conductance logic of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably.

Development of a Housing Component for an Auto-compressor Using Vacuum Ladling Die Casting (진공급탕식 다이캐스팅법을 이용한 자동차 콤프레서용 하우징 부품 개발)

  • Lee, H.S.;Park, J.S.
    • Transactions of Materials Processing
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    • v.21 no.3
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    • pp.195-201
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    • 2012
  • A vacuum ladling die casting system is suggested as a means to obtain a high vacuum level. A high vacuum of 17.8 mmHg is obtained by sealing the inner space of the mould. The sample product is a rear-head housing for an auto-compressor, and the die-casting with 6-cavities was conducted. The flow analysis shows that the filling speed during vacuum ladling is faster than for a non-vacuum system. The air holes in the sample product were too small to be seen with the naked eye in X-ray films. Density tests show that the high vacuum ladling system reduces the internal porosity as much as 57.8% when compared to the non-vacuum system. A defective rate of only 0.17% was found from leak testing. The results of this research prove that the high vacuum die-casting process is useful for manufacturing of aluminium components under high internal pressure.

Simulation of Modeling Characteristics of Pumping Design Factor on Vacuum System

  • Kim, Hyung-Taek;Cho, Han-Ho
    • International journal of advanced smart convergence
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    • v.5 no.2
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    • pp.1-7
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    • 2016
  • Recently, with the development of advanced thin film devices comes the need for constant high quality vacuum as the deposition pressure is more demanding. It is for this reason our research seeks to understand how the variable design factors are employed in such vacuum systems. In this study, the effects of design factor applications on the vacuum characteristics were simulated to obtain the optimum design modeling of variable models on an ultra high vacuum system. The commercial vacuum system simulator, $VacSim^{(multi)}$, was used in our investigation. The reliability of the employed simulator was verified by the simulation of the commercially available models of ultra high vacuum system. Simulated vacuum characteristics of the proposed modeling aligned with the observed experimental behavior of real systems. Simulated behaviors showed the optimum design models for the ideal conditions to achieve optimal pressure, pumping speed, and compression ratio in these systems.

Measurement Uncertainties for Vacuum Standards from a Low to an Ultra-high Vacuum

  • Hong, S.S.;Shin, Y.H.;Lim, J.Y.
    • Applied Science and Convergence Technology
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    • v.23 no.3
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    • pp.103-112
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    • 2014
  • The Korea Research Institute of Standards and Science (KRISS) has three major vacuum systems: an ultrasonic interferometer manometer (UIM; Section II, Figs. 1 and 2) for a low vacuum, a static expansion system (SES; Section III, Figs. 3 and 4) for a medium vacuum, and an orifice-type dynamic expansion system (DES, Section IV, Figs. 5 and 6) for high and ultra-high vacuum systems. For each system, explicit measurement model equations with multiple variables are given. According to ISO standards, all of these system variable errors were used to calculate the expanded uncertainty (U). For each system, the expanded uncertainties (k = 1, confidence level = 95%) and relative expanded uncertainty (expanded uncertainty/generated pressure) levels are summarized in Table 4. Within the uncertainty limits, our bilateral and key comparisons [CCM.P-K4 (10 Pa to 1 kPa)] are extensive and in good agreement with those of other nations (Fig. 8 and Table 5).

Analysis of High Vacuum System Based on the Applications of Vacuum Materials

  • Kim, Hyung-Taek
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.6
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    • pp.334-338
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    • 2013
  • In this study, the outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the turbomolecular pump system than in the diffusion pump system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

Simulation of High Vacuum Characteristics by VacTran Simulator

  • Kim, Hyung-Taek;Jeong, Hyeongwon
    • International journal of advanced smart convergence
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    • v.11 no.4
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    • pp.88-95
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    • 2022
  • Vacuum simulation is associated with the prediction and calculation of how materials, pumps and systems will perform using mathematical equations. In this investigation, three different high vacuum systems were simulated and estimated with each vacuum characteristics by VacTran simulator. In each of modelled vacuum systems, selection of gas loads into vessel, combination of rough and high vacuum pumps and dimension of conductance elements were proposed as system variables. In pump station model, the pumping speed to pressures by the combination of root pump was analyzed under the variations of vessel volume. In this study, the effects of outgassing dependent on vessel materials was also simulated and aluminum vessel was estimated to optimum materials. It was obtained from the modelling with diffusion pump that the diameter, length of 50×250[mm]roughing line was characterized as optimum variables to reach the ultimate pressure of 10E-7[torr]. Optimum design factors for vacuum characteristics of modelled vacuum system were achieved by VacTran simulator. Feasibility of VacTran as vacuum simulator was verified and applications of VacTran in high tech process expected to be increased.

A study on the design of triggering pulse generator for the triggered vacuum switch (진공스위치 트리거 발생기 설계에 관한연구)

  • Kim, Mu-Sang;Son, Yun-Gyu;Park, Ung-Hwa;Lee, Byeong-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.201.2-201.2
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    • 2016
  • The triggered vacuum switch (TVS) is widely used as a high power switch in the field of pulsed power application. TVS can produce current of higher than 100 kA within a microsecond after being triggered. A triggering high voltage pulse generator supplies a high voltage signal to the trigger system to initiate the discharge between a trigger pin and one of main electrode. The trigger system, which consists of a tungsten trigger electrode and cylindrical ceramic insulator around it, is normally installed at the center of main cathode electrode. The discharging characteristics of the trigger system strongly depend on the geometry, electrode material, vacuum pressure and so on. In addition, we especially will focus on the developing a triggering pulse generator, which can vary not only value of voltage but also pulse duration, because its properties gives pivot influences on the TVS discharge. To verify such effects, we made a 3.3 kJ TVS set-up initially. Thus we will discuss some of prominent results from 3.3 kJ TVS system. In parallel we will show on the design of 300 kJ TVS system for the high current in the future.

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Simulation of Conductance Effects on Vacuum Characteristics of High Vacuum System for Semiconductor Processing (반도체공정 고진공시스템 진공특성에 대한 배기도관 컨덕턴스 영향 전산모사)

  • Kim, Hyung-Taek;Seo, Man-Jae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.4
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    • pp.287-292
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    • 2010
  • Effect of conductance factors on performance of vacuum system was simulated for optimum design of vacuum system. In this investigation, the feasibility of modeling mechanism for VacSim$^{Multi}$ simulator was proposed. Application specific design of vacuum system is required to meet the particular process conditions for various industrial implementations of vacuum equipments. Geometry and length, diameter of exhaust pipeline were modeled as simulation modeling variables for conductance effects. Series vacuum system was modeled and simulated with varied dimensions and structures of exhaust pipeline. Variation of pipeline diameter showed the more significant effects on vacuum characteristics than that of pipeline length variations. It was also observed that the aperture structure of pipeline had the superior vacuum characteristics among the modeled systems.

Simulation of Vacuum Characteristics in Semiconductor Processing Vacuum System by the Combination of Vacuum Pumps (진공펌프 조합에 의한 반도체공정 진공시스템 진공특성 전산모사)

  • Kim, Hyung-Taek;Kim, Dae-Yeon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.6
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    • pp.449-457
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    • 2011
  • Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.