• 한국표면공학회지
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• 제35권1호
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• 한국세라믹학회지
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• 제37권1호
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• pp.12-20
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• 2000

Dielectric property of Ba-modified 0.65Pb(Mg1/3Nb2/3)O3-0.35PbTiO3 ceramics having compositions near the morphotropic phase boundary was investigated. For the specimens having Ba contents between 0 and 20 at%, the average transition temperature was decreased linearly with increasing Ba contents and the degree of hysteresis was also decreased with increasing Ba contents. The maximum dielectric constants (K), electric field induced polarization(P) and electrically-induced strain(S) were found to exihibit a maximum value at∼3 at% of Ba. The increase of S and the decrease of hysteresis by minor additions of Ba impurities indicated the development of new higher perfomance actuator materials. The composition of Ba-PMN-PT (10/65/35) may be appropriate for capacitor materials because of low hysteresis and high polarization.

• 한국표면공학회지
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• 제29권5호
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• pp.424-429
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• 1996

Thin films of Ti-Ni alloy were formed by sputtering under various Ar gas pressures and r. f. powers to investigate the optimum sputtering conditions and to demonstrate their shape memory effect. The composition and structure of the films were examined by electron micro-probe analysis and scanning electron microscope. These films were annealed in order to crystallize them. The mechanical property of the annealed films was evaluated by a conventional bending test. The transformation tmeperatures were determined by differential scanning calorimetry. The shape memory behaviour was examined quantiatatively by changing in sample temperature under various constant loads. It was found that the Ar gas pressure had a critical effect on the mechanical property of the thin film,s although the r.f. power also affected it. The films formed at a high Ar gas pressure were too brittle to be bent successfully. However, the films formed at a low Ar gas pressur could be bent and their shape memory behavior was found to be comparable with that of bulk Ti-Ni alloys.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.621-624
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed boards(PCR) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor meta1s, such as Al and Cu and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure. wear resistance, corrosion protection and thermal stability In this study fundamental aspects of electroless nickel deposition were studied with effort of complexeing agents of different kinds. Then the property of electroless deposit are controlled by the composition of the deposition solution the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• 한국전기전자재료학회논문지
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• 제37권3호
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• pp.328-331
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• 2024

This research explores the development of [100]-textured barium titanate (BaTiO₃, BT) ceramics using sodium bismuth titanate (Na_0.5Bi_4.5Ti₄O₁₅, NBiT) templates, aimed at leveraging the inherent high dielectric property of BT. However, the attempted texturing was unsuccessful, primarily due to bismuth diffusion from the NBiT templates into the BT matrix below the sintering temperature, at 1,000℃. Systematical exploration about the cause of the failure is involved and alternative approaches are proposed in detail to overcome the challenge. These findings contribute to the understanding of techniques and conditions for textured ceramic fabrication and highlight the need for further research in this area.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2000년도 특별강연 및 추계학술발표대회 개요집
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• pp.256-259
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• 2000

High viscosity mixing powder is a very useful material for laser cladding. This material has a high viscosity so that it can be sticked to substrate. Therefore, Laser cladding can be performed on a curved or slope surface. Laser cladding can be easily performed with the material instead of wire that is difficult to be manufactured in some case. In this experiment, it was used a high viscosity mixing powder which consists of a high temperature flux and a bronze powder. And AC2B alloy material was used as a substrate. Flux prevents the clad layer from being oxidized and increases bonding property between substrate and cladding material. It makes possible to laser cladding at low level energy.

• 한국화재소방학회:학술대회논문집
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• 한국화재소방학회 2006년도 춘계학술논문발표회 논문집
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• pp.172-175
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• 2006

Recently, fire resistance of high performance concrete for explosive spatting was issued as high performance concrete was vulnerable to the explosive spatting in initial fire. Therefore, This study is willing to propose fundamental data for quick and accurate diagnosis of deteriorated concrete structure by fire damage with making variable concrete test specimen, exposing high temperature environment, observing the explosive spatting and examining engineering property.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.169-169
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• 2012

The high-temperature superconductor YBa2Cu3O7-x (YBCO) have attached attentions because of a high superconducting transition temperature, low surface resistance, high superconducting critical current density (Jc), and superior superconducting capability under magnetic field. Moreover, the Jc of YBCO superconductors can be enhanced by adding impurities to the YBCO films for vortex-pinning. Understanding and controlling pinning centers are key factors to realize high Jc superconductors. We synthesized vertically-aligned ZnO nanorods on SrTiO3 (STO) substrates by catalyst-free metal-organic chemical vapor deposition (MOCVD), and subsequently, deposited YBCO films on the ZnO nanorods/STO templates using pulsed laser deposition (PLD). The various techniques were used to analyze the structural and interfacial properties of the YBCO/ZnO nanorods/STO hybrid structures. SEM, TEM, and XRD measurements demonstrated that YBCO films on ZnO nanorods/STO were well crystallized with the (001) orientation. EXAFS measurements from YBCO/ZnO nanorods/STO at Cu K edge demonstrated that the local structural properties around Cu atoms in YBCO were quite similar to those of YBCO/STO.

• 소성∙가공
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• 제22권5호
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• pp.264-268
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• 2013

Aluminum clad sheets for brazing materials in the automotive heat exchangers are required to exhibit both high strength and excellent erosion resistance. In this study, the effects of microstructural changes on the property of clad sheets due to thermomechanical treatment were investigated. The clad sheets were fabricated by roll bonding of twin-roll-cast AA3527 and AA4343 alloys followed by cold rolling down to a thickness of 0.22mm. Partial or full annealing was conducted at the final thickness in order to improved the erosion resistance while keeping the proper strength. Since full annealing was achieved for a temperature of $400^{\circ}C$, annealing treatments were performed at 360, 380, and $400^{\circ}C$, respectively. The tensile strength of 3527/4343 clad material was found to be inversely proportional to the annealing temperature before the brazing heat treatment. After this latter treatment, however, the tensile strength of the clad material was about 195~200MPa regardless of the annealing temperature. The erosion depth ratio of the clad annealed at $400^{\circ}C$ was 8.8% (the lowest), while that of the clad annealed at $380^{\circ}C$ was 17% (the highest). The effect of annealing temperature on the tensile and erosion properties of 3527/4343 aluminum clad sheets was elucidated by means of microstructural analyses.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 추계학술대회 초록집
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• pp.53.2-53.2
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• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.