• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.7 no.2
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• pp.43-51
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• 2001

This study was carried out to analyze changes of the physical properties of corrugated fiberboard boxes for fruits packaging by various moisture and temperature changes. There were significant decrease in burst strength with increased relative humidity. And also compressive strength(ring crush test) of corrugated fiberboard and box were reduced with moisture content. The decreasing amounts of single wall(SW) corrugated fiberboard was bigger than that of double wall(DW). The physical properties reductions of corrugated fiberboard and box were mainly affected by relative humidity. Therefore, it is suggested that development of the water-resistant corrugated fiberboard and box be useful under the condition of low temperature and high relative humidity such as the cold chain system.

• Journal of Applied Reliability
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• v.12 no.4
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• pp.275-285
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• 2012

This paper presents a changes of luminescence property for converted white LEDs with the commercially available silicate phosphor. If silicate phosphor's quantity increase step by step. luminescence property will be changing. we analyze luminescence property for these change and carry out the high temperature aging test for 7,000 hours, the high temperature and humidity aging test for 7,000 hours for reliability. LED degradation not only results in reduced light output but also in color changes. so we monitor correlated color temperature (CCT), chromaticity coordinates(x, y) and spectrum intensity. Those results suggest that humidity factor more bad effect in color changes than temperature factor and Lighting quality is related with quantity of phosphor.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.4
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• pp.381-388
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• 1998

Hot and humid weather in summer generally brings about discomfort. Experiments on which relative humidity makes effects on the comfort sensation were performed to the young and the aged using sensation vote. From July to October 1996, seven college students and eleven aged people were exposed for 2 hours under six different conditions in the Pukyong National University test chamber so as to determine the effects of relative humidity on thermal and comfort sensations. Subjects were wearing same clothes, and the mean clo value was 0.5. The mean radiant temperature was equal to the air temperature and air velocity in the occupied zone around 0.lm/s. In the experiments, it was found that discomfort could be largely reduced when the humidity is controlled to low values in the settled high temperature.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.30 no.1
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• pp.18-27
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• 2020

Objectives: For testing asbestos stabilizer products which are used for the maintenance and management of asbestos-containing materials, durability assessment should accompany the evaluation of basic properties and performance. Therefore, in this study we designed a testing method and constructed a database of durability performance, thereby providing basic data for reliability studies of asbestos stabilizer. Methods: Since the ceiling materials targeted in this study are interior materials, test conditions of 95% relative humidity and 60℃ temperature were designed in consideration of the effect of high relative humidity in summer and seasonal indoor temperatures. Plate-shaped specimens treated with asbestos stabilizers were maintained in a thermo-hygrostat for 5, 10, and 20 days, and then the asbestos scattering prevention rate was measured by air erosion testing. Results: The scattering concentration tended to increase with time under the single humidity condition, and exceeded the indoor air quality standard of 0.01 f/cc, during the 20 days of maintenance. On the other hand, there was little change according to the temperature condition. In the case of a complex condition with temperature and humidity, the results were similar to the humidity test, but the scattering concentration increased more sharply at 20 days. Conclusions: The main deterioration factor that affects the durability of asbestos stabilizer is humidity, and the deterioration is caused by a mechanism in which the stabilizer coated on the surface is re-dissolved by moisture and evaporates or the coating layer is peeled off, which is accelerated by high temperatures.

• Journal of Biosystems Engineering
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• v.11 no.1
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• pp.52-63
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• 1986

This study was performed to find out drying characteristics and develop drying model for the design of an efficient dryer or drying system of red peper. The basic model which describes drying phenomenon of red pepper was firstly established, and drying tests were conducted at 14-different drying conditions. In this test, the effects of drying air temperature and relative humidity on the rate of drying were undertaken. Finally, a new drying model based on these experimental results was developed to describe the drying characteristics of red pepper. The results from this study may be summarized as follows. 1. Drying constant of the basic model established from Lewis' experimental model and diffusion equation was theoretically deduced as a function of moisture content and inner-temperature of red pepper. 2. From the results of drying tests, drying air temperature was found to have the greatest effect on the rate of drying. However, the effect of temperature was small for the condition of high relative humidity, and for low temperature, the effect of relative humidity was found to be large even though the range of relative humidity was low. 3. Modified Henderson equation was found to be better than Chung equation as the EMC model for the estimation of the equilibrium moisture content of red Pepper. 4. Constant-rate drying period did not exist in the red pepper drying test. And falling-rate drying period was divided into three distinct phases. Drying rate was dependent on the moisture content, the inner-temperature of red pepper and the change of physical property due to drying. 5. Drying constant increased with decrease of free moisture content, but it decreased at the end of the drying period. Also, drying constant was dependent on the drying air temperature and relative humidity. 6. The new drying model developed in this study was found to be most suitable in describing the drying characteristics of red pepper. Therefore, it may be concluded that drying time could be accurately estimated by the new drying model.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.2
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• pp.185-190
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• 2015

This paper presents a new method to determine sensitivity coefficients of temperature and humidity of torque transducers by using a natural and seasonal variation of ambient conditions at the laboratory. We had measured the sensitivities of the torque transducers over almost one year using the KRISS 2 kN m torque standard machine. The sensitivity data acquired at various ambient conditions were processed using our measurement model to extract the sensitivity coefficients of temperature and humidity simultaneously with high precision. A comparison with a previous method using an environmental control chamber was carried out to test the feasibility of using our new method. Two results agreed within the uncertainty. We revealed that the torque measuring errors could be 8 times higher than the measurement and calibration capability of KRISS torque standard machine if the sensitivity changes due to the temperature and humidity are not properly corrected during a calibration.

• Journal of Applied Reliability
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• v.12 no.3
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• pp.177-186
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• 2012

This paper presents a comparison of the failure mechanism for high power converted white LEDs(3W) with the commercially available YAG:Ce and silicate phosphor. We carry out the normal aging life test for 10,000 hours, the high temperature aging test for 8,000 hours, the high temperature and humidity aging test for 8,000 hours and the current aging testing for 5,000 hours. The optical and electrical parameters of LEDs were monitored, such as lumen, correlated color temperature (CCT), chromaticity coordinates(x, y), thermal resistance, I -V curve and spectrum intensity. The stress induced a luminous flux decay on LED in all experiments and causes a failure. So we try to find out what's a main failure mechanism for a high power LED.

• 보존과학연구
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• s.30
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• pp.47-61
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• 2009

Cultural heritages are affected by various environmental factors. Main factors are temperature, humidity, light and indoor air pollutants such as ozone, nitrogen oxides. Especially humidity condition is very important. Low humidity condition can cause contraction and high humidity condition can lead to growth of microorganism. This study is conducted to appraise an applicability of the Humidity Indicator which is one of the simple method for humidity control. The Humidity Indicator shows the humidity conditions through color change. Therefore, photometer was used to correctly measure the color change of Humidity Indicator. As a result of lab test, Humidity Indicators was stabilized after one hour from en exposure in a certain humidity condition and the indicators indicated clear correlations between color changes of Humidity Indicators and humidity conditions. Some Humidity Indicators which had been selected through the lab tests were applied to preservation facilities of cultural heritages and the indicators indicated closed correlations with humidity conditions in indoor of facilities.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.25-29
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• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.