• Title/Summary/Keyword: High temperature and high humidity

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Effects of Storage Temperature and Humidity on Germinability and Longevity of Primed Tobacco Seeds

  • Min, Tai-Gi
    • KOREAN JOURNAL OF CROP SCIENCE
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    • v.46 no.4
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    • pp.321-324
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    • 2001
  • Tobacco seeds (Nicotiana tabacum L. cv KF109) were primed in the polyethylene glycol 6000(PEG) solution and then stored at 5 and $25^{\circ}C$ under 40, 60 and 80% relative humidity (RH) conditions for six months. The effect of storage temperature and humidity on mean germination time ($T_{50}$), longevity and germination of the primed tobacco seeds were compared. Untreated seeds (control) stored at $5^{\circ}C$ showed high germinability throughout the entire storage period and humidity, and a decline in germinability showed after 6 months at 60% RH and after 3 months at 80% RH when stored at $25^{\circ}C$, Primed seeds retained high germinability until 6 months at 60% RH and 3 months at 80% RH when stored at $5^{\circ}C$ but showed a significant decline in germinability after 3 months at 40% RH, and 1 months at 60% and 80% RH, respectively when stored at $25^{\circ}C$, Primed seeds were completely lost viability when stored at $25^{\circ}C$ under 60% RH for 6 months and under 80% RH for 3 months.

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Formation and Humidity-Sensitive Characteristics of Anodically Oxidized porous Silicon Films (다공질 실리콘 양극산화막의 형성과 감습특성)

  • Choi, Bok-Gil;Rhie, Dong-Hee;Ryoo, Jee-Ho;Sung, Yung-Kwon
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1066-1068
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    • 1995
  • The formation properties and oxidation mechanism of electrochemically oxidized porous silicon(OPS) films have been studied. To examine the humidity-sensitive properties of OPS films, surface-type and bulk-type humidity sensors were fabricated. The oxidized thickness of porous silicon layer(PSL) increases with the charge supplied during electrochemical oxidation and current density. The humidity sensor shows high sensitivity at high relative humidity in low temperature. The sensitivity and linearity can be improved by increasing a porosity of PSL.

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Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test (온도/습도 시험, 온도 싸이클링 시험 및 고온유지 시험에 따른 Package-on-Package의 신뢰성)

  • Park, Donghyun;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.43-49
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    • 2016
  • Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions (Bendable 임베디드 전자모듈의 손상 메커니즘)

  • Jo, Yun-Seong;Kim, A Young;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

Charge Formation in PCB Insulations (PCB 절연체에서 전하 형성)

  • Lee, Joo-Hong;Choi, Yong-Sung;Hwang, Jong-Sun;Lee, Kyung-Sup
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.264-265
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    • 2008
  • While the reliability of bulk insulation has become important particularly in multilayer boards and embedded boards, electronics are to be used under various environments such as at high temperature and in high humidity. We observed internal space charge behavior for two types of epoxy composites under dc electric fields to investigate the influence of water at high temperature. In the case of glass/epoxy specimen, homocharge is observed at water-treated specimen, and spatial oscillations become clearer in the water-treated specimens. Electric field in the vicinity of the electrodes shows the injection of homocharge. In aramid/epoxy specimens, heterocharge is observed at water-treated specimens, i.e. negative charge accumulates near the anode, while positive charge accumulates near the cathode. Electric field is enhanced just before each electrode. In order to further examine the mechanism of space charge formation, we have developed a new system that allows in situ space charge observation during ion migration tests at high temperature and high humidity. Using this in situ system.

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A Study on Wearing Sensation in Accordance with difference in Materials of Aerobic Wear (에어로빅복의 소재 차이에 따른 착용감에 관한 연구)

  • 이미경;류숙희
    • Journal of the Korean Society of Clothing and Textiles
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    • v.22 no.1
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    • pp.116-126
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    • 1998
  • This study was conducted to examine the effect of difference in materials of aerobic wear on both human body's physiological reactions and subjective wearing sensation by comparing and analysing not only cotton sparidex A, B and C but nylon spandex D, E and F used as actually wearing materials. The rectal temperature of type A and I remained at high degree, the type C was higher from after high-speed running but dropped sharply when taking a break finally. Both skin temperature and mean skin temperature dropped sharply due to sweat occurred during physical exercise, and then rose slowly when taking a break. Type A -D and B-I showed that the mean skin temperature remained at high degree when wearing a cotton spandex. Type C's temperature within its aerobic wear was lower than type F while its relative humidity was higher than type F. Wearing sensation showed a change similar to wearing, particularly, which was remarkable in type B-E. Also, it was shown that humidity sensation, tactile sensation and comfort sensation were good when wearing the cotton spandex.

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Study on the Reliability of COB Flip Chip Package using NCP (NCP 적용 COB 플립칩 패키지의 신뢰성 연구)

  • Lee, So-Jeong;Yoo, Se-Hoon;Lee, Chang-Woo;Lee, Ji-Hwan;Kim, Jun-Ki
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.3
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    • pp.25-29
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    • 2009
  • High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.

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Research on Durability Assessment of Asbestos Stabilizer for Asbestos-containing Ceiling Materials (석면 함유 천장재에 대한 석면 안정화제 내구성 평가 연구)

  • Ha, Joo-Yeon;Shin, Hyun-Gyoo
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.30 no.1
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    • pp.18-27
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    • 2020
  • Objectives: For testing asbestos stabilizer products which are used for the maintenance and management of asbestos-containing materials, durability assessment should accompany the evaluation of basic properties and performance. Therefore, in this study we designed a testing method and constructed a database of durability performance, thereby providing basic data for reliability studies of asbestos stabilizer. Methods: Since the ceiling materials targeted in this study are interior materials, test conditions of 95% relative humidity and 60℃ temperature were designed in consideration of the effect of high relative humidity in summer and seasonal indoor temperatures. Plate-shaped specimens treated with asbestos stabilizers were maintained in a thermo-hygrostat for 5, 10, and 20 days, and then the asbestos scattering prevention rate was measured by air erosion testing. Results: The scattering concentration tended to increase with time under the single humidity condition, and exceeded the indoor air quality standard of 0.01 f/cc, during the 20 days of maintenance. On the other hand, there was little change according to the temperature condition. In the case of a complex condition with temperature and humidity, the results were similar to the humidity test, but the scattering concentration increased more sharply at 20 days. Conclusions: The main deterioration factor that affects the durability of asbestos stabilizer is humidity, and the deterioration is caused by a mechanism in which the stabilizer coated on the surface is re-dissolved by moisture and evaporates or the coating layer is peeled off, which is accelerated by high temperatures.

Evaluation of Thermal Physiological Responses and Comfort in Dox Fabric (한지닥 섬유제품의 인체 생리 반응 및 쾌적성 평가)

  • Im, Soon
    • Journal of the Korean Society of Costume
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    • v.63 no.5
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    • pp.102-114
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    • 2013
  • This study performed the evaluation of skin temperature, heart rate, humidity and temperature inside clothing, and subjective sensation to estimate the physiological responses of the human body and its feeling of comfort for developing value-added dox fabric. Experiments were performed on five healthy adult women whose average age was 21, at climate chamber in which temperature, relative humidity and air current were set up below $28{\pm}5^{\circ}C$, $50{\pm}10%$, 0.2m/s, respectively. Two kinds of clothes were used for the experiments: 100% cotton and dox clothes. The clothes were identical in size and form, and the attire consisted of long-sleeved shirts, long trousers, and socks. The experiment was performed for 30 minutes using ergometer. The results are as follows. 1) It showed low skin temperature of forearm, breast, back, forehead and lower leg in exercise, but high skin temperature of them in recovery. However skin temperature of thigh and foot increased from rest to recovery. 2) It showed significant difference (p<0.001, p<0.01) in average skin temperature between cotton and dox clothes. Cotton clothes had a higher average skin temperature compared to dox. Not only was there a significant difference in temperature inside clothing (p<0.001), this was also the case with humidity inside the clothing (p<0.001).

The Design Criteria of the Indoor Temperature and Humidity for the Prevent Condensation of Small Apartment Buildings (소형 공동주택의 동계 실내온습도 조사를 통한 결로방지 설계 기준온습도 설정방안)

  • Kim, Gil-Tae;Kim, Jong-Yeob;Hwang, Ha-Jin;Kim, Kyoung-Sik
    • Land and Housing Review
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    • v.5 no.4
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    • pp.291-296
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    • 2014
  • The apartment buildings were hard to emission of water vapor by reduced infiltration. The purpose of this study was to investigate the generation of indoor temperature and humidity in the recent construction of small size apartment buildings. The temperature and humidity were measured in 3 apartments in Seongnam and Daejeon city. During the winter indoor temperature and relative humidity were measured ranged from 20 to $24^{\circ}C$ and 40 to 60%. Generated humidity caused by various characteristics of the residents, rather than external influences. Compare daytime (6:00 to 22:00) and nighttime (22:00 to 6:00), the temperature is low and absolute humidity is high at nighttime. Condensation is likely to occur at nighttime. Using the cumulative relative frequency and absolute humidity, small apartments design criteria (temperature, relative humidity) can be set.