• 한국공작기계학회논문집
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• 제16권6호
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• pp.205-211
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• 2007

In this paper, foam-composite sandwich structures for EDM machine tool components such as column and column block designed by controlling stacking sequences and cross-sectional dimensions of the composite structures. The original column block is a box-shaped structure made of aluminum connecting a column and a Z-stage of the system. This research was focused on the design of efficient column block structure using a foam-composite sandwich structure which have good bending stiffness and damping characteristics to reduce the mass and increase damping ratio of the system. Vibration tests for getting damping ratio with respect to the stacking angle and thickness of the composites were carried out. Finite element analyses for static defection and vibration behaviour were also carried out to find out the appropriate stacking conditions; that is, stacking sequence and rib configuration. From the test and analysis results it was found that composite-foam sandwich structures for the microfactory system can be successful alternatives for high precision machining.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.131.6-131
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• 2001

During the operation of crane system in container yard, it is necessary to control the crane trolley position and loop length so that the swing of the hanging container is minimized. Recently an automatic control system with high speed and rapid transportation is required. Therefore, we designed a controller to control the stacking crane system.

• 한국세라믹학회지
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• 제36권1호
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• pp.36-42
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• 1999

2단계 열탄소환원법으로 탄화규소 휘스커를 기상-고상, 2단계, 기상-액상-고상 성장기구로 각각 합성하였다. 그리고 휘스커에 있는 적층결합을 X-ray와 투과전자현미경을 이용하여 분석하였다. 탄화규소 휘스커에 있는 적층결함은 휘스커의 지름과 상관관계가 있는 것으로 나타났다. 즉, 기상-고상, 2단계 성장, 기상-액상-고상 성장기구에 상관없이 지름이 1$\mu\textrm{m}$이하로 작아지는 경우 적층결합이 많아지고, 기상-액상-고상 기구로 성장한 지름이 2$\mu\textrm{m}$보다 큰 경우 적층결함이 거의 없는 것으로 나타났다. 이같은 현상은 휘스커 지름이 작아짐에 따라 휘스커의 비표면적이 증가하는 때문인 것으로 판단되었다.

• 마이크로전자및패키징학회지
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• 제23권3호
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• pp.1-6
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• 2016

IoT 적용을 위해서는 다종 소자를 높은 connectivity 밀도로 집적화시키는 전자패키징 기술이 매우 중요하다. FOWLP 기술은 입출력 밀도가 높고, 소자의 집적화가 우수하고, 디자인 유연성이 우수하여, 최근 개발이 집중되고 있는 기술이다. 웨이퍼나 패널 기반의 FOWLP 기술은 초미세 피치 RDL 공정 기술과 몰딩 기술 개발이 최적화 되어야 할 것이다. 3D stacking 기술 특히 웨이퍼 본딩 후 TSV를 제조하는 방법(via after bonding)은 가격을 낮추면서 connectivity를 높이는데 매우 효과적이라 하겠다. 하지만 저온 웨이퍼 본딩이나 TSV etch stop 공정과 같이 아직 해결해야할 단위 공정들이 있다. Substrate 기술은 두께를 줄이고 가격을 낮추는 공정 개발이 계속 주목되겠지만, 칩과 PCB와의 통합설계(co-design)가 더욱 중요하게 될 것이다.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.79-85
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• 2007

The modem industry age began when the conveyer system was introduced by Ford to produce model "T". The conveyer system is designed to optimize and maximize mass production of a specific item. Nowadays, however, accommodating to individual tastes has become an important factor in selection of products. Thus, rather than the mass production of one item, producing fewer but a wide variety of goods became important. To give flexibility and elasticity to the conveyer system, a new method of transportation where it is possible to choose a specific item is necessary. Therefore mall quantity and high-volume mass production was decrescent and small quantity batch production was expanded. In this paper, we developed multiple crate stacking and picking system to give flexibility to the conveyer system. First, we verified the conceptually designed system through manufacture. Second, we solved the problems that would happen on the actual field using pneumatic system. Finally, we optimized the system through FEM technique. This system works with stability and fast speed and can improve work efficiency which would minimize the losses resulting from too much dependence on manual labor.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2006년도 춘계학술대회 및 창립 30주년 심포지엄(논문집)
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• pp.317-323
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• 2006

본 연구는 초대형컨테이너선 기항에 대비한 차세대 항만하역기술로 고층 장치시스템 개발을 다루고 있다. 고층 장치시스템은 한정된 부지내에서 처리능력을 극대화시킬 수 있는 시스템으로 기존의 컨테이너 터미널이 안고 있는 장치장 부족문제룰 일시에 해결할 수 있으며, 고성능 및 자동화가 가능하여 터미널의 하역생산성을 높일 수 있는 대안으로 평가된다. 이에 본 연구에서는 고층 장치시스템을 적용한 터미널의 설계개념도를 작성해 보았으며 시뮬레이션 기법을 이용하여 고층 장치시스템을 도입한 전용터미널의 하역능력을 분석해 보았다. 연구결과는 차후 실제 터미널 운영을 위한 기본 설계 및 상세설계의 기초자료로 활용될 수 있으며, 본 연구에서 제시하는 고층 장치시스템은 향후 기존 터미널 및 신규 터미널 개발에 적용하여 항만의 부가가치를 더욱 향상시키는 원동력이 될 것으로 본다.

• Journal of Welding and Joining
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• 제24권2호
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• 한국산업융합학회 논문집
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• 제27권1호
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• pp.229-237
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• 2024

The logistics industry is converging with digital technology and growing into various logistics automation systems. However, inspection and loading/unloading, which are mainly performed in logistics work, depend on human resources, and the workforce is shrinking due to the decline in the productive population due to the low birth rate and aging. Although much research is being conducted on the development of automated logistics systems to solve these problems, there is a lack of research and development on load stacking stability, which has the potential to cause significant accidents. In this study, loading boxes with various sizes and positions of the center of gravity were set up, and a method for stacking that with high stability is presented. The size of the loading box is measured using a depth camera. The loading box's weight and center of gravity are measured and estimated by a developed device with four loadcells. The measurement error is measured through various repeated experiments and is corrected using the least squares method. The robot arm performs load stacking by determining the target position so that the centers of gravity of the loading boxes with unbalanced masses with a random sequence are transported in alignment. All processes were automated, and the results were verified by experimentally confirming load stacking stability.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.37-41
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• 2012

Cu 본딩을 이용한 웨이퍼 레벨 적층 기술은 고밀도 DRAM 이나 고성능 Logic 소자 적층 또는 이종소자 적층의 핵심 기술로 매우 중요시 되고 있다. Cu 본딩 공정을 최적화하기 위해서는 Cu chemical mechanical polishing(CMP)공정 개발이 필수적이며, 본딩층 평탄화를 위한 중요한 핵심 기술이라 하겠다. 특히 Logic 소자 응용에서는 ultra low-k 유전체와 호환성이 좋은 Ti barrier를 선호하는데, Ti barrier는 전기화학적으로 Cu CMP 슬러리에 영향을 받는 경우가 많다. 본 연구에서는 웨이퍼 레벨 Cu 본딩 기술을 위한 Ti/Cu 배선 구조의 Cu CMP 공정 기술을 연구하였다. 다마싱(damascene) 공정으로 Cu CMP 웨이퍼 시편을 제작하였고, 두 종류의 슬러리를 비교 분석 하였다. Cu 연마율(removal rate)과 슬러리에 대한 $SiO_2$와 Ti barrier의 선택비(selectivity)를 측정하였으며, 라인 폭과 금속 패턴 밀도에 대한 Cu dishing과 oxide erosion을 평가하였다.

• Journal of Communications and Networks
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• 제13권1호
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• pp.70-76
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• 2011

This paper presents the unified user equipment (UE) baseband modulation and demodulation (modem) hardware platform architecture to support multiple radio access technologies. In particular, this platform selectively supports two systems; one is HEDGE system, which is the combination of third generation partnership project (3GPP) Release 7 high speed packet access evolution (HSPA+) and global system for mobile communication (GSM)/general packet radio service (GPRS)/enhanced data rates for GSM evolution (EDGE), while the other is LEDGE system, which is the combination of 3GPP Release 8 long term evolution (LTE) and GSM/GPRS/EDGE. This is done by applying the flexible pin multiplexing scheme to a hardwired pin mapping process. On the other hand, to provide stable connection, high portability, and high debugging ability, the stacking structure is employed. Here, a layered board architecture grouped by functional classifications is applied instead of the conventional one flatten board. Based on this proposed configuration, we provide a framework for the verification step in wireless cellular communications. Also, modem function/scenario test and inter-operability test with various base station equipments are verified by system requirements and scenarios.