• Title/Summary/Keyword: High resistivity

Search Result 1,276, Processing Time 0.027 seconds

Electrical Resistivity and NTC/PTC Transition Point of a Nitrogen-Doped SiC Igniter, and Their Correlation to Electrical Heating Properties

  • Jeon, Young-Sam;Shin, Hyun-Ho;Yoo, Dong-Joo;Yoon, Sang-Ok
    • Journal of the Korean Ceramic Society
    • /
    • v.49 no.1
    • /
    • pp.124-129
    • /
    • 2012
  • An M-shaped SiC gas igniter was fabricated by a reaction sintering followed by nitrogen doping. The igniter showed both resistivity at room temperature and NTC to PTC transition temperature values that were lower than those of commercial igniters. It was deduced that the doped nitrogen reduces the electrical resistivity at room temperature, while, at high temperature, the doped nitrogen and a trace of $Si_3N_4$ phase work as scattering centers against electron transfer, resulting in a lowered NTC-to-PTC transition point (below $650^{\circ}C$). Such characteristics were correlated to the fast heating speed (as compared to the commercial models) and to the prevention of the high temperature overshooting of the nitrogen-doped SiC igniter.

Fabrication of Copper Films by RF Magnetron Sputtering (스퍼터링법에 의한 Cu막 형성 기술)

  • Kim, Hyun-Sik;Song, Jae-Sung;Jeong, Soon-Jong;Oh, Young-Woo
    • Proceedings of the KIEE Conference
    • /
    • 1996.07c
    • /
    • pp.1648-1650
    • /
    • 1996
  • In present paper, Cu films $4{\mu}m$, thick were fabricated by dual deposition methods using RF magnetron sputtering on Si wafer. The dependence of the electrical resistivity, adherence, and reflection in Cu films [$Cu_{4-x}$(low resistivity) / $Cu_x$(high adherence) / Si- wafer] on the x thickness have been investigated. Cu films of $4{\mu}m$ thickness formed with dual deposition methods had the low electrical resistivity of about $2.6{\mu}{\Omega}{\cdot}cm$ and high adherence of about 700g/cm. In conclusion, it is possible for these films to be used for micro-devices.

  • PDF

A Case of Reducing Grounding Resistance of 154KV Substation (154KV 변전소의 접지저항 저감대책 검토사례)

  • Kee, H.T.;Choi, J.K.;Jung, G.J.;On, D.H.
    • Proceedings of the KIEE Conference
    • /
    • 2000.07c
    • /
    • pp.2064-2067
    • /
    • 2000
  • In our country, most region is composed of mountains and people have recently been displeased with the construction of the substations in their vicinity so the substations newly built are mainly constructed with GIS system in the small area that has high soil resistivity near mountain. Therefore, nowadays the design of substation grounding system has been difficult, and the additional considerations are needed. UC substation was also difficult to design the grounding system because of so small substation area and high soil resistivity. This paper shows the examples of reducing the grounding system resistance reasonably by using several ways. Designing the ground grid electrode in the access road, deep electric earth probe, changing the substation soil with the law level resistivity soil. This report deals with the computer simulation of the grounding system resistance about the ways illustrated above.

  • PDF

Property of Spin-sprayed ZnO Film on PC Substrate (스핀 스프레이법으로 PC 기판에 제작한 산화아연 박막의 특성)

  • Hoong, Jeongsoo;Matsushita, Nobuhiro;Katsumata, Ken-ichi;Park, Yongseo;Kim, Kyunghwan
    • Journal of the Semiconductor & Display Technology
    • /
    • v.17 no.3
    • /
    • pp.27-30
    • /
    • 2018
  • In this study, ZnO film was deposited on polycarbonate substrate by spin-spray method at low substrate temperature of $85^{\circ}C$. Surface morphology of ZnO films was changed by adding citrate from rod to dense structure. As-deposited ZnO film indicated high transmittance above 80%. In case of the resistivity, as-deposited ZnO film had high resistivity due to the existence of organic substance in the film. However, organic substance was removed and resistivity was decreased to $3.9{\times}10^{-2}{\Omega}{\cdot}cm$, after UV irradiation.

Influence of Chloride Content of on Electrical Resistivity in Concrete (콘크리트내 염소이온량이 전기저항에 미치는 영향)

  • Yoon, In-Seok;Nam, Jin-Won
    • Journal of the Korea institute for structural maintenance and inspection
    • /
    • v.18 no.6
    • /
    • pp.90-96
    • /
    • 2014
  • The electrical resistivity of concrete can be related to two processes involved in corrosion of reinforcement: initiation (chloride penetration) and propagation (corrosion rate). The resisistivity of concrete structure exposed to chloride indicates the risk of early corrosion damage, because a low resistivity is related to rapid chloride penetration and to high corrosion rate. Concrete resistivity is a geometry-independent material property that describes the electrical resistance, which is the ratio between applied voltage and resulting current in a unit cell. In previous study, it was realized that the resistivity of concrete depended on the moisture content in the concrete, microstructural properties, and environmental attack such as carbonation. The current is carried by ions dissolved in the pore liquid. While some data exist on the relationship between moisture content on electrical resistivity of concrete, very little research has been conducted to evaluate the effect of chloride on the conduction of electricity through concrete. The purpose of this study is to examine and quantify the effect of chloride content on surface electrical resistivity measurement of concrete. It was obvious that chloride content had influenced the resistivity of concrete and the relationship showed a linear function. That is, concrete with chloride ions had a comparatively lower resistivity. Decreasing rate of resistivity of concrete was clear at early time, however, after 50 days resistivity was constant irrespective of chloride concentration. Conclusively, this paper suggested the quantitive solution to depict the electrical resistivity of concrete with chloride content.

Effects of Matrix Strength, Fiber Type, and Fiber Content on the Electrical Resistivity of Steel-Fiber-Reinforced Cement Composites During Fiber Pullout (매트릭스 강도, 섬유 형식 및 보강량에 강섬유 보강 시멘트 복합재료의 인발시 전기저항에 미치는 영향)

  • Le, Huy Viet;Kim, Dong Joo
    • KSCE Journal of Civil and Environmental Engineering Research
    • /
    • v.39 no.6
    • /
    • pp.675-689
    • /
    • 2019
  • Development of smart construction materials with both self-strain and self-damage sensing capacities is still difficult because of little information about the self-damage sensing source. Herein, we investigate the effects of the matrix strength, fiber geometry, and fiber content on the electrical resistivity of steel-fiber-reinforced cement composites by multi-fiber pullout testing combined with electrical resistivity measurements. The results reveal that the electrical resistivity of steel-fiber-reinforced cement composites clearly decreased during fiber-matrix debonding. A higher fiber-matrix interfacial bonding generally leads to a higher reduction in the electrical resistivity of the composite during fiber debonding due to the change in high electrical resistivity phase at the fiber-matrix interface. Higher matrix strengths, brass-coated steel fibers, and deformed steel fibers generally produced higher interfacial bond strengths and, consequently, a greater reduction in electrical resistivity during fiber debonding.

Electrical Properties and Microstructures in Ti Films Deposited by TFT dc Sputtering

  • Han, Chang-Suk;Jeon, Seung-Jin
    • Korean Journal of Materials Research
    • /
    • v.26 no.4
    • /
    • pp.207-211
    • /
    • 2016
  • Ti films were deposited on glass substrates under various preparation conditions in a chamber of two-facing-target type dc sputtering; after deposition, the electric resistivity values were measured using a conventional four-probe method. Crystallographic orientations and microstructures, including the texture and columnar structure, were also investigated for the Ti films. The morphological features, including the columnar structures and surface roughness, are well explained on the basis of Thornton's zone model. The electric resistivity and the thermal coefficient of the resistivity vary with the sputtering gas pressure. The minimum value of resistivity was around 0.4 Pa for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films; the apparent tendencies are almost the same for the two films, with a small difference in resistivity because of the different film thicknesses. The films deposited at high gas pressures show higher resistivities. The maximum of TCR is also around 0.4 Pa, which is the same as that obtained from the relationship between the resistivity and the gas pressure. The lattice spacing also decreases with increasing sputtering gas pressure for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films. Because they are strongly related to the sputtering gas pressures for Ti films that have a crystallographic anisotropy that is different from cubic symmetry, these changes are well explained on the basis of the film microstructures. It is shown that resistivity measurement can serve as a promising monitor for microstructures in sputtered Ti films.

Analysis of Geophysical and Geotechnical SPT Data for the Safety Evaluation of Fill Dam (필댐 안정성 평가를 위한 물리탐사와 SPT 자료의 분석)

  • Oh, Seok-hoon;Sun, Chang-Guk
    • Journal of the Korean Geophysical Society
    • /
    • v.7 no.3
    • /
    • pp.171-183
    • /
    • 2004
  • Electrical resistivity survey is widely used to investigate the stability of center-core type fill dam against the seepage phenomenon. In this study, we analyze the resistivity information obtained on a earth fill dam and compare it with the geotechnical SPT result. The analysis shows that the zones showing low resistivity value generally have low N value. However, some zones with high resistivity pattern do not accompany the increase of N value, and even showing low N value. These results imply that the direct identification of resistivity value to the real status of the core material of fill dam is impossible, and a highly resistive zone may be in serious status due to the effect increasing the resistivity value by the piping condition. Therefore, multiple exploration should be planned to reduce the uncertainty in application of geophysical methods to dam safety evaluation.

  • PDF

STIFFNESS AND POROSITY EVALUATION USING FIELD VELOCITY RESISTIVITY PROBE

  • Lee, Jong-Sub;Yoon, Hyung-Koo;Choi, Yong-Kyu
    • Proceedings of the Korean Geotechical Society Conference
    • /
    • 2010.09c
    • /
    • pp.24-30
    • /
    • 2010
  • The void ratio and elastic moduli are design parameters used in geotechnical engineering to understand soil behavior. Elastic and electromagnetic waves have been used to evaluate the various soil characteristics due to high resolution. The objective of this study is to evaluate the void ratio and elastic moduli based on elastic wave velocities and electrical resistivity. The Field Velocity Resistivity Probe (FVRP) is developed to obtain the elastic and electromagnetic wave profiles of soil during penetration. The Piezoelectric Disk Elements (PDE) and Bender Elements (BE) are used as transducers for measuring the elastic wave velocities such as compressional and shear wave velocities. The Electrical Resistivity Probe (ERP) is also installed for capturing the electrical resistivity profile. The application test is carried out on the southern coast of the Korean peninsula. The field tests are performed at a depth of 6~20 m, at 10 cm intervals for measuring elastic wave velocities and at 0.5cm intervals for measuring electrical resistivity. The elastic moduli such as constraint and shear moduli are calculated by using measured elastic wave velocities. The void ratios are also evaluated based on the elastic wave velocities and the electrical resistivity. Furthermore, the converted void ratios by using FVRP are compared with the volumetric void ratio obtained by a standard consolidation test. The comparison shows that the void ratios based on the FVPR match the volume based void ratio well. This study suggests that the FVRP may be a useful device to effectively determine the elastic moduli and void ratio in the field.

  • PDF

Microstructure and Electrical Properties of $RuO_2$ System Thick Film Resistors ($RuO_2$계 후막저항체의 미세구조와 전기적성질)

  • 구본급;김호기
    • Journal of the Korean Ceramic Society
    • /
    • v.27 no.3
    • /
    • pp.337-344
    • /
    • 1990
  • As a function of sintering temperature and time, the electrical properties of ruthenium based thick film resistors were investigated with microstructure. The variatio of resistivity and TCR(temperature coefficient of resistance)trends of sintered speciman at various sintering temperature were different low resistivity paste(Du Pont 1721) from high one(Du Pont 1741). These phenomena are deeply relative to microstructure of sintered film. With increasing the sintering temperature for 1721 system, the electrical sheet resistivity decreased, but again gradually increased above 80$0^{\circ}C$. And TCR trends in 1721 system are all positive. On the other hand the electrical sheet resistivity of 1741 resistor system decreased with sintering temperature. And TCR trends variable according to sintering temperature. TCR of speciman sintered at $700^{\circ}C$ was negative value, and TCR of 80$0^{\circ}C$ sintered speciman coexisted negative and positive value. But in case of speciman sintered at 90$0^{\circ}C$, TCR was positive value. As results of this fact, it was well known that the charge carrier contributied to electrical conduction in 1741 resistor system varied with sintering temperature.

  • PDF