• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.4
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• pp.617-621
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• 2016

In addition to the energy storage facilities based on high power technologies, Electric double layer capacitors(EDLC) are today's candidate for power quality stabilization. However, its low energy density is often inhibiting factor for application of electric power industry. Hybrid supercapacitor is an promising energy storage device that positioned between conventional EDLC and Li-ion battery. This paper describes the preparation and characteristics of a hybrid supercapacitor and module for power quality stabilization. A cylindrical 3200F hybrid supercapacitor ($60{\times}74.5mm$) was assembled by using the $Li_4Ti_5O_{12}$ electrode as an anode and activated carbon as a cathode. It shows 2.5 times higher energy density than conventional EDLC with the same volume. In order to determine the characteristics of the hybrid supercapacitor Module for uninterruptible power supply (UPS), hybrid supercapacitor cells were connected in series with active balancing circuit. At even the high current density of 14A(10C), Module prepared by 18 cells showed the capacitance of 170F at 30~50V, suggesting the applicability for UPS.

• The Transactions of the Korean Institute of Power Electronics
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• v.28 no.1
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• pp.39-47
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• 2023

This paper applies a structural technique with uniform parallel switch characteristics in gates and power loops to minimize the ringing and current imbalance that occurs when a general discrete package (TO-247)-based power semiconductor device is operated in parallel. Also, this propose a heat sink integrated switching module with heat sink design flexibility and high power density. The developed heat dissipation-integrated switching module verifies the symmetry of the parasitic inductance of the parallel switch through Q3D by ansys and the validity of the structural technique of the parallel switch using the LLC resonant converter experiment operating at a rated capacity of 7.5 kW.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.711-713
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• 2004

In the past time, the protection relay did only a protection function. Currently, its upgraded device i.e. IED(Intelligent Electric Device) has been designed to protect, control, and monitor the whole power system automatically. Also the device is desired to successfully measure important elements of the power system. This paper considers design method of a digital protection IED with a function of measuring various elements and a communication function. The protection IED is composed of the specific function modules that are signal process module, communication module, input/output module and main control module. A signal process module use a DSP processor for analysis of input signal. Main control module use a embedded processor, Xscale, that has an ARM Core. The communication protocol uses IEC61850 protocol that becomes standard in the future. The protection IED is able to process mass information with high-performance processor. As each function module is designed individually, the reliability of the device can be enhanced.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.79-80
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• 2006

From a viewpoint of heat stress at high temperatures and contact thermal resistance, it is confirmed that the optimal structure is the skeleton structure using Cu substrate on the cooling side, which has excellent heat conductivity and the optimal installation method is to adopt a carbon sheet and a mica sheet to the high temperature side, where Si grease is applied to the low temperature side, under pressurized condition. The power of the developed modules indicated 0.5W in an $FeSi_2$ module and 3.8 W with a SiGe module at 823K, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.826-831
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• 2009

In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.2 no.1
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• pp.11-15
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• 2009

In this study, we have developed the SMPS(Switched-mode power supply) power module for the medical kit. It is used the medical kit for improved supplying power better than the existing power module in performance, safety and reliability. The developed SMPS(Switched-mode power supply) is composed of the three fundamental electronic circuits, first one is for converting AC power to DC power, second one is for converting to high frequency, and the other is for absorbing noise frequency and preventing malfunction. It is possible for developed SMPS module to enlarge applications for PC, home appliances, switchboard as well as medical instruments.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.14-21
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• 2009

In this paper, a Ka-band 10 W power amplifier module with seven power MMIC bare dies is designed and fabricated using MIC technology which combines multiple MMIC chips on a thin film substrate. Modified Wilkinson power dividers/combiners and CBFGCPW-Microstrip transitions for suppressing resonance and reducing connection loss are utilized for high-gain and high-power millimeter wave modules. A new TTL pulse timing control scheme is proposed to improve output power degradation due to large bypass capacitors in the gate bias circuit. Pulse-mode operation time is extended more than 200 nsec and output power increase of 0.62 W is achieved by applying the proposed scheme to the Ka-band 10 W power amplifier module operating in the pulsed condition of 10 kHz and $5\;{\mu}sec$. The implemented power amplifier module shows a power gain of 59.5 dB and an output power of 11.89 W.

• Journal of the Korea Institute of Military Science and Technology
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• v.24 no.1
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• pp.50-60
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• 2021

For conventional AESA radars, DC-DC power modules using 300 Vdc have low efficiency, high volume, heavy weight, and high price, which have problems in modularity with T/R module groups. In this paper, to improve these problems, we propose a distributed DC-DC power module with high-voltage 800 Vdc and high-efficiency Step-down Converter. In particular, power requirements for modern and future marine weapons systems and sensors are rapidly evolving into high-energy and high-voltage power systems. The power distribution of the next generation Navy AESA radar antenna is under development with 1000 Vdc. In this paper, the proposed highvoltage, high-efficiency DC-DC power modules increase space(size), weight, power and cooling(SWaP-C) margins, reduce integration costs/risk, and reduce maintenance costs. Reduced system weight and higher reliability are achieved in navy and ground AESA systems. In addition, the proposed architecture will be easier to scale with larger shipboard radars and applicable to other platforms.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.498-498
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• 2013

Atmospheric Pressure Plasmas have pioneered a new field of plasma for biomedical application bridging plasma physics and biology. Biological and medical applications of plasmas have attracted considerable attention due to promising applications in medicine such as electro-surgery, dentistry, skin care and sterilization of heat-sensitive medical instruments [1]. Traditional approaches using electronic devices have limits in heating, high voltage shock, and high current shock for patients. It is a great demand for plasma medical industrial acceptance that the plasma generation device should be compact, inexpensive, and safe for patients. Microwave-excited micro-plasma has the highest feasibility compared with other types of plasma sources since it has the advantages of low power, low voltage, safety from high-voltage shock, electromagnetic compatibility, and long lifetime due to the low energy of striking ions [2]. Recent experiment [2] shows three-log reduction within 180-s treatment of S. mutans with a low-power palm-size microwave power module for biomedical application. Experiments using microwave plasma are discussed. This low-power palm-size microwave power module board includes a power amplifier (PA) chip, a phase locked loop (PLL) chip, and an impedance matching network. As it has been a success, more compact-size module is needed for the portability of microwave devices and for the various medical applications of microwave plasma source. For the plasma generator, a 1.35-GHz coaxial transmission line resonator (CTLR) [3] is used. The way of reducing the size and enhancing the performances of the module is examined.

• Journal of Power Electronics
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• v.9 no.3
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• pp.464-471
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• 2009

This paper introduces a new Motion-$SPM^{TM}$ (Smart Power Modules) module in Single In-line Package (SIP), which is a fully optimized intelligent integrated IGBT inverter module for up to 1kW low power motor drive applications. This module offers a sophisticated, integrated solution and tremendous design flexibility. It also takes advantage of pliability for the arrangement of heat-sink due to two types of lead forms. It comes to be realized by employing non-punch-through (NPT) IGBT with a fast recovery diode and highly integrated building block, which features built-in HVICs and a gate driver that offers more simplicity and compactness leading to reduced costs and high reliability of the entire system. This module also provides technical advantages such as the optimized cost effective thermal performances through IMS (Insulated Metal Substrate), the high latch immunity. This paper provides an overall description of the Motion-$SPM^{TM}$ in SIP as well as actual application issues such as electrical characteristics, thermal performance, circuit configurations and power ratings.