• Title/Summary/Keyword: High performance heat sink

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THE EFFECTS OF RADIAL HEAT SINK GEOMETRY AND SURFACE COATINGS ON THE LED COOLING PERFORMANCE FOR HIGH POWER LED LAMP (고출력 LED 램프 용 방사형 히트싱크의 형상 및 표면코팅이 LED 냉각성능에 미치는 영향에 대한 연구)

  • Kim, H.S.;Park, S.H.;Kim, D.;Kim, K.
    • Journal of computational fluids engineering
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    • v.18 no.1
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    • pp.63-68
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    • 2013
  • The purpose of this study is to investigate the cooling performance of radial heat sink used for high power LED lightings by natural convection cooling with surrounding air. Experimental and numerical analyses are carried out together. Parametric studies are performed to compare the effects of geometric parameters in radial heat sink such as the number of fins, fin height, fin length, and thickness of fin base as well as the surface coatings of radial heat sink. In this study, the cooling of 60 W LED lamp is examined with radiative heat transfer considered as well as natural convection. Numerical results show the optimum condition when the number of fin is 40, heat sink height is 120 mm, fin length is 15 mm, and fin base thickness is 3 mm. The difference in temperature of the LED metal PCB is within $1^{\circ}C$ between numerical analyses and experimental results. Also, the CNT coating on the heat sink surface is found to increase the cooling performance significantly.

A Study on Cooling for High Thermal Density Electronics Using Heat Sink and Heat Spreader (히트싱크 및 히트 스프레더를 이용한 고밀도 발열 전자부품의 방열 구조에 관한 연구)

  • Kang, Sung-Wook;Kim, Ho-Yong;Kim, Jin-Cheon
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2286-2291
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    • 2008
  • Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

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Evaluation on the Cooling Performance to Design Heat sinks for LED lightings (LED 조명용 히트싱크 방열기 설계를 위한 냉각성능 평가)

  • Jung, Tae-Sung;Kang, Hwan-Kook
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.7
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    • pp.778-784
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    • 2012
  • In comparison with some other light sources, LED has merits such as increased life expectancy, fast response, pollution free, and high energy efficiency. Lately, due to development of LED with high brightness and capacity, LED has widely used in many industrial fields such as automotive, aviation, display, transportation and special lighting applications. Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. In this study, experiments on measuring the heat generation rate of LED and the cooling performance of a heat sink were carried for analyzing the thermal characteristics of LED lighting system in free convection. From the results, dimensionless correlation on the cooling performance of heat sink in natural convection was proposed with Nusselt number and Rayleigh number as a guideline for designing cooling device of LED lightings.

Study on the Natural Convection Heat-Transfer Enhancement in Radial Heat Sink Using the Perforation and Flow Guide (천공과 유동 가이드를 활용한 방사형 히트싱크의 자연대류 열전달 향상에 관한 연구)

  • Jeon, Sora;Li, Bin;Byon, Chan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.5
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    • pp.339-345
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    • 2016
  • In this study, we numerically investigate the thermal performance of an enhanced radial heat sink with a perforation and chimney structure. We estimate the thermal performance of the enhanced radial heat sink, and compared it with that of a conventional radial heat sink. The results show that the radial heat sink with perforation has a higher thermal performance when either of the diameter and the number of perforations is high. With regards to the radial heat sink with a chimney structure, we investigate primarily the effect of the fin number, and the spacing between the chimney and the base plate on the thermal performance. The results show that there are optimal values for the fin number and the spacing between chimney and base plate. In addition, the enhanced radial heat sinks have maximum thermal performance when facing upward ($0^{\circ}$), while it has worst performance when facing sideward ($90^{\circ}$). The perforation and chimney are shown to cause thermal performance enhancements of 17% and 20%, respectively, compared with a conventional radial heat sink. The proposed method is useful for starting business, and is useful in terms of venture and entrepreneurship.

Cooling Performance Study of a Impinging Water Jet System with Heat Sink for High Power LEDs (분사냉각모듈 내에 부착된 히트싱크에 따른 고출력 LED의 냉각성능에 관한 연구)

  • Ku, G.M.;Kim, K.;Park, S.H.;Choi, S.D.;Heo, J.W.
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.6
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    • pp.152-158
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    • 2013
  • The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

Effect of the variation of base thickness on the heat release performance of the heat sink (히트싱크 베이스의 두께 변화가 방열성능에 미치는 영향)

  • Kim, Jung Hyun;Lee, Gyo Woo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.8
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    • pp.4749-4755
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    • 2014
  • In this study, to maximize the heat release from the heat generating environment, such as a high-capacity inverter, the heat release performance of the extruded-type heat sinks with the variation of the base thickness were investigated using the experimental and numerical methods. The base thickness was varied from 5 to 14 mm. The heat release was characterized by the amount of heat released through the heat sink, the surface temperature of heat sink base between the heat sources, and temperature of heat sources. The surface temperatures between heat sources and the amounts of heat release were improved more as the base thickness was decreased. In contrast, the temperatures of the heat sources decreased with increasing base thickness. Based on the case study of these heat sinks, it is believed that a heat sink with a 9.5mm-thick base was optimized for the heat release.

A Study on Analysis of Complex Heat Sink System for High Efficiency LED Thermal Effect (고효율 LED 방열효과 증대를 위한 융합형 Heat Sink 장치 방열 해석)

  • Kang, Chang-Soo;Kang, Ki-Sung
    • 전자공학회논문지 IE
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    • v.48 no.2
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    • pp.12-18
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    • 2011
  • In this paper, did numerical simulation to confirm LED module for lighting and protection against heat special quality of heat sink device. Analysis was gone dividing on case that emitting light side turns normalcy department considering that eat of device according to usage and case that turn down looking being street lamp of 200 W or security appointment lighting device analysis case, and also, volume of thermal element divides on big case and small case and analyzed. Confirmed that can do so that may discharge LED's thermal value to outside enough in analysis wave and current heat sink shape, and investigated that difference of protection against heat performance according to position of device and size of thermal element appears.

Development of Water-Cooled Heat Sink for High-Power IGBT Inverter

  • Han, Min-Sub;Lee, Su-Dong;Hong, Chan-Ook;Yang, Chun-Suk;Kim, Kyung-Seo
    • 한국전산유체공학회:학술대회논문집
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    • 2008.03b
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    • pp.349-353
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    • 2008
  • We present the development of a water-cooled heat sink that provides reliable thermal performance for high-power IGBT inverter. The development process comprises three stages. In the concept design, the thermal performances of two design proposals are considered. The thermal system of each design is particularly analyzed using the compact model. In the detailed design stage, specific dimensions of the heat sink are determined considering the design options under given external restrictions and the results from three-dimensional heat transfer analysis. The prototype of the resultant design is made and tested on the rig for final confirmation. We emphasize the relevant use of the thermal analysis on each stage and also discuss various practical issues involved.

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Effects of Symmetrically Arranged Heat Sources on the Heat Release Performance of Extruded-Type Heat Sinks (열원의 대칭 배열에 따른 압출형 히트싱크의 방열성능 연구)

  • Ku, Min Ye;Shin, Hon Chung;Lee, Gyo Woo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.2
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    • pp.119-126
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    • 2016
  • In this study we investigated the effects of symmetrically arranged heat sources on the heat release performances of extruded-type heat sinks through experiments and thermal fluid simulations. Also, based on the results we suggested a high-efficiency and cost-effective heat sink for a solar inverter cooling system. In this parametric study, the temperatures between heaters on the base plate and the heat release rates were investigated with respect to the arrangements of heat sources and amounts of heat input. Based on the results we believe that the use of both sides of the heat sink is the preferred method for releasing the heat from the heat source to the ambient environment rather than the use of a single side of the heat sink. Also from the results, it is believed that the symmetric arrangement of the heat sources is recommended to achieve a higher rate of heat transfer. From the results of the thermal fluid simulation, it was possible to confirm the qualitative agreement with the experimental results. Finally, quantitative comparison with respect to mass flow rates, heat inputs, and arrangements of the heat source was also performed.

Development of the High Performance W-Cu Components by Powder Injection Molding

  • Chung, Seong-Taek;Kwon, Young-Sam;Lee, Seong;Noh, Joon-Woong
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.761-762
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    • 2006
  • W-Cu alloy was very useful material for a heat sink, high electric contact and EDM electrode. Powder injection molding (PIM) is the optimum manufacturing technology to provide W-Cu components with low-cost and high-volume. We used various compositions of tungsten coated copper powders (W-Cu with 10 to 80 wt-% of copper) to manufacture W-Cu components by PIM. The optimum mixing, injection molding, debinding and sintering conditions to provide the high performance W-Cu components were investigated. The thermal and mechanical properties of W-Cu parts by PIM were measured. Finally, we can verify the high performance of W-Cu components by PIM with the tungsten coated copper.

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