• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.8
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• pp.42-47
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• 2000

Long-wavelength infrared (LWIR) detectors made of self-assembled quantum dots embedded in the channel region of high electron mobility transistor (HEMT) is demonstrated. Above 180 K, the detector shows low dark currents due to strong confinement effect of electrons in InAs quantum dots and exhibits the broad spectral response ranging from 7 mm to 11 mm. The peak detectivity ($D^*$) of $1.93{\times}10^{10}cmHz^{1/2}/W$ is obtained at 9.4 mm. The photocurrent characteristics as a function of applied bias are similar to that of normal FETs, while the photocurrent decreases as the applied electric field exceeds $2{\times}10^3V/cm$ because of the increased dark current.

• Journal of IKEEE
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• v.11 no.4
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• pp.152-157
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• 2007

AlGaN/GaN high electron mobility transistors (HEMTs) were fabricated and the effect of ${N_2}O$ plasma on the electrical characteristics of the devices was investigated. The HEMT exposed to ${N_2}O$ plasma formed by 40 W of RF power in a chamber with pressure of 20 mTorr at a temperature of $200^{\circ}C$, exhibited a reduction of gate leakage current from 246 nA to 1.2 pA by 10 seconds treatment. The current between the two isolated active regions reduced from 3 uA to 7 nA and the sheet resistance of the active layer was lowered also. The variations of electrical characteristics for HEMT were occurred within a short time expose of 10 seconds and the successive expose did not influence on the improvements of gate leakage characteristics and conductivity of the active region. The reduced leakage current level was not varied by successive $SiO_2$ deposition and its removal. The transconductnace and drain current of AlGaN/GaN HEMTs were increased also by the expose to the ${N_2}O$ plasma.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.76-76
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• 2008

갈륨-질화물(GaN) 기반의 고속전자이동도 트랜지스터(high electron mobility transistor, HEMT)는 최근 마이크로파 또는 밀리미터파 등의 고주파 대역의 통신시스템에 널리 사용되는 전자소자이자, 차세대 고주파용 전력 소자로 각광받고 있다. AlGaN/GaN HEMT에서 AlGaN층과 GaN층의 이종접합 구조(heterostructure)는 두 물질 간의 큰 전도대의 불연속성으로 인해 발생하는 이차원 전자가스(two-dimensional electron gas, 2DEG) 채널을 이용하여 높은 전자이동도, 높은 항복전압 및 우수한 고출력 특성을 얻는 것이 가능하다. 그러나 이린 이론적인 우수한 특성에도 불구하고 실제 AlGaN/GaN HEMT 소자에서는 AlGaN 표면과 AlGaN과 GaN 층 사이 접합면, AlGaN과 GaN 벌크층에 존재하는 트랩의 영향으로 이론보다 낮은 DC 출력 특성을 갖는다. 본 논문에서는 표면, 접합면, 벌크 층에 존재하는 트랩들을 각각의 존재 유무에 따라 시뮬레이션 함으로써 각각의 트랩이 DC 특성에 미치는 영향에 대해서 알아본다. 또한 소스와 게이트, 드레인과 게이트간의 거리에 따라 표면 트랩에 따른 영향과 AlGaN층과 GaN 층의 두께를 변화시켜가면서 각 층의 두께에 따라 벌크 트랩이 DC 특성에 미치는 영향을 알아보았다. 본 논문에서 트랩에 따른 특성의 파악을 위해서 $ATLAS^{TM}$를 이용하여 전산모사 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.151-151
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• 2008

갈륨-질화물(GaN) 기반의 고속전자이동도 트랜지스터(high electron mobility transistor, HEMT)는 마이크로파 또는 밀리미터파 등과 같은 고주파 대역의 통신시스템에 널리 사용되는 전자소자로 각광받고 있다. GaN HEMT는 AlGaN/GaN 또는 AlGaN/InGaN/GaN 등과 같은 이종접합구조(heterostructure)로부터 발생하는 이차원 전자가스(two-dimensional electron gas, 2DEG) 채널을 이용하여 캐리어 구속효과(carrier confinement) 및 이동도의 향상이 가능하다. 또한 높은 2DEG 채널의 면밀도(sheet concentration) 와 전자의 포화 속도(saturation velocity)를 바탕으로 고출력 동작이 가능하여 차세대 이동통신용 전력 증폭기로 주목받고 있다. 그러나 이론적으로 우수한 특성과 달리, 실제 소자에서는 epi 성장시의 결함이나 전위, 표면 상태에 따른 2DEG 감소 등의 영향으로 이론보다 높은 누설 전류와 낮은 항복 전압 특성을 가진다. 특히, 기존의 GaN HEMT 구조에서는 Drain-Side Gate Edge에서의 전계 집중이 항복 전압 특성에 미치는 영향이 크다. 본 논문에서는 이러한 문제를 해결하기 위해 Trapezoidal Gate구조를 이용하여 Drain 방향의 Gate Edge가 완만히 변하는 구조를 제안하였다. 이를 위해 $ATLAS^{TM}$ 전산모사 프로그램을 이용하여 Trapezoidal Gate 구조를 구현하여 형태에 따른 전류-전압 특성 및 소자의 스위칭 특성 및 Gate 아래 채널층에 형성되는 Electric Field의 분산을 조사하고, 이를 바탕으로 고속 동작 및 높은 항복 전압을 갖는 AlGaN/GaN HEMT의 최적화된 구조를 제안하였다. 새로운 구조의 Gate를 적용한 AlGaN/GaN HEMT는 Gate edge에서의 전계를 분산시켜 피크 값이 감소되는 것을 확인하였다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.10
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• pp.564-569
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• 2000

This paper analyzed single AlGaAs/GaAa heterojunction energy band structures by solving Schr dinger's equation and Poisson's equation self-consistently. Four different concentrations, positively ionized donors, holes in the valence band, free electrons in the conduction band and 2DEG are taken into account for the whole system. 2DEG from both of the structures are obtained and compared with the date available in the literatures. Differential capacitances are also calculated from the concentration profiles obtained to prove the validity of the single AlGaAs/GaAs system. Finally, theoretical predictions for both of 2DEGs and the capacitances show good agreement with the experimental data referred in this study. It has only an error of les than 10 percent.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.2
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• pp.165-170
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• 2015

In this paper, we present design and measurement of LNA(Low Noise Amplifier) based on GaN HEMT(Gallium Nitride High Electron Mobility Transistor) to reduce the total noise figure of radar receiver and for robustness of LNA. In radar receiver using LNA based on GaAs(Gallium Arsenide) technology, limiter is necessary at the very front of the radar receiver to protect LNA. As a result, total noise figure of radar receiver is deteriorated. In this research, measured noise figure of LNA based on GaN HEMT is below 2 dB. In the case of commercialized GaAs LNA, recommended maximum input power is about 30 dBm. On the other hand, GaN HEMT LNA which is designed and measured is burned-out when input power is 43 dBm and robustness is guaranteed at input power 45.4 dBm.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.9
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• pp.783-789
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• 2015

This paper presents a Doherty power amplifier(DPA) operating in the 2.6 GHz band for long term evolution(LTE) systems. In order to achieve high efficiency, second and third harmonic impedances are controlled using a compact output matching network. The DPA was implemented using a gallium nitride high electron mobility transistor(GaN-HEMT) that has many advantages, such as high power density and high efficiency. The implemented DPA was measured using an LTE downlink signal with a 10 MHz bandwidth and 6.5 dB PAPR. The implemented DPA exhibited a gain of 13.1 dB, a power-added efficiency(PAE) of 57.6 %, and an ACLR of -25.7 dBc at an average output power of 33.4 dBm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.7-12
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• 2004

In this paper, CPW wideband distributed amplifier was designed and fabricated using 0.1 $\mum$ InGaAs/InAlAs/GaAs Metamorphic HEMT(High Electron Mobility Transistor). The DC characteristics of MHEMT are 442 mA/mm of drain current density, 409 mS/mm of maximum transconductance. The current gain cut-off frequency(fT) is 140 GHz and the maximum oscillation frequency(fmax) is 447 GHz. The distributed amplifier was designed using 0.1 $\mum$ MHEMT and CPW technology. We designed the structure of CPW curve, tee and cross to analyze the discontinuity characteristics of the CPW line. The MIMIC circuit patterns were optimized electromagnetic field through momentum. The designed distributed amplifier was fabricated using our MIMIC standard process. The measured results show S21 gain of above 6 dB from DC to 45 GHz. Input reflection coefficient S11 of -10 dB, and output reflection coefficient S22 of -7 dB at 45 GHz, respectively. The chip size of the fabricated CPW distributed amplifier is 2.0 mm$\times$l.2 mm.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.436-440
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• 2021

The impact of the gate length (L_g) on the DC and high-frequency characteristics of indium-rich In_0.8Ga_0.2As channel high-electron mobility transistors (HEMTs) on a 3-inch InP substrate was inverstigated. HEMTs with a source-to-drain spacing (L_SD) of 0.8 ㎛ with different values of L_g ranging from 1 ㎛ to 19 nm were fabricated, and their DC and RF responses were measured and analyzed in detail. In addition, a T-shaped gate with a gate stem height as high as 200 nm was utilized to minimize the parasitic gate capacitance during device fabrication. The threshold voltage (V_T) roll-off behavior against L_g was observed clearly, and the maximum transconductance (g_{m_max}) improved as L_g scaled down to 19 nm. In particular, the device with an L_g of 19 nm with an L_SD of 0.8 mm exhibited an excellent combination of DC and RF characteristics, such as a g_{m_max} of 2.5 mS/㎛, On resistance (R_ON) of 261 Ω·㎛, current-gain cutoff frequency (f_T) of 738 GHz, and maximum oscillation frequency (f_max) of 492 GHz. The results indicate that the reduction of L_g to 19 nm improves the DC and RF characteristics of InGaAs HEMTs, and a possible increase in the parasitic capacitance component, associated with T-shap, remains negligible in the device architecture.

• Electrical & Electronic Materials
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• v.12 no.8
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• pp.10-17
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• 1999

본 논문에서는 최근 초고주파영역에서 우수한 고출력 특성을 갖는 것으로 알려진 AlGaN-GaN high-electron mobility transistor(HEMT's)의 최근 기술동향과 함께 응용가능성 및 한계에 대하여 검토하였다. GaN는 약 3.4eV 정도의 큰 밴드갭을 갖는 까닭에 200V 이상의 높은 항복전압을 갖는다. 또한 AlGaN와 이종접합을 형성하는 경우 piezoelectric field에 의하여 1$\times$10\ulcornercm\ulcorner 이상의 높은 밀도의 2DEG(two-dimensional electron gas)의 형성이 가능하고, 상온 전자이동도가 1,200$\textrm{cm}^2$/V-s 이상으로서 초고주파 고출력 전자소자의 구현에 필요한 물성을 갖추고 있다. 현재 cutoff frequency fT가 60GHz이상, maximum frequency fmax가 150GHz 이상의 소자가 개발되었으며, 3W/cm 이상의 cw(continuous wave) 전력밀도가 보고된바 있다. 또한 열전도도가 큰 새로운 기판이 개발되고, heat dissipation을 개선하기 위한 새로운 소자구조가 개발됨에 따라 보다 높은 전력밀도를 갖는 단위소자 또는 MMIC(monolithic microwave integrated circuits)의 구현가능성이 높아지고 있다.