• 제목/요약/키워드: High deposition

검색결과 3,333건 처리시간 0.042초

고용착 GMA 용접의 Arc 안정성 및 용적이행 현상에 미치는 보호gas의 영향 (Effect of Shielding gas Composition on Arc Stability and Transfer mode of High deposition GMA Welding)

  • 경규담;천홍정;이정헌;강봉용;김희진
    • Journal of Welding and Joining
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    • 제15권1호
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    • pp.109-115
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    • 1997
  • The arc stability and the metal transfer mode of high deposition GMA welding were investigated using various compositions of shielding gas with two types of filler, ie solid wire and metal cored wire. As for a solid wire, the transfer mode changed from axial spray to rotational spray with increasing wire feed rate (welding current) and the transition current was different with the gas composition. The gas composition also affected the apparent stability of rotating arc. As for a metal cored wire, on the other hand, no transition occurred and thus spray transfer mode could be applied with the welding current over 500A (deposition rate over 300g/min). Looking for the development of high deposition GMA welding process, above results were discussed in two different ways, one is to elevate the transition current, the other is to stabilize the rotational transfer mode.

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The Effects of Deposition Rates on Exchange Coupling and Magnetoresistance in NiO Spin-Valve Films

  • D. G. Hwang;Park, C. M.;Lee, S. S.;Lee, K. A.
    • Journal of Magnetics
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    • 제2권4호
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    • pp.143-146
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    • 1997
  • The effects of deposition rate on exchange coupling field Hex and coercive field Hc in NiO spin-valves are discussed. The Hex and Hc increased with deposition rate of NiO film. The rms roughnesses of the NiO deposited at 6 ${\AA}$/min (NiO-Low) and 30${\AA}$/min (NiO-High) were almost similar, however, the short-range roughness increased with the deposition rate. The Hex, Hc and surface morphologies for the modulated NiO spin-valve films such as NiO-Low\NiO-High\NiO-Low and NiO-High\NiO-Low were investigated.

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Precursor alternating metalorganic chemical vapor deposition에 의한 (100) GaAs 기판위로의 InGaAs 성장시의 높은 indium 유입 (High indium incorporation in the growth of InGaAs on (100) GaAs by precursor alternating metalorganic chemical vapor deposition)

  • 정동근
    • 한국진공학회지
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    • 제5권4호
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    • pp.354-358
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    • 1996
  • precuror alternating metalorganic chemical vapor deposition(PAMOCVD)에 의한 InGaAs의 성장시에 높은 indium의 유입이 관찰되었다. gallium과 indium의 전구물질의 분해의 차이 그리고 이에따른 분해된 전구물질 분자의 흡착행동의 차이를 고려함으로써 PAMOCVD 성장시의 결정내로의 높은 indium유입의 mechanism을 제안하였다.

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펄스 레이저 증착법에 의한 DLC 박막의 내마모성 특성변화 (Characterization of tribologic DLC thin films fabricated by pulsed laser deposition)

  • 심경석;이상렬
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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    • pp.851-853
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    • 1999
  • DLC thin films have been fabricated by pulsed laser deposition with various deposition parameters. The characterization of fabricated thin films was performed depending on the deposition parameters. As the kinetic energies provided by deposition temperature and the laser energy density were increased, the film showed graphite properties. Structural properties of the films were investigated by Raman spectroscopy. The growth energy should be optimized to fabricate high quality DLC thin films. DLC films showed high hardness and their friction coefficient was measured to be about 0.2 regardless of the load of the ball pin.

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Chemical Vapor Deposition of Silicon Carbide Thin Films Using the Single Precursor 1,3-Disilabutane

  • Lee, Kyung-Won;Boo, Jin-Hyo;Yu, Kyu-Sang;Kim, Yunsoo
    • The Korean Journal of Ceramics
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    • 제3권3호
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    • pp.177-181
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    • 1997
  • Epitaxial films of cubic silicon carbide (3C-SiC, $\beta$-SiC) have been grown on Si(001) and Si(111) substrates by high vacuum chemical vapor deposition using the single precursor 1,3-disilabutane, $H_3SiCH_2SiH_2CH_3$, at temperatures 900~$100^{\circ}C$. The advantage of using the single precursor over the covnentional chemical vapor deposition is evident in that the source chemical is safe to handle, carbonization of the substrates is not necessary, accurate stoichiometry of the silicon carbide films is easily achieved, and the deposition temperature is much lowered. The films were characterized by XPS, XRD, SEM, RHEED, RBS, AES, and TED.

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WSix 증착에서 공정조건이 contact 저항에 미치는 영향 (Influence of Process Condition on Contact Resistance in WSix Deposition)

  • 정양희;강성준;강희순
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2002년도 춘계종합학술대회
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    • pp.279-282
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    • 2002
  • In this paper, we discuss influence of process condition on contact resistance in WSix deposition process. In the WSix deposition process, we confirmed that word line to bit line contact resistance(WBCR) due to temperature of word line WSix deposition among various process condition split experiment. RTP treatment, d-poly ion implantation dose and thickness was estimated a little bit influence on contact resistance. Also, life time of shower head in the process chamber for WSix deposition related to contact resistance. The results obtained in this study are applicable to process control and electrical characteristics for high reliability and high density DRAM's.

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Characteristics of NiO films prepared by atomic layer deposition using bis(ethylcyclopentadienyl)-Ni and O2 plasma

  • Ji, Su-Hyeon;Jang, Woo-Sung;Son, Jeong-Wook;Kim, Do-Heyoung
    • Korean Journal of Chemical Engineering
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    • 제35권12호
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    • pp.2474-2479
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    • 2018
  • Plasma-enhanced atomic layer deposition (PEALD) is well-known for fabricating conformal and uniform films with a well-controlled thickness at the atomic level over any type of supporting substrate. We prepared nickel oxide (NiO) thin films via PEALD using bis(ethylcyclopentadienyl)-nickel ($Ni(EtCp)_2$) and $O_2$ plasma. To optimize the PEALD process, the effects of parameters such as the precursor pulsing time, purging time, $O_2$ plasma exposure time, and power were examined. The optimal PEALD process has a wide deposition-temperature range of $100-325^{\circ}C$ and a growth rate of $0.037{\pm}0.002nm$ per cycle. The NiO films deposited on a silicon substrate with a high aspect ratio exhibited excellent conformality and high linearity with respect to the number of PEALD cycles, without nucleation delay.

다공성 금속 샤워헤드가 적용된 상압플라즈마 화학기상증착법을 이용한 저온 다결정 실리콘 증착 공정 (Low Temperature Polycrystalline Silicon Deposition by Atmospheric Pressure Plasma Enhanced CVD Using Metal Foam Showerhead)

  • 박형규;송창훈;오훈정;백승재
    • 한국전기전자재료학회논문지
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    • 제33권5호
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    • pp.344-349
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    • 2020
  • Modern thin film deposition processes require high deposition rates, low costs, and high-quality films. Atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) meets these requirements. AP-PECVD causes little damage on thin film deposition surfaces compared to conventional PECVD. Moreover, a higher deposition rate is expected due to the surface heating effect of atomic hydrogens in AP-PECVD. In this study, polycrystalline silicon thin film was deposited at a low temperature of 100℃ and then AP-PECVD experiments were performed with various plasma powers and hydrogen gas flow rates. A deposition rate of 15.2 nm/s was obtained at the VHF power of 400 W. In addition, a metal foam showerhead was employed for uniform gas supply, which provided a significant improvement in the thickness uniformity.

Solid Lubrication Characteristics of DLC Coated Alumina Seals in High Temperature

  • 옥철호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.356-356
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    • 2007
  • Plasma immersion ion beam deposition (PIIBD) technique is a cost-effective process for the deposition of diamond like carbon thin film, the possible solid lubricant on large surface and a complex shape. We used PIIB process for the preparation of DLC thin film on $Al_2O_3$ with deposition conditions of deposition temperature range $200^{\circ}C$, working gas pressure of 1.310-1Pa. DLC thin films were coated by $C_2H_2$ ion beam deposition on $Al_2O_3$ after the ion bombardment of SiH4 as the bonding layer. Energetic bombardment of $C_2H_2$ ions during the DLC deposition to ceramic materials generated mixed layers at the DLC-Si interface which enhanced the interface to be highly bonded. Wear test showed that the low coefficient of friction of around 0.05 with normal load 2.9N and proved the advantage of the low energy ion bombardment in PIIBD process which improved the tribological properties of DLC thin film coated alumina ceramic. Furthermore, PIIBD was recognized as a useful surface modification technique for the deposition of DLC thin film on the irregular shape components, such as molds, and for the improvement of wear and adhesion problems of the DLC thin film, high temperature solid lubricant.

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High aspect ratio wrinkled patterns on polymers by glancing angle deposition

  • Ko, Tae-Jun;Ahmed, Sk. Faruque;Lee, Kwang-Ryeol;Oh, Kyu-Hwan;Moon, Myoung-Woon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.335-335
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    • 2011
  • Instability of a thin film attached to a compliant substrate often leads to emergence of exquisite wrinkle patterns with length scales that depend on the system geometry and applied stresses. However, the patterns that are created using the current techniques in polymer surface engineering, generally have low aspect ratio of undulation amplitude to wavelength, thus, limiting their application. Here, we present a novel and effective method that enables us to create wrinkles with a desired wavelength and high aspect ratio of amplitude over wavelength as large as to 2.5:1. First, we create buckle patterns with high aspect ratio of amplitude to wavelength by deposition of an amorphous carbon film on a surface of a soft polymer poly(dimethylsiloxane) (PDMS). Amorphous carbon films are used as a protective layer in structural systems and biomedical components, due to their low friction coefficient, strong wear resistance against, and high elastic modulus and hardness. The deposited carbon layer is generally under high residual compressive stresses (~1 GPa), making it susceptible to buckle delamination on a hard substrate (e.g. silicon or glass) and to wrinkle on a flexible or soft substrate. Then, we employ glancing angle deposition (GLAD) for deposition of a high aspect ratio patterns with amorphous carbon coating on a PDMS surface. Using this method, pattern amplitudes of several nm to submicron size can be achieved by varying the carbon deposition time, allowing us to harness patterned polymers substrates for variety of application. Specifically, we demonstrate a potential application of the high aspect wrinkles for changing the surface structures with low surface energy materials of amorphous carbon coatings, increasing the water wettability.

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