• Title/Summary/Keyword: High Temperature Structure

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Effect of Aluminium Content on High Temperature Deformation Behavior of TiAl Intermetallic Compound

  • Han, Chang-Suk
    • Korean Journal of Materials Research
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    • v.25 no.8
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    • pp.398-402
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    • 2015
  • Fundamental studies of microstructural changes and high temperature deformation of titanium aluminide (TiAl) were conducted from the view point of the effect of Al content in order to develop the manufacturing process of TiAl. Microstructures in an as cast state consisted mainly of lamellar structure irrespective of Al content. By homogenization at 1473 K, the microstructures of Ti-49Al and Ti-51Al were transformed into an equiaxial structure which was composed of ${\gamma}$-TiAl, while the lamellar structure that was observed in Ti-46Al and Ti-47Al was much more stable. We found that the reduction of Al content suppressed the formation of equiaxial grains and resulted in a microstructure of only a lamellar structure. On Ti-49Al and Ti-51Al, dynamic recrystallization occurred during high temperature deformation, and the microstructure was transformed into a fine equiaxial one, while the microstructures of Ti-46Al and Ti-47Al contained few recrystallized grains and consisted mainly of a deformed lamellar structure. We observed that on the low-Al alloys the lamellar structure under hard mode deformation conditions deformed as kink observed B2-NiAl. High temperature deformation characteristics of TiAl were strongly affected by Al content. An increase of Al content resulted in a decrease of peak stress and activation energy for plastic deformation and an increase of the recrystallization ratio in TiAl.

DESIGN STUDY OF AN IHX SUPPORT STRUCTURE FOR A POOL-TYPE SODIUM-COOLED FAST REACTOR

  • Park, Chang-Gyu;Kim, Jong-Bum;Lee, Jae-Han
    • Nuclear Engineering and Technology
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    • v.41 no.10
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    • pp.1323-1332
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    • 2009
  • The IHX (Intermediate Heat eXchanger) for a pool-type SFR (Sodium-cooled Fast Reactor) system transfers heat from the primary high temperature sodium to the intermediate cold temperature sodium. The upper structure of the IHX is a coaxial structure designed to form a flow path for both the secondary high temperature and low temperature sodium. The coaxial structure of the IHX consists of a central downcomer and riser for the incoming and outgoing intermediate sodium, respectively. The IHX of a pool-type SFR is supported at the upper surface of the reactor head with an IHX support structure that connects the IHX riser cylinder to the reactor head. The reactor head is generally maintained at the low temperature regime, but the riser cylinder is exposed in the elevated temperature region. The resultant complicated temperature distribution of the co-axial structure including the IHX support structure may induce a severe thermal stress distribution. In this study, the structural feasibility of the current upper support structure concept is investigated through a preliminary stress analysis and an alternative design concept to accommodate the IHTS (Intermediate Heat Transport System) piping expansion loads and severe thermal stress is proposed. Through the structural analysis it is found that the alternative design concept is effective in reducing the thermal stress and acquiring structural integrity.

High-temperature Semiconductor Bonding using Backside Metallization with Ag/Sn/Ag Sandwich Structure (Ag/Sn/Ag 샌드위치 구조를 갖는 Backside Metallization을 이용한 고온 반도체 접합 기술)

  • Choi, Jinseok;An, Sung Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.1
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    • pp.1-7
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    • 2020
  • The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

Effect of Shading Types and Duration on Alleviation of High Temperature Stress in Cnidium officinale Makino (차광형태와 기간이 천궁의 고온피해 경감에 미치는 효과)

  • Nam, Hyo Hoon;Seo, Young Jin;Jang, Won Cheol
    • Korean Journal of Medicinal Crop Science
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    • v.28 no.2
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    • pp.111-118
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    • 2020
  • Background: Cnidium officinale is a medicinal crop sensitive to high temperature. It is necessary to develop environment control technology that can reduce environmental stresses such as high temperature. This study was conducted to develop technology for stable production of Cnidium officinale by reducing damage owing to high temperature by applying shading treatment of varying duration, and structure. Methods and Results: Black shading nets were used from May to September or November; shading structures such as pillar, flat roof, and tunnel type structures were installed. Environmental changes, rate of photosynthesis, and growth characteristics were investigated. The shading treatment reduced temperature by 3℃. The rate of photosynthesis and yield with shading treatment were higher by 134% and 127%, respectively, than those with full sunlight. The ratio of shading area ranged from 50% to 71% according to the type of shading structure. The effect of environmental control on growth varied depending on the type of shading structure. Conclusions: The shading treatment reduced damage owing to high temperature, shading rate of 55% - 75% was recorded between the period May - September, and the flat roof type shading structure was considered the most suitable among shading methods.

Examination of Ingredients of High Temperature Heat Resistant Inorganic Fire-Resistant Adhesive Using XRD Analysis (XRD 분석을 이용한 고온가열 무기계 내화 접착제의 성분검토)

  • Cho, Hyeon-Seo;Ji, Woo-Ram;Shin, Ki-Don;Lee, Gun-Cheol
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2018.11a
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    • pp.81-82
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    • 2018
  • The structure of the RC structure is actively reinforcing the structure of the building which has suffered from aging, artificial and natural damage of the building. Among various reinforcement methods, epoxy adhesive is used to attach FRP in FRP reinforcement method which is reinforcing by attaching FRP to the structural part. At this time, the epoxy adhesive having a low critical temperature has a sudden adhesive failure upon exposure to heat, and thus, the development of an inorganic fireproof adhesive having a high critical temperature has progressed. Therefore, in this study, the compositional change of inorganic fire - resistant adhesive exposed to high temperature heat was analyzed by XRD.

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Thermal-pressure loading effect on containment structure

  • Kwak, Hyo-Gyoung;Kwon, Yangsu
    • Structural Engineering and Mechanics
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    • v.50 no.5
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    • pp.617-633
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    • 2014
  • Because the elevated temperature degrades the mechanical properties of materials used in containments, the global behavior of containments subjected to the internal pressure under high temperature is remarkably different from that subjected to the internal pressure only. This paper concentrates on the nonlinear finite element analyses of the nuclear power plant containment structures, and the importance for the consideration of the elevated temperature effect has been emphasized because severe accident usually accompanies internal high pressure together with a high temperature increase. In addition to the consideration of nonlinear effects in the containment structure such as the tension stiffening and bond-slip effects, the change in material properties under elevated temperature is also taken into account. This paper, accordingly, focuses on the three-dimensional nonlinear analyses with thermal effects. Upon the comparison of experiment data with numerical results for the SNL 1/4 PCCV tested by internal pressure only, three-dimensional analyses for the same structure have been performed by considering internal pressure and temperature loadings designed for two kinds of severe accidents of Saturated Station Condition (SSC) and Station Black-out Scenario (SBO). Through the difference in the structural behavior of containment structures according to the addition of temperature loading, the importance of elevated temperature effect on the ultimate resisting capacity of PCCV has been emphasized.

Properties of Thermal Conductivity of Cement Mortar for Apartment Housing Floor Using Combined Strengthening Method (공동주택 바닥용 시멘트 모르타르의 복합강화법 변화에 따른 열전도 특성)

  • 윤길봉;전충근;정성철;윤기원;한천구
    • Proceedings of the Korea Concrete Institute Conference
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    • 2001.05a
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    • pp.243-248
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    • 2001
  • The objective of this study is to investigate the thermal conductivity of cement mortar for apartment housing floor using expansive admixture, copper fiber, cower lathe, hollowed aluminum plate. According to test results, temperature at point (a) located above heating pipe does not show significant variation with age, and temperature at (b), which is located at the finishing surface above heating pipe, and temperature at (c), which is located at center surface between heating pipe has remarkable change. Temperature distribution sat (b) are in order for, structure containing copper fiber>plain structure>structure containing hollowed aluminum plate>structure containing expansive admixture. Temperature distribution, shows high tendency in order for, structure containing copper fiber>structure containing copper lathe>structure containing hollowed aluminum plate>plain structure>structure containing expansive admixture. (a) estimation of temperature distribution is determined with the variation of temperature between (b) point and (c) point during 60 minutes heating.

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Mechanism of Piezoelectricity for Langasite Based on the Framework Crystal Structure

  • Ohsato, Hitoshi;Iwataki, Tsuyoshi;Morikoshi, Hiroki
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.2
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    • pp.51-59
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    • 2012
  • Piezoelectric langasite crystals have superior properties such as high temperature performance and high quality Q and can be applied in combustion pressure sensors and surface acoustic wave (SAW) filters. Crystal growth, crystal structure and properties of langasite group are reviewed, and the mechanism of piezoelectricity of langasite is presented based on the crystal structure and deformation under high pressure. Finally, for the discovery of new piezoelectric materials, this paper presents the role of the framework, and recommends the search of framework crystal structure, because the characteristic of the mechanism exists on the framework of the crystal structure.

A Study on the 3D Imaging of High Temperature Heating Cement Paste and the Analysis of Variation of the Pore Structure (고온 가열 시멘트 페이스트의 3D 영상화 및 세공구조 변화 분석에 관한 연구)

  • Kim, Min-Hyouck;Lee, Gun-Cheol
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2020.11a
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    • pp.147-148
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    • 2020
  • In case of high temperature damage such as fire, the durability of concrete is reduced due to the collapse of internal pore tissue. Therefore, in this paper, we are going to analyze the pore structure of cement paste hardening agent using MIP analysis and build up 3D data produced using X-ray CT tomography. The test specimen is made of cement paste from W/C 0.4. As the temperature of heating increased, the amount of air gap and the diameter of air gap in cement paste increased. It is judged that the air gap structure inside cement collapsed due to the evaporation of the hydrate, gel count, capillary water, etc. inside the cement due to the high temperature.

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Study on the Thermal Properties and High Impact of Elastic Epoxy Blend System (탄성에폭시 블렌드 시스템의 열적 특성 및 내충격성에 관한 연구)

  • 이경용;이관우;민지영;최용성;박대희
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.4
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    • pp.192-199
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    • 2004
  • Elastic-factor of elastic epoxy were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis), TGA (Thermogravimetric Analysis) and FESEM (Field Emission Scanning Electron Microscope) for structure-images analysis as toughness-investigation to improve brittleness of existing epoxy resin. A range of measurement temperature of the TMA and DMTA was changed from -20($^{\circ}C$) to $200^{\circ}(C)$, and TGA was changed from $0^{\circ}(C)$ to $600^{\circ}(C)$. Glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices with the content of 0(phr), 20(phr) and 35(phr). Also, thermal expansion coefficient (a), high temperature, modulus and loss factor were investigated through TMA, TGA, and DMTA. In addition, the structure of specimens was analyzed through FESEM, and then elastic-factor of elastic epoxy was visually showed by FESEM. As thermal analysis results, 20(phr) was more excellent than 30(phr) thermally and mechanically. Specially, thermal expansion coefficient, high temperature, modulus, and damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.