• 제목/요약/키워드: High Speed Process

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고속 열차용 분할형 차륜디스크 개발 (Development of a Split Wheel-Mounted Brake Disc for a High Speed Train)

  • 조동현;강성웅;조연재
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2010년도 춘계학술대회 논문집
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    • pp.583-589
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    • 2010
  • This paper describes the design process and the test of split wheel-mounted brake discs for high speed train with maximum speed 180km/h. A disc set composed 2 disc rings and individual rings are partitioned into 3 pieces with the same circumferential angle. Because partitioned disc rigs are exposed to severe centrifugal force as the vehicle speed increase, finite element analyses used in the design process to ensure mechanical safety. A prototype was verified its mechanical safety through the spin test up to 250km/h. 2 prototypes for 1 wheelset are mounted to Korean Tilting Train(TTX) and have been running over 15,000km

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연강 판재의 속도에 따른 블랭킹의 유한요소해석 (FEM Analysis of Blanking of Mild Steel Sheet at Various Punch Speeds)

  • 송신형;최우천
    • 한국생산제조학회지
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    • 제25권6호
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    • pp.458-461
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    • 2016
  • In this study, a finite element analysis for high-speed blanking of mild steel is performed. A thermomechanically coupled simulation model of a blanking process was developed using ABAQUS/Explicit. Through a simulation of the high-speed blanking process of mild steel, the influence of the punch speed, tool edge radius, and work material thickness on the development of the plastic heat and punch load were studied. The results of the study revealed that a higher punch speed caused thermal softening of the work material and decreased the punch load. Decreasing tool edge radius could help reduce the punch load. In addition, the results of the study revealed that the thermal softening effect was more dominant in the blanking of a mild steel sheet with a greater thickness as compared to that in the blanking of a mild steel sheet with a lower thickness.

Reduction of surface roughness during high speed thinning of silicon wafer

  • Heo, W.;Ahn, J.H.;Lee, N.E.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.392-392
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    • 2010
  • In this study, high-speed chemical dry thinning process of Si wafer and evolution of surface roughness were investigated. Direct injection of NO gas into the reactor during the supply of F radicals from $NF_3$ remote plasmas was very effective in increasing the Si thinning rate due to the NO-induced enhancement of surface reaction but thinned Si surface became roughened significantly. Addition of Ar gas, together with NO gas, decreased root mean square (RMS) surface roughness of thinned Si wafer significantly. The process regime for the thinning rate enhancement with reduced surface roughness was extended at higher Ar gas flow rate. Si wafer thinning rate as high as $22.8\;{\mu}m/min$ and root-mean-squared (RMS) surface roughness as small as 0.75 nm could be obtained. It is expected that high-speed chemical dry thinning process has possibility of application to ultra-thin Si wafer thinning with no mechanical damage.

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Gate/Body-Tied 구조의 고감도 광검출기를 이용한 2500 fps 고속 바이너리 CMOS 이미지센서 (2500 fps High-Speed Binary CMOS Image Sensor Using Gate/Body-Tied Type High-Sensitivity Photodetector)

  • 김상환;권현우;장준영;김영모;신장규
    • 센서학회지
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    • 제30권1호
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    • pp.61-65
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    • 2021
  • In this study, we propose a 2500 frame per second (fps) high-speed binary complementary metal oxide semiconductor (CMOS) image sensor using a gate/body-tied (GBT) p-channel metal oxide semiconductor field effect transistor-type high-speed photodetector. The GBT photodetector generates a photocurrent that is several hundred times larger than that of a conventional N+/P-substrate photodetector. By implementing an additional binary operation for the GBT photodetector with such high-sensitivity characteristics, a high-speed operation of approximately 2500 fps was confirmed through the output image. The circuit for binary operation was designed with a comparator and 1-bit memory. Therefore, the proposed binary CMOS image sensor does not require an additional analog-to-digital converter (ADC). The proposed 2500 fps high-speed operation binary CMOS image sensor was fabricated and measured using standard CMOS process.

구름접촉을 하는 분말고속도공구강의 X선을 이용한 표면성상해석 (Analysis of Rolling Contact Surface on PM-High Speed Steel by X-ray Diffraction)

  • 이한영;김용진;배종수
    • Tribology and Lubricants
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    • 제19권1호
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    • pp.1-8
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    • 2003
  • Recently, PM-high speed steel(PM-HSS) has reportedly been a good alternative material for rolling mill because of its superior performance to conventional HSS. This paper has been aimed to investigate the possibility for application to rolling contact element for PM-HSS by X-ray diffraction technique. The X-ray elastic constant for PH-HSS has been found by X-ray diffraction during the four-point bending test. Residual stress and half-value breadth on the contact surface during rolling contact fatigue process by X-ray diffraction have also been measured. The result of this study shows that the application of X-ray diffraction technique to PM-HSS could be as possible alternative material as conventional HSS. Half-value breadth on rolling contact surface by X-ray diffraction is not changed during rolling contact fatigue process. On the other hand, the residual stress is changed. This suggests that dislocation reaction has been hardly occurred in rolling contact, depending on super-saturated carbon in PM-HSS.

반도체금형에서 부속부품의 재료선정 및 개선과 제작에 관한 연구 (A study on material selection for semiconductor die parts and on their modification and manufacture)

  • 김세환;최계광
    • Design & Manufacturing
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    • 제8권1호
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    • pp.27-30
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    • 2014
  • Alloy tool steel such as SKD11 and SKD61 or high speed tool like SKH51 are used as materials for semiconductor dies. Cavities, curl blocks, pot blocks and housings are made from those materials. To make those parts from alloy tool steel or high speed tool, one utilizes discharge machining, and mechanical machining including machining center, milling, drilling, forming grinding and others. In the process of cutting machining and polishing, the die materials become unsuitable for machining owing to bubbles and foreign substances in them, which hinders production process. Therefore, this study focuses on die material selection criteria, and on analysis and comparison of material characteristics to help companies to solve their problems, make die manufacture less burdensome and extend die life.

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초고속 자기부상철도 개발을 위한 시스템엔지니어링 계획서 (Systems Engineering Plan for the Development of Ultra-High-Speed Maglev Train System)

  • 이영훈;민성기
    • 시스템엔지니어링학술지
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    • 제5권1호
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    • pp.21-32
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    • 2009
  • The systems engineering (SE) process shall be applied to the project for successful development of ultra-high-speed (UHS) Maglev train system which is one of very large and complex systems. It is important to abolish technology differentials from the advanced developers such as Germany, Japan, etc. and to ensure discriminatory competitiveness of the application of systems engineering process for the development of the system based on appropriate concepts and requirements. General operation concept and stakeholder's requirements of UHS Maglev train system must be elicited with system concept for initiating the project. The management plan should be devised for all sorts of systems engineering activities of risk management, performance management, lifecycle cost management, etc. This paper would support to establish the systems engineering management plan (SEMP) for the program of UHS Maglev train system development with associated documents.

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고속 탭핑에서의 절삭 특성 해석 (Analysis of Cutting Characteristics in High Speed Tapping)

  • 강지웅;김용규;이돈진;김선호;김화영;안중환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.243-246
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    • 2000
  • Productivty of tapping has been increasing through the tcchnological advances in synchronization between spindle rotation and feed motion even in the high spindle speed. However, not much researches have been conducted about tapping process because its complicate cutting mechanism. In order ta investigate the characteristics of the tapping process, this paper concentrates on the analysis of curting torque behavior during one cycle of lapping. As one completc thread is performed through the whole chamfer ercuttlng, cutting torque increases highly in chamfer cutting, but smaothly in full thread cutting Functioning of the threads guide. Cutting torque in backward cutting is smaller than in Sorwerd cutting due to only friction farce in against between the tool and workpiece. And torque behavior of a periodic Sine ripple-mark was identified during one revolution of a tap.

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Al6061 소재의 소구경 고속측면밀링특성에 관한 연구 (A Study on the Characteristics of High-Speed Small-Diameter Wipe Milling for Al6061)

  • 박휘근;이상민;이충석;채승수;이원석;최윤서;조현택;백영종;이종찬
    • 한국기계가공학회지
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    • 제11권3호
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    • pp.24-28
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    • 2012
  • In this paper, the high speed milling characteristics of Al6061 was studied. A gantry type milling & tapping center was developed for this study. The cutting force and the resulting surface roughness were measured at various cutting conditions. The experimental results indicate that the surface roughness is relative to the cutting conditions.

고속 디버링 머신의 개발에 관한 연구 (A Study on Development of High Speed Deburring Machine)

  • 구자함;김인환;허남수
    • 한국기계가공학회지
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    • 제12권5호
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    • pp.116-121
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    • 2013
  • A high speed deburring machine was developed based on the analysis of magnetic contact force, forced vibration, stiffness and deformation of the structure. After 3 dimensional CATIA modelling, the stiffness and the deformation properties of the deburring machine in static and dynamic condition using finite element method were analyzed. Both static and dynamic simulation results showed that designed high speed deburring machine was well satisfied the stability properties at the operating condition. we have performance test program for the real system to evaluate the simulation results.