• Title/Summary/Keyword: High Speed Molding

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Development and Evaluation of the Characteristics of Porous Materials for a Mold (금형 소재용 다공질 재료의 개발과 특성 평가)

  • 박선준;정성일;임용관;정해도;이석우;최헌종
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.6
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    • pp.35-42
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    • 2004
  • At the large-sized mold fer injection molding, the remaining gas in the mold causes some problems with final products. In order to solve these problems, air-bent was drilled on the surface of mold. However, this method leaves the scar on the surface of a product. Therefore, porous material was developed to the removal of remaining gas in this study. Porcerax II, which is a commercialized porous material, were developed in USA. It requires the electric discharge machining(EDM) process to make pores on the surface of the materials. The electric discharge machining (EDM) process, however, cause the increase of the time and cost for the fabrication of the mold. In this study, high speed machining(HSM) process was applied to the fabrication of porous mold without electric discharge machining(EDM) process. Some characteristics of the developed materials machined by high speed machining(HSM) and electric discharge machining(EDM) including air-permeability and porosity were compared with those of Porcerax II. Besides, in order to be applied to the molding process, hardness and tensile & yield strength were compared between Porcerax II and developed materials.

Precision Molding of Polymeric Multi-Channel Optical Interconnection Devices Considering the Coefficient of Thermal Expansion of the Materials

  • Ahn, Seung-Ho;Han, Sang-Pil;Choi, Choon-Gi;Jeong, Myung-Yung
    • ETRI Journal
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    • v.25 no.4
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    • pp.266-269
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    • 2003
  • Polymeric multi-channel optical interconnection devices that are usually fabricated by transfer molding are indispensable for parallel interconnection in high speed, high capacity optical communication systems. This paper proposes a design technique considering the thermal behavior of materials, such as shrinkage and expansion during the molding process, to satisfy geometrical requirements that have less than 1 ${\mu}m$ tolerance. We also designed molds considering the thermal effects of the materials and fabricated multi-channel optical fiber connectors that have less than 1 ${\mu}m$ tolerance.

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Development of stack mold for weather strip injection molding of vehicle (자동차용 웨더스트립의 성형을 위한 스택몰드 개발)

  • Han, Seong-Ryeol;Jun, Seung-Kyeong;Kim, Jun-Hyeong;Jung, Yeong-Deu
    • Design & Manufacturing
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    • v.2 no.1
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    • pp.51-56
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    • 2008
  • Recently, the demand of high-productivity injection mold increases since the consumption of packaging grows in the world. Stack mold is composed of more than two molds and it has very high productivity and economic efficiency. In this study, stack mold was developed to improve productivity of vehicle fixed weather strip with TPV materials and to investigate the characteristic of injection molding using CAE.

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A Study on Slip Behavior of Fiber Preform by High Speed Resin Flow in High Pressure Resin Transfer Molding (고압 RTM 공정에서 고속 수지 유동에 의한 섬유 보강재의 변형 거동에 관한 연구)

  • Ahn, Jong-Moo;Seong, Dong-Gi;Lee, Won-Oh;Um, Moon-Kwang;Choi, Jin-Ho
    • Composites Research
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    • v.27 no.1
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    • pp.31-36
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    • 2014
  • This paper presents the slip behavior of composite fabrics by high speed resin flow in high pressure resin transfer molding. In order to observe the fiber deformation behavior, we constructed the measuring equipment for friction coefficient between fiber and mold, and the monitoring system for deformation of fiber preform in high-pressure RTM process. Coulomb friction coefficient and hydrodynamic friction coefficient between fiber preform and mold were measured and the external force induced by fluid flow causing the deformation of fiber preform was measured. Friction force calculated by friction coefficient and the external force upon fiber deformation were compared, which showed that preform deformation occurred when the external force was bigger than the friction force. The slip behavior of the fiber preform was mainly influenced by the volume fraction of fiber preform and the friction coefficient.

Thermophysical Properties of Epoxy Molding Compound for Microelectronic Packaging (반도체 패키지 EMC의 열물성 연구)

  • 이상현;도중광;송현훈
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.4
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    • pp.33-37
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    • 2004
  • As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

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Fabriation of BMI Resin Composite for High Speed Train Transformer (변압기 권선 지지용 BMI 수지 복합재 제조 공정 개발)

  • 엄문광;김종훈;우재희;김세창
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.257-260
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    • 2000
  • The composite composed of glass fabric and BMI resin was fabricated using resin transfer molding(RTM) process. it will be used as a supporting plate of transformer coil for high speed train. To develop a RTM process, permeability of preform was measured and resin properties like a viscosity and gellation time were checked. A resin pre-heating system and a mold system were also designed and developed. Using a vacuum-assisted RTM process, the composite supporting plate was successfully fabricated.

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Topography Analysis in High Speed Working by Flat Endmill (엔드밀에 의한 고속가공시 표면형상 해석)

  • Bae, H.J.;Lee, S.J.;Seo, Y.B.;Park, H.S.
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.1 no.1
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    • pp.79-88
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    • 2002
  • High speed machining system have been used in industrial because it is effective to a material manufacturing with various shape. Recently the end-milling processing is needed the high-precise technique with good surface roughness and rapid time in aircraft, automobile part and molding industry. Therefore this study proposed to decide best manufacturing cutting condition for surface roughness and rapid manufacturing tune by using computer Image processing system and 3D modelling. Until the 16,000 rpm, the surface roughness is decreased rapidly, but it is not over that. The 22,000 rpm is the spindle speed with the optimum surface in the high speed end-milling. In the case of the feed rate with 2,000 mm/mm and 8,000 mm/mm, the surface roughness is better than 4,000 mm/min and 6,000 mm/min. By using the 3D modelling, it is effectively represented shape characteristics of working surface m high speed end-milling.

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A study on the development of injection mould with a high productivity using hybrid rapid manufacturing technologies (Hybrid 쾌속생산공정을 이용한 고생산성 사출성형 금형 개발에 관한 연구)

  • Ahn, Dong-Gyu
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1243-1248
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    • 2007
  • In recent, rapid manufacturing (RM) technology is widely used to develop an injection mould with a high performance. The objective of this paper is to develop the injection mould with a high productivity using a hybrid RM technology combining Laser-aided Direct Metal Tooling process with a machining process. The geometry decomposition has been utilized to improve the speed of the manufacturing for the mould. Mould with conformal cooling channels has been designed to improve cooling characteristics. Several experiments have been carried out to evaluate characteristics of the mould manufactured from the hybrid RM technology. In addition, injection molding tests have been performed to examine the performance of the manufactured mould. The results of the injection molding tests have been shown that a cooling time and the injection time of the designed mould are reduced to one-fifth and one-second that of the mould with convention cooling channels.

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Fracture Toughness of IC Molding Compound Materials(II) (IC 몰딩 콤파운드 재료의 파괴 인성치(II))

  • 김경섭;신영의
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.5
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    • pp.353-357
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    • 1998
  • Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

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