• Geomechanics and Engineering
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• v.33 no.6
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• pp.529-542
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• 2023

Wave propagation with high transverse deflection could affect the stability of the ball in its trajectory. For low stiffness balls similar to soccer and volleyball balls, the waves are more noticeable in comparison to other balls like ping-pong ball. On the other hand, the soccer balls are under heavy impact loads from shoots and contacting different objects in the field. The maximum recorded speed of a soccer ball after kicking is the 211 km/hr and the average maximum speed is around 112 km/hr. Therefore, in such speeds the aerodynamic forces become important which are directly related to geometrical shape of the ball. In this regard, the wave propagation in soccer ball is examined in the current study using large deformation shear deformable formulations. Classical relations of stress-strain components are taken into consideration along with minimum total energy principle. The final derived relations were solved by using harmonic differential quadrature method. The results are generally presented ion term of phase velocity as function of different influencing parameters of the materials, geometry and mass of the ball.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.153-154
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• 2011

• Tribology and Lubricants
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• v.27 no.3
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• pp.140-146
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• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• Tribology and Lubricants
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• v.28 no.6
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• pp.278-282
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• 2012

Various bearings such as deep-groove ball bearings, angular-contact ball bearings, and roller bearings are used to support the load and to lubricate between the shaft and the housing. The bearings of potential rolling systems in a turbo pump are the deep-groove ball bearings as comparing with the bearings with rolling elements such as cylindrical rollers, tapered cylindrical rollers, and needle rollers. The deep-groove ball bearings consist of rolling elements, an inner raceway, an outer raceway and a retainer that maintain separation and help to lubricate the rolling element that is rotating in the raceways. In the case of water-lubricated ball bearings, however, fluid friction between the ball and raceways is affected by the entry direction of flow, rotation speed, and flow rate. In addition, this friction is the key factor affecting the bearing life cycles and reliability. In this paper, the characteristics of flow conditions corresponding to a deep-groove ball bearing are investigated numerically, with particular focus on the friction distribution on the rolling element, in order to extend the analysis to the area that experiences solid friction. A simple analysis model of fluid flow inside the water-lubricated ball bearing is analyzed with CFD, and the flow characteristics at high rotation speeds are presented.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.1-9
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• 2010

We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an influence on the results, the shear strength and failure mode. In order to prove these experimental inconsistency, simulation using finite element analysis was also conducted to calculate the shear strength and to figure out the distribution of plastic energy inside of the solder ball. The shear strength decreased while the tip height increased or the shear speed decreased. A variation in shear strength due to inconsistent shear conditions made confusion on analyzing experimental results. As a result, it was strongly needed to standardize the shear test method.

• Korean Journal of Materials Research
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• v.24 no.3
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.57-64
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• 2012

Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.

• Korean Journal of Mineralogy and Petrology
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• v.36 no.2
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• pp.95-106
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• 2023

Quartz (SiO₂) is among the major rock-forming minerals in the earth's crust. The atomistic structures of SiO₂ may evolve during diverse frictional processes. The reduction of friction of quartz-rock accompanied by its amorphization, hydration, and formation of silica gel provides mineralogical insights into earthquakes and related phenomena. Ball milling, together with rotary shear experiments have been useful to infer the atomic origins of such processes. In this study, optimal experimental conditions for ball milling for amorphization of SiO₂ were determined by taking into account various process variables. The crystallinity of SiO₂ gradually decreased and became amorphous as the ball milling time increased at a high milling speed. The degree of wear of the milling media and its effect on the amorphization of SiO₂ were analyzed using distinct milling materials (zirconia, stainless steel). The amount of ball wear increased with increasing milling time. Furthermore, the worn stainless steel particles from balls tend to interact with amorphized SiO₂ to form Si-O-Cr. These results aid in understanding the process of atomistic structural changes caused by ball milling of divserse materials with relatively high hardness, such as SiO₂, and understanding various geological friction processes.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.97-103
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• 2014

Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.