• Journal of radiological science and technology
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• v.31 no.1
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• pp.89-95
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• 2008

The quality correction factor for used beam and qualities is strongly required for clinical dosimetry by TRS-398 protocol of IAEA. In this study the quality correction factors for a commercial plane-parallel ionization chamber in high energy electron beams were calculated by Monte Carlo code(DOSRZnrc/EGSnrc). In comparison of quality correction factor, the difference between this study and TRS-398 were within 1% in 5-20 MeV. In case of 4MeV the difference was 1.9%. As an independent method of determination of quality correction factor this study can be applied to evaluate values in the protocol or calculate the factor for a new chamber.

• Journal of the Mineralogical Society of Korea
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• v.22 no.4
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• pp.407-415
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• 2009

The change of the nitrogen-related centers and the color change of electron beam irradiated type Ia natural diamonds were studied. The irradiation of diamond with high-energy electron beam creates lattice defects which are neutral single vacancy $V^0$. It increased with increasing electron dose density. The B aggregation seems to produce vacancies more easily than the A aggregation, because diamonds with more B aggregation have more platelets, which are sufficient breakable size by electron beam. Greenish blue color of irradiated diamond is changed to darker with increasing electron dose density. GR1 centers with a zero-phonon line at 741 nm and phonon sidebands make transmit visible light at 530 nm and it moves to 500 nm with higher intensity of GR1 centers.

• Korean Journal of Materials Research
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• v.22 no.10
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• pp.539-544
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• 2012

We have grown AlN nanorods and AlN films using plasma-assisted molecular beam epitaxy by changing the Al source flux. Plasma-assisted molecular beam epitaxy of AlN was performed on c-plane $Al_2O_3$ substrates with different levels of aluminum (Al) flux but with the same nitrogen flux. Growth behavior of AlN was strongly affected by Al flux, as determined by in-situ reflection high energy electron diffraction. Prior to the growth, nitridation of the $Al_2O_3$ substrate was performed and a two-dimensionally grown AlN layer was formed by the nitridation process, in which the epitaxial relationship was determined to be [11-20]AlN//[10-10]$Al_2O_3$, and [10-10]AlN//[11-20]$Al_2O_3$. In the growth of AlN films after nitridation, vertically aligned nanorod-structured AlN was grown with a growth rate of $1.6{\mu}m/h$, in which the growth direction was <0001>, for low Al flux. However, with high Al flux, Al droplets with diameters of about $8{\mu}m$ were found, which implies an Al-rich growth environment. With moderate Al flux conditions, epitaxial AlN films were grown. Growth was maintained in two-dimensional or three-dimensional growth mode depending on the Al flux during the growth; however, final growth occurred in three-dimensional growth mode. A lowest root mean square roughness of 0.6 nm (for $2{\mu}m{\times}2{\mu}m$ area) was obtained, which indicates a very flat surface.

• Korean Journal of Remote Sensing
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• v.15 no.4
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• pp.289-295
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• 1999

Space Physics Sensor (SPS) on-board the KOMPSAT-1 consists of the High Energy Particle Detector (HEPD) and the Ionospheric Measurement Sensor (IMS). The HEPD is to characterize the low altitude high energy particle environment and the effects on the microelectronics due to these high energy particles. It is composed of four sensors: Proton and Electron Spectrometer(PES), Linear Energy Transfer Spectrometer (LET), Total Dose Monitor (TDM), and Single Event Monitor (SEM). 35 MeV proton beam from the medical KCCH cyclotron, at Korea Cancer Center Hospital in Seoul, is used to calibrate the PES. Primary proton beam of 35MeV scattered by polypropylene target is converted to various energy protons according to the elastic collision kinematics. In this calibration, the threshold level of the proton in the PES can be determined and the energy ranges of PES channels are also calibrated.

• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.365-370
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• 2010

The growth interruption effects on growth mode of the GaAs and AlGaAs epitaxial layers grown on GaAs substrate by molecular beam epitaxy were investigated. Growth process of the epitaxial layers as a function of the growth interruption time was observed by reflection high energy electron diffraction (RHEED). The growth interruption time was 0, 15, 30, 60 s. The GaAs/$Al_{0.3}Ga_{0.7}As$ multi quantum wells (MQWs) with different growth interruption time were grown and its properties were investigated. RHEED intensity oscillation and optical property of the MQWs were dependent on the growth interruption time. When the growth interruption time was 30 s, interface between the well and barrier layers became sharper.

• Journal of Radiation Industry
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• v.17 no.2
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• pp.199-207
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• 2023

Since seeds can be directly used as food resources as well as for crop cultivation or preservation of genetic resources, it is essential to develop high-quality seed processing technology to increase agricultural productivity. Seed treatment means processing technologies of seeds through physical or chemical treatment processes from after harvesting seeds to before sowing of seeds to improve germination and growth rate, durability, and immunity, etc. Since chemical seed treatment technology using pesticides or plant growth regulators has problems of environmental pollution and human toxicity, it is desired to develop an alternative technology. As a physical seed treatment method, various technologies such as ionizing radiation, plasma, microwave, and magnetic field are being developed, and some of them are being used practically. In this paper, I will summarize the mechanism of seed priming and disinfection, and the advantages and disadvantages of application, focusing on these physical seed treatment methods. Low dose or moderate intensity ionizing radiation, microwave, low-temperature plasma, and magnetic field treatments often promoted seed germination and seedling growth. However, effective removal of direct seed pathogens at these treatment intensities appears to be difficult. And it has been shown that relatively high-dose electron beam treatment using low-energy electron beams kills microorganisms on the seed surface and hull layer while not damaging the inner tissue of the seed, and is also effectively used for seed treatment on a commercial scale. In order to put the physical seed treatment technology to practical use in Korea, it is necessary to develop an economical scale treatment device along with the development of individual treatment technology to each crop.

• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.371-376
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• 2010

The GaAs epitaxial layers were grown on Si(100) substrates by molecular beam epitaxy (MBE) using the two-step method. The Si(100) substrates were cleaned with three different surface cleaning methods of vacuum heating, As-beam exposure, and Ga-beam deposition at the substrate temperature of $800^{\circ}C$ in the MBE growth chamber. Growth temperature and thickness of the GaAs epitaxial layer were $800^{\circ}C$ and $1{\mu}m$, respectively. The surface structure and properties were investigated by reflection high-energy electron diffraction (RHEED), AFM (Atomic force microscope), DXRD (Double crystal x-ray diffraction), PL (Photoluminescence), and PR (Photoreflectance). From RHEED, the surface structure of GaAs epitaxial layer grown on Si(100) substrate with Ga-beam deposition is ($2{\times}4$). The GaAs epitaxial layer grown on Si(100) substrate with Ga-beam deposition has a high quality.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.29-37
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• 2021

A 7 nm technology node using extreme ultraviolet lithography with a wavelength of 13.5 nm has been recently developed and applied to the semiconductor manufacturing process. Furthermore, the development of sub-3 nm technology nodes continues to be required. In this study, design factors of an electrostatic deflector for an ultra-miniaturized microcolumn system that can realize an electron wavelength of below 1.23 nm with an acceleration voltage of above 1 eV were investigated using a three-dimensional simulator. Particularly, the optimal design of the electrostatic octupole floating deflector was derived by optimizing the design elements and improving the driving method of the 1 keV low energy ultra-miniaturized microcolumn deflector. As a result, the entire wide field of view greater than 330 ㎛ at a working distance of 4 mm was realized with an ultra-high-resolution electron beam spot smaller than 10 nm. The results of this study are expected to be a basis technology for realizing a wafer-scale multi-array microcolumn system, which is expected to innovatively improve the throughput per unit time, which is the biggest drawback of electron beam lithography.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.828-833
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• 2000

Growth characteristics and microstructure of AIN thin films grown by plasma assisted molecular beam epitaxy on Si substrates have been investigated. Growing temperature and substrate orientation were chosen as major variables of the experiment. Reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the micorstructure of the films. On Si(100) substrates, AlN thin films were grown along the hexagonal c-axis preferred orientation at temperature range 850-90$0^{\circ}C$. However on Si(111), the AlN films were epitaxially grown with directional coherency in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112) at 85$0^{\circ}C$ and the epitaxial coherencry seemed to be slightly distorted with increasing temperature. The microstructure of AlN thin films on Si(111) substrates showed that the films include a lot of crystal defects and there exist micro-gaps among the columns.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.111-114
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• 2000

Growth characteristics and microstructure of AlN thin films grown by plasma assisted molecular beam epitaxy on Si substrates have been investigated. Growing temperature and substrate orientation were chosen as major variables of the experiment. Reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the microstructure of the films. On Si(100) substrates, AlN thin films were grown along the hexagonal c-axis preferred orientation at temperature range 850-90$0^{\circ}C$. However on Si(111), the AlN films were epitaxially grown with directional coherency in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112) at 85$0^{\circ}C$ and the epitaxial coherencry seemed to be slightly distorted with increasing temperature. The microstructure of AlN thin films on Si(111) substrates showed that the films include a lot of crystal defects and there exist micro-gaps among the columns.