• Title/Summary/Keyword: Hf-oxide

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Characteristic Study for Defect of Top Si and Buried Oxide Layer on the Bonded SOI Wafer (Bonded SOI wafer의 top Si과 buried oxide layer의 결함에 대한 연구)

  • Kim Suk-Goo;Paik Un-gyu;Park Jea-Gun
    • Korean Journal of Materials Research
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    • v.14 no.6
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    • pp.413-419
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    • 2004
  • Recently, Silicon On Insulator (SOI) devices emerged to achieve better device characteristics such as higher operation speed, lower power consumption and latch-up immunity. Nevertheless, there are many detrimental defects in SOI wafers such as hydrofluoric-acid (HF)-defects, pinhole, islands, threading dislocations (TD), pyramid stacking faults (PSF), and surface roughness originating from quality of buried oxide film layer. Although the number of defects in SOI wafers has been greatly reduced over the past decade, the turn over of high-speed microprocessors using SOI wafers has been delayed because of unknown defects in SOI wafers. A new characterization method is proposed to investigate the crystalline quality, the buried oxide integrity and some electrical parameters of bonded SOI wafers. In this study, major surface defects in bonded SOI are reviewed using HF dipping, Secco etching, Cu-decoration followed by focused ion beam (FIB) and transmission electron microscope (TEM).

$HfO_2$ 박막과 Si 기판사이에 다양한 산화제로 증착한 $Al_{2}O_{3}$ 방지막을 사용한 경우에 대한 고찰

  • 조문주;박홍배;박재후;이석우;황철성;정재학
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2003.12a
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    • pp.42-44
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    • 2003
  • 최근 logic 소자의 gate oxide로 기존의 $SiO_2$, SiON보다 고유전, 작은 누설전류를 가지는 물질의 개발이 중요한 이슈가 되고 있다. 본 실험실에서는 Si 기판위에 $HfO_2$ 를 바로 증착하는 경우, 기판의 Si 이박막내로 확산하여 유전율이 저하되는 문제점을 인식하고, 기판과 $HfO_2$ 사이에 $AlO_x$를 방지막으로 사용하였다. 이 때, $AlO_x$의 Al precursor 는 TMA 로 고정하고, 산화제로는 $H_2O, O_2$-plasma, O_3$ 를 각각 사용하였다. 모든 $AlO_x/HfO_y$ 박막에서 매우 우수한 누설전류특성을 얻을 수 있었는데, 특히 $O_3$ 를 산화제로 사용한 $AlO_x$ 방지막의 경우 가장 우수한 특성을 보였다. 또한 질소 분위기에서 $800^{\circ}C$ 10 분간 열처리한 후, 방지막을 사용한 모든 경우에서 보다 향상된 열적 안정성을 관찰할 수 있었다.

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The Influence of Cyclic Treatments with H₂O₂ and HF Solutions on the Roughness of Silicon Surface

  • 이혜영;이충훈;전형탁;정동운
    • Bulletin of the Korean Chemical Society
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    • v.18 no.7
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    • pp.737-740
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    • 1997
  • The influence of cyclic treatments with H2O2/DIW (1 : 10) and HF/DIW (1 : 100) on the roughness of silicon surface in the wet chemical processing was investigated by atomic force microscopy (AFM). During the step of the SC-1 cleaning, there is a large increase in roughness on the silicon surface which will result in the poor gate oxide breakdown properties. The roughness of the silicon wafer after the SC-1 cleaning step was reduced by cyclic treatments of hydrogen peroxide solution and hydrofluoric acid solution instead of HF-only cleaning. AFM images after each step clearly illustrated that the average roughness of silicon surface after three times treatments with H2O2 and HF solutions was reduced by 10 times compared with that after the SC-1 cleaning step.

Capacitance-voltage Characteristics of MOS Capacitors with Ge Nanocrystals Embedded in HfO2 Gate Material

  • Park, Byoung-Jun;Lee, Hye-Ryeong;Cho, Kyoung-Ah;Kim, Sang-Sig
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.8
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    • pp.699-705
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    • 2008
  • Capacitance versus voltage (C-V) characteristics of Ge-nanocrystal (NC)-embedded metal-oxide-semiconductor (MOS) capacitors with $HfO_2$ gate material were investigated in this work. The current versus voltage (I-V) curves obtained from Ge-NC-embedded MOS capacitors fabricated with the $NH_3$ annealed $HfO_2$ gate material reveal the reduction of leakage current, compared with those of MOS capacitors fabricated with the $O_2$ annealed $HfO_2$ gate material. The C-V curves of the Ge-NC-embedded MOS capacitor with $HfO_2$ gate material annealed in $NH_3$ ambient exhibit counterclockwise hysteresis loop of about 3.45 V memory window when bias voltage was varied from -10 to + 10 V. The observed hysteresis loop indicates the presence of charge storages in the Ge NCs caused by the Fowler-Nordheim (F-N) tunneling. In addition, capacitance versus time characteristics of Ge-NC-embedded MOS capacitors with $HfO_2$ gate material were analyzed to investigate their retention property.

Effect of Herbal Acupuncture with Sang-hwang(Phellinus linteus) on High Fat Diet-induced Obesity in Rats (지방식이로 유도된 비만동물모델에서의 약침의 효과)

  • Kim, Ji-Hyun;Park, Chang-Shin;Hahm, Dae-Hyun;Lee, Hye-Jung;Shim, In-Sop
    • Journal of Pharmacopuncture
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    • v.7 no.1 s.12
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    • pp.5-14
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    • 2004
  • Acupuncture has fairly good weight-reducing effect in treating simple obesity due to the neuroendocrine regulation. In this study, the antiobesity effects of herbal acupuncture(HA) with Sang-hwang(phellinus linteus) at Fuai(SP16) were investigated in the rat fed on high-fat(HF) diet. Sang-hwang mushroom has been proven to have anti-carcinogenic effects and Sang-hwang extracts are highly effective in treatment and preventive treatment of AIDS, diabetes and high blood-pressure. To determine whether the Sang-hwang herbal acupuncture may have the anti-obesity effect, male Sprague-Dawley(4-wk-old) rats were fed a HF diet for 5 wk, which produced significant weight gain compared to rats were fed a normal diet, and then herbal acupuncture were treated for 3 wk in HF diet group. The body weight, food consumption, food effeciency ratio(FER), body fat mass, plasma nitric oxide(NO) were investigated in rats fed on normal diet, HF diet, and HF diet with HA(HF-diet-HA) groups. NO has been proposed to be involved in the regulation of food intake. In addition, the expression of appetite peptides such as orexigenic peptide neuropeptide Y(NPY) and the anorectic peptide cholecystokinin(CCK) were observed in the hypothalamus. HF-HA group reduced body weight gain, FER, body fat contents and NO concentration compared to HF diet group. The expression of NPY was reduced in arcuate nucleus(ARC), and CCK was increased in the paraventricular nucleus(PVN) after treatment of HA. In conclusion, Sang-hwang HA reduced adipocity, plasma NO and hypothalamic NPY, but increased CCK expression in the HF dietinduced obesity rat, therefore HA may have anti-obesity action through regulating body weight and appetite peptide of the central nervous system.

Novel Robust Structure and High k Dielectric Material for 90 nm DRAM Capacitor

  • Park, Y.K.;Y.S. Ahn;Lee, K.H.;C.H. Cho;T.Y. Chung;Kim, Kinam
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.2
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    • pp.76-82
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    • 2003
  • The robust stack storage node and sufficient cell capacitance for high performance is indispensable for 90 nm DRAM capacitor. For the first time, we successfully demonstrated MIS capacitor process integration for 90 nm DRAM technology. Novel cell layout and integration technology of 90 nm DRAM capacitor is proposed and developed, and it can be extended to the next generation DRAM. Diamond-shaped OCS with 1.8 um stack height is newly developed for large capacitor area with better stability. Furthermore, the novel $Al_2O_3/HfO_2$ dielectric material with equivalent oxide thickness (EOT) of 25 ${\AA}$ is adopted for obtaining sufficient cell capacitance. The reliable cell capacitance and leakage current of MIS capacitor is obtained with ~26 fF/cell and < 1 fA/ceil by $Al_2O_3/HfO_2$ dielectric material, respectively.

MOSFET 구조내 $HfO_2$게이트절연막의 Nanoindentation을 통한 Nano-scale의 기계적 특성 연구

  • Kim, Ju-Yeong;Kim, Su-In;Lee, Gyu-Yeong;Lee, Chang-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.317-318
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    • 2012
  • 현재의 반도체 산업에서 Hafnium oxide와 Hafnium silicates같은 high-k 물질은 CMOS gate와 DRAM capacitor dielectrics로 사용하기 위한 대표적인 물질에 속한다. MOSFET (metal oxide semiconductor field effect transistor)구조에서 gate length는 16 nm 이하로 계속 미세화가 연구 중이고, 또한 gate는 기존구조에서 Multi-gate구조로 다변화가 일어나고 있다. 이를 통해 게이트 절연막은 그 구조와 활용범위가 다양해지게 될 것이다. 동시에 leakage current와 dielectric break-down을 감소시키는 연구가 중요해지고 있다. 그러나 나노 영역에서의 기계적 특성에 대한 연구는 전무한 상태이다. 따라서 복잡한 회로 공정, 다양한 Multi-gate 구조, 신뢰도의 향상을 위해서는 유전박막 물질자체와 계면에서의 물리적, 기계적인 특징의 측정이 상당히 중요해지고 있다. 이에 본 연구는 Nano-indenter의 통해 경도(Hardness)와 탄성계수(Elastic modulus) 등의 측정을 통하여 시료 표면의 나노영역에서의 기계적 특성을 연구하고자 하였다. $HfO_2$게이트 절연막은 rf magnetron sputter를 이용해 Si (silicon) (100)기판위에 박막형태로 증착하였고, 이후 furnace에서 질소분위기로 온도(400, 450, $500^{\circ}C$)를 달리하여 20분 열처리를 하였다. 또한 Weibull distribution을 이용해 박막의 characteristic value를 계산하였으며, 실험결과 열처리 온도가 $400^{\circ}C$에서 $500^{\circ}C$로 증가함에 따라 경도와 탄성계수는 7.4 GPa에서 10.65 GPa으로 120.25 GPa에서 137.95 GPa으로 각각 증가하였다. 이는 재료적 측면으로 재료의 구조적 우수성이 증가된 것으로 판단된다.

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Direct Bonding Characteristics of 2 inch 3C-SiC Wafers for MEMS in Hash Environments (극한환경 MEMS용 2 inch 3C-SiC 기판의 직접접합 특성)

  • Chung, Yun-Sik;Ryu, Ji-Goo;Kim, Kyu-Hyun;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.387-390
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    • 2002
  • SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

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The Effect of Native Oxide on the $TiSi_{2}$ Transformation after HF Cleaning (HF 세정후 자연 산화막의 존재가 티타늄 실리사이드 형성에 미치는 영향)

  • Bae, Jong-Uk;Hyeon, Yeong-Cheol;Yu, Hyun-Kyu;Lee, Jeong-Yong;Nam, Kee-Soo
    • Korean Journal of Materials Research
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    • v.8 no.5
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    • pp.464-469
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    • 1998
  • HF 세정후 자연 산화막의 존재가 급속 열처리 장비를 이용, 아르곤 분위기에서 열처리할 때 티타늄 실리사이드 형성을 관찰하였다. 고분해능 단면 투과 전자 현미경 관찰 결과 기판 온도가 상온일 때 자연산화막(native oxide)이 존재함을 확인하였으며 기판 온도가 40$0^{\circ}C$일 때는 실리콘 기판과 티타늄 박막의 계면 부위에서 자연산화막, 티타늄 및 실리콘이 혼합된 비정질층이 존재함을 확인하였다. 티타늄을 증착하는 동안 기판 온도를 40$0^{\circ}C$로 유지했을 때는 C54~$TiSi_2$상이 형성되는데 요구되는 급속 열처리(Rapid Thermal Annealing : RTA)온도가 기판 온도를 상오느로 유지 했을 때보다 $100^{\circ}C$정도 감소함을 확인하였다. 이 같은 결과는 산소불순물을 함유한 비정질 층이 핵생성 자리를 제공하여 이 상의 형성이 촉진된다는 사실을 말한다. 기판온도 $400^{\circ}C$에서 형성된 티타늄 실리사이드막의 경우 비저항 $\mu$$\Omega$cm임을 확인하였다.

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Study on the Structural Stability and Charge Trapping Properties of High-k HfO2 and HFO2/Al2O3/HfO2 Stacks (High-k HfO2와 HfO2/Al2O3/HfO2 적층막의 구조 안정성 및 전하 트랩핑 특성 연구)

  • Ahn, Young-Soo;Huh, Min-Young;Kang, Hae-Yoon;Sohn, Hyunchul
    • Korean Journal of Metals and Materials
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    • v.48 no.3
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    • pp.256-261
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    • 2010
  • In this work, high-k dielectric stacks of $HfO_2$ and $HfO_2$/$Al_2O_3$/$HfO_2$ (HAH) were deposited on $SiO_2/Si$ substrates by atomic layer deposition as charge trapping layers in charge trapping devices. The structural stability and the charge trapping characteristics of such stacks were investigated using Metal-Alumina-Hafnia-Oxide-Silicon (MAHOS) structure. The surface roughness of $HfO_2$ was stable up to 11 nm with the insertion of 0.2 nm thick $Al_2O_3$. The effect of the thickness of the HAH stack and the thickness of intermediate $Al_2O_3$ on charge trapping characteristics were investigated for MAHOS structure under various gate bias pulse with duration of 100 ms. The threshold voltage shift after programming and erase showed that the memory window was increased with increasing bias on gate. However, the programming window was independent of the thickness of HAH charge trapping layers. When the thickness of $Al_2O_3$insertion increased from 0.2 nm to 1 nm, the erase window was decreased without change in the programming window.