• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.6
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• pp.683-694
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• 1998

The application of hydrocarbon refrigerants in a hermetic reciprocating compressor for refrigerator is investigated. The selected refrigerants are isobutane(R600a), propane(R290), R12, binary mixture of R600a/R290, and OS-21CII. Both theoretical and experimental investigations have been performed for the selected refrigerants. The test results of hydrocarbon refrigerants have been compared to the traditional refrigerant(R12). The results show that hydrocarbon refrigerants(HC-Blend, OS-21C II) are very good alternatives in the refrigeration system for R12.

• Journal of the Korean Vacuum Society
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• v.21 no.1
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• pp.1-5
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• 2012

The measurement device of internal pressures of small components sealed hermetically was developed. The internal pressure of a sample measured with this device was 43.151 kPa, and the expanded uncertainty ($\kappa$=2) was 741 Pa. The resultant measurement ability of internal pressures in small vacuum components, which had been almost impossible previously, shows the possibility of internal vacuum detection of hermetically sealed parts.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11a
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• pp.385.2-385
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• 2002

Hermetic rotary compressor is one of the most important components for air conditioning system since it has a great effect on both the performance and the noise and vibration of the system. Noise and vibration of rotary compressor is occurred due to gas pulsation during compression process and unbalanced dynamic force. In order to reduce noise and vibration, it is necessary to identify sources of noise and vibration and effectively control them. (omitted)

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• Tribology and Lubricants
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• v.10 no.1
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• pp.69-77
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• 1994

Oil flow pass of hermetic scroll compressor with back pressure chamber was described. Dynamic analysis was preceded in order to obtain the loads on the lubricating contacts. The mobility method of dynamically loaded journal bearings was applied to the crank jornal bearing and lower main bearing, and they could be designed to operate under fluid film lubrication. From the consideration of their film thicknesses and oil flow rates, optimal bearing clearances or other bearing dimensions could be assessed. The major friction loss was calculated to be from the axial force between the two scrolls. Therefore, it was suggested that the designers should be careful to reduce the over-turning moment on the orbiting scroll.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.4 no.3
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• pp.163-174
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• 1992

This paper presents numerical and experimental methods of investigating dynamic characterisics of reed valves of hermetic reciprocating compressors. For the natural frequency, two different techniques have been tried : microphone method and strain gage method. In the microphone method, acoustic pressure signals from excited valves have been analyzed, while signals of tiny strain gauge attached on the reed valves have been utilized in the strain gage method. The empirically determined natural frequencies have been compared to the ones calculated by finite element method. Reasonably good agreements between the experimental and numerical results have been found, implying that the natural frequencies of reed valves could be obtained by FFM alone with enough accuracy.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.2
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• pp.262-269
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• 1999

The application of hydrocarbon refrigerant mixtures in a hermetic reciprocating compressor for dehumidifier is investigated. The selected refrigerants are R12, R134a, HC-Blend (R290/R600a), CX(R152a/R600a) and OS-l2a. Both theoretical and experimental investigations have been performed for the selected refrigerants. The test results of hydrocarbon refrigerants have been compared to traditional refrigerant(R12) and R134a. The results show that hydrocarbon refrigerant mixtures(HC-Blend, CX and OS-l2a) are very good alternatives in the refrigeration system for R12 and R134a.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.2
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• pp.270-280
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• 1999

A performance analysis simulation program that can be applied to a hermetic reciprocating compressor with various refrigerants has been developed. For the numerical analysis, the passage of refrigerant in compressor is subdivided into control volumes. Instead of the ideal gas assumption, CSD equation of state is applied to calculate the thermodynamic properties of refrigerants. To verify the validity of developed program, the result has been compared with the experimental data served by the compressor supplier. The performance of each refrigerant and the possibility of direct application are estimated by applying R12, 134a, R290, R600a and R290/R600a mixture to an existing compressor. Also, parametric study for various crank rotating speeds and the mole fractions of refrigerant has been performed.

• Proceedings of the KWS Conference
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• 2000.04a
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• pp.121-124
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• 2000

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.